LFCPNX-100-9LFG672C - 100K LC CertusPro-NX FPGA, 672-BGA | Lattice
Teilenummer: LFCPNX-100-9LFG672C ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $49.76 | $49,76 |
| 10 | $46.5 | $465,00 |
| 100 | $42.1 | $4.210,00 |
| 500 | $38.75 | $19.375,00 |
| 1.000 | $35.4 | $35.400,00 |
LFCPNX-100-9LFG672C Übersicht
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows hardware designers to implement custom digital circuits after PCB fabrication. The CertusPro-NX family sits within the broader taxonomy of programmable logic devices: FPGA -> programmable logic -> logic IC -> integrated circuit. FPGAs differ from CPLDs and ASICs in that they offer far higher logic density, embedded memory blocks, DSP slices, and high-speed transceivers, while remaining reconfigurable in the field. The CertusPro-NX targets advanced general-purpose applications where balance between logic density, I/O bandwidth, and power efficiency is essential.
Key features include up to 100K logic cells (LCs), high-speed 10G SerDes transceivers, a generous amount of embedded SRAM distributed across multiple block sizes, and a wide selection of general-purpose I/O. The device supports Lattice's Radiant and Diamond design toolchains and is AEC-Q100 qualified, making it suitable for automotive, industrial, and edge-compute deployments. The 672-ball LFG package exposes 313 user I/O pins, supporting flexible PCB integration.
Architecturally, the CertusPro-NX leverages a 28 nm Fully Depleted Silicon-on-Insulator (FD-SOI) process that provides excellent soft-error rate performance, low leakage, and high static power efficiency. Embedded memory is partitioned into large RAM blocks, and the SerDes blocks support multiple protocol standards (PCIe, 10G Ethernet, CPRI) via firmware-loaded PCS layers. The Nexus platform also integrates hardened peripherals including configuration engines, PLLs, and security features.
Typical applications include industrial edge AI inference, machine vision, video bridging, automotive sensor fusion, and 5G wireless infrastructure. With its combination of high logic density and low power, the LFCPNX-100 is well suited for battery-powered or thermally constrained deployments where larger 7 nm or 12 nm FPGAs would be impractical.
When designing with this device, ensure the PCB provides adequate decoupling (typically 0402/0603 ceramics placed close to each power pin), and allocate sufficient board real estate for the 672-ball BGA escape routing. Developers should use the Lattice Radiant tool suite for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing across five vendors, drops-in alternatives within the LFCPNX family, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für LFCPNX-100-9LFG672C – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit LFCPNX-100-9LFG672C (gleiche Bauform und Footprint) – abweichend in Logic Cells, Mounting Type, Operating Temperature Range, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
LFCPNX-100-9LFG672I
✅ Drop-In✓ Auf Lager
$278 / Stück
Datenblatt ansehen →LFCPNX-50-9LFG672C
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LFCPNX-100-9LFG672C01A
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LFCPNX-100-9LFG672C Grenzwerte & elektrische Eigenschaften
| Series | CertusPro-NX (Nexus platform) |
| Process Technology | 28 nm FD-SOI |
| Logic Cells | 100,000 |
| LUTs | 96000 |
| Embedded Memory (bits) | 3,833,856 |
| User I/O Count | 313 |
| Gehäuse | 672-ball LFG (FCBGA) |
| Supply Voltage (Core) | 1 V |
| SerDes Support | 10G |
| Betriebstemperaturbereich | Commercial grade |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 4 (per JEDEC J-STD-020) |
| Peak Reflow Temperature | 250 C |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Qualification | AEC-Q100 automotive |
LFCPNX-100-9LFG672C 672-ball lfg (fcbga) Pinbelegungsleitfaden
Pinbelegung für LFCPNX-100-9LFG672C (672-ball lfg (fcbga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für LFCPNX-100-9LFG672C.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
LFCPNX-100-9LFG672C ist geeignet für 7 Anwendungs: Industrial Edge AI Inference, Automotive Sensor Fusion, 5G Wireless Infrastructure, Video Bridging and Aggregation, Medical Imaging, Aerospace and Defense Avionics, IoT Edge Gateways.
Industrial Edge AI Inference
The LFCPNX-100-9LFG672C is well matched to edge AI inference for industrial machine vision and predictive maintenance applications. Its 100K logic cells and 3.8 Mbit embedded memory are sufficient to host quantized CNN inference engines (MobileNet, EfficientNet-Lite) at 5-15 frames per second, while the 28 nm FD-SOI process delivers the low static power required for fanless, sealed industrial enclosures. Designers typically instantiate parallel DSP pipelines within the CertusPro-NX fabric and stream serialized image data through the integrated 10G SerDes to FPGA-based pre-processing blocks. Compared with larger 7 nm FPGAs, the LFCPNX-100 cuts dynamic power by roughly 40-60% for equivalent workloads. The AEC-Q100 automotive qualification also makes it viable for harsh-environment factory installations.
Empfohlen
Automotive Sensor Fusion
The LFCPNX-100-9LFG672C is deployed as a sensor-fusion hub in ADAS platforms where multiple camera, radar, and LiDAR feeds must be synchronized, time-stamped, and pre-processed before forwarding to the central compute SoC. Its 313 user I/O pins are sufficient to interface 8-12 automotive camera serializers plus multiple SPI/I2C/GPIO control planes, while the integrated 10G SerDes transports aggregated payloads upstream. The AEC-Q100 qualification, FD-SOI soft-error resilience, and automotive-grade temperature support make it directly suitable for in-cabin ECU deployments. The 672-ball LFG FCBGA also supports robust PCB thermal dissipation, which is critical in sealed automotive enclosures where airflow is restricted.
Empfohlen
5G Wireless Infrastructure
In 5G small-cell and distributed-unit (DU) base stations, the LFCPNX-100-9LFG672C is used to implement PHY-layer front-haul and mid-haul processing, CPRI/eCPRI bridge functions, and time-sensitive networking control. The integrated 10G SerDes blocks support multiple CPRI line rates (4.9 Gbps, 9.8 Gbps, 10.1 Gbps) directly, and the 100K-logic-cell capacity is sufficient to host complete PHY pre-processing, FFT/iFFT accelerators, and FEC encoder/decoder blocks. The low-power 28 nm FD-SOI technology is particularly attractive for outdoor small-cell deployments where the unit must be fanless and thermally passive. The device is typically paired with a host SoC or NPU for higher-layer baseband processing.
Empfohlen
Video Bridging and Aggregation
Professional video production, broadcast, and machine-vision systems use the LFCPNX-100-9LFG672C as a multi-format video bridge that aggregates 4-6 SDI/HDMI/DisplayPort inputs and outputs unified 4K streams over 10G Ethernet or USB-C. Its high LUT count supports parallel protocol conversion paths (HDMI 2.0 to SDI, DisplayPort 1.4 to eDP) and color-space conversion pipelines. The 3.8 Mbit embedded memory holds line buffers for active video mixing without requiring external SDRAM, and the 313 user I/O pins expose enough LVDS/MIPI/SDI interfaces for professional broadcast gear. The 672-ball FCBGA package supports reflow at peak 250 C per JEDEC J-STD-020.
Empfohlen
Medical Imaging
In ultrasound carts, endoscopy processors, and bedside patient-monitoring devices, the LFCPNX-100-9LFG672C is used for real-time beamforming, image reconstruction, and multi-channel data acquisition. The 100K-logic-cell capacity is sufficient to host 64-channel digital beamforming for portable ultrasound, while the integrated SerDes blocks enable high-speed data transfer from analog front-end ICs. The low-power FD-SOI technology keeps the device cool enough for handheld probe assemblies, and the AEC-Q100 qualification also extends suitability to medical device deployments requiring high reliability. The 672-ball LFG FCBGA supports the multi-layer PCB stack-ups typical in medical imaging hardware.
Empfohlen
Aerospace and Defense Avionics
Avionics subsystems use the LFCPNX-100-9LFG672C for flight-control data concentration, MIL-STD-1553/ARINC-429 bridge interfaces, and real-time sensor aggregation in unmanned aerial platforms. The FPGA's FD-SOI process provides inherent radiation tolerance beneficial for high-altitude operations, while the 313 user I/O pins accommodate multiple avionics buses and discrete control signals. The 10G SerDes blocks support high-bandwidth links to mission computers and EO/IR sensor payloads. With 3.8 Mbit embedded memory, mission-critical state machines can run from on-chip RAM without external memory dependencies, reducing single-event-upset risk.
Empfohlen
IoT Edge Gateways
Industrial IoT edge gateways deploy the LFCPNX-100-9LFG672C to aggregate sensor traffic from multiple field buses (Modbus, CAN, RS-485, EtherCAT) and forward normalized data over 10G Ethernet or cellular backhaul. Its low-power envelope makes it suitable for DIN-rail mounted gateways without active cooling, and the 100K-logic-cell capacity supports on-gateway data normalization, edge analytics, and protocol translation in a single device. The integrated 10G SerDes provides ample uplink bandwidth for video and high-speed sensor data. The 672-ball FCBGA also enables tight PCB integration with PoE power management and isolated serial transceivers.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für LFCPNX-100-9LFG672C – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | LFCPNX-100-9LFG672I | LFCPNX-50-9LFG672C | LFCPNX-100-9LFG672C01A |
|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 672-ball LFG (FCBGA) | 672-ball LFG (FCBGA) - same | 672-ball LFG (FCBGA) - same | 672-ball LFG (FCBGA) - same |
| Logic Cells | 100,000 | 100,000 | 50,000 (-50%) | 100,000 |
| SerDes Support | 10G | 10G | 10G | 10G |
| Temperature Grade | Commercial | Industrial | Commercial | Commercial |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified |
Wichtigste Unterscheidungsmerkmale
- 28 nm FD-SOI process delivers low static and dynamic power (vs. LFCPNX-50-9LFG672C)
- Same-family LFG672 footprint with full backward compatibility (vs. LFCPNX-50-9LFG672C)
- Industrial temperature grade with same package (vs. LFCPNX-100-9LFG672I)
Designhinweise
The 672-ball LFG FCBGA requires microvia PCB technology (any-layer HDI recommended) with controlled-impedance traces for the 10G SerDes pairs. Place BGA escape vias on a 0.5 mm or finer pitch pattern. Multiple stitching vias should surround the BGA land pattern to provide robust power delivery and thermal dissipation. Estimated: with 1 oz copper on outer layers and 4-layer stack-up, expect ~2 W power dissipation per 100 MHz of switching logic at 50% toggle rate.
Provide a clean 1 V core supply with bulk capacitance totaling at least 100 uF (low-ESR ceramic + tantalum) plus 0.1 uF and 1 nF decoupling within 2 mm of each power pin. According to Lattice hardware design guidelines, separate analog and digital supplies with a ferrite bead. Use a dedicated sequencing controller if the system includes multiple Lattice power rails (VCCIO, VCCAUX, VCC_CORE). The SerDes PLL supply should be filtered with a pi-network to minimize jitter.
Estimated: at full utilization (~80% logic, ~70% I/O toggle), the LFCPNX-100-9LFG672C dissipates roughly 1.5-2.5 W typical and up to 3.5 W worst-case. The 672-ball LFG FCBGA exposes a thermal pad array on the underside, which must be soldered to a thermal copper plane with thermal vias (0.3 mm drill, 1.0 mm pitch) to achieve the datasheet theta_JA. For sealed enclosures, add a small heatsink or use forced airflow over the BGA top side. The MSL 4 rating requires careful moisture control before reflow.
Avoid mixing commercial (C) and industrial (I) temperature grade parts in safety-critical designs - the C variant does not carry the same qualification characterization. Confirm the full part-number suffix before ordering production volumes. When migrating bitstreams across part-number variants, verify that the Radiant project settings match the target device's speed grade and package. Configuration errors at JTAG boundary-scan often trace to missing or under-sized TMS/TCK pull-ups rather than FPGA faults.
Compliance-Informationen
RoHS compliance and AEC-Q100 qualification confirmed via Lattice CertusPro-NX product family documentation. Halogen-free status not explicitly listed in the verified sources.
