LFCPNX-100-9LFG672I - 100K LC CertusPro-NX FPGA, 672-BGA | Lattice
Teilenummer: LFCPNX-100-9LFG672I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $387 | $3.870,00 |
| 100 | $348 | $34.800,00 |
| 500 | $312 | $156.000,00 |
| 1.000 | $278 | $278.000,00 |
LFCPNX-100-9LFG672I Übersicht
An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit that lets engineers implement custom digital logic, memory blocks, DSP blocks, and high-speed transceivers after PCB fabrication. FPGAs sit at the heart of embedded systems in a hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. CertusPro-NX is Lattice's advanced general-purpose FPGA family, positioned between low-density ECP5 and high-density Avant devices, optimized for bridging, sensor aggregation, and edge AI inference.
Key features include 96K logic cells, 7.4 Mb embedded SRAM, 156 18x18 multipliers, dedicated DDR3/LPDDR4 memory controller hard IP, up to 10 Gbps SERDES lanes for PCIe Gen 3 and 10 GbE, and a wide variety of programmable I/O supporting LVCMOS, LVDS, and MIPI standards. The LFG672 caBGA package with 27x27 mm body footprint is part of the surface-mount BGA family and integrates a high-I/O-count silicon variant of the CertusPro-NX family.
From an architectural perspective, CertusPro-NX uses Lattice's Nexus small-form-factor platform combined with hardened system IP such as SERDES and DDR PHY. The 28 nm FD-SOI process delivers improved soft-error rate (SER) and lower soft-error sensitivity compared to bulk CMOS, making the family suitable for industrial and aerospace applications where radiation-induced upsets are a concern.
Typical applications include industrial sensor aggregation and machine vision, edge AI inference for low-power vision, motor control and robotics, PCIe bridging for host expansion, and 5G small-cell fronthaul. The 100K LC variant sits in the mid-density sweet spot between the LFCPNX-50 (smaller logic capacity) and LFCPNX-200 (highest density) devices, all sharing the same LFG672 package for migration headroom.
When designing with this device, use Lattice Radiant software for synthesis, place-and-route, and bitstream generation. Provide stable power rails for VCC_CORE (0.85 V typical) and VCC_IO bank supplies; bulk decoupling close to each rail pin and a clean SERDES reference clock are critical for 10 Gbps link reliability.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers select and qualify the LFCPNX-100-9LFG672I faster.
Drop-in-Alternativen für LFCPNX-100-9LFG672I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit LFCPNX-100-9LFG672I (gleiche Bauform und Footprint) – abweichend in Mounting Type, Package, Family, Logic Cells, Operating Temperature Range.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
LFCPNX-200-9LFG672I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LFCPNX-100-9LFG672C
✅ Drop-In✓ Auf Lager
$35.4 / Stück
Datenblatt ansehen →LFCPNX-100-9LFG672I
✅ Drop-In✓ Auf Lager
$278 / Stück
Datenblatt ansehen →LFCPNX-50-9LFG672I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPF300T-1FCG484E
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC7A200T-2FBG676I
✅ Drop-In✓ Auf Lager
$100 / Stück
Datenblatt ansehen →LFCPNX-100-9LFG672I Grenzwerte & elektrische Eigenschaften
| Family | CertusPro-NX |
| Logic Cells | 96000 |
| Embedded Memory Bits | 3833856 |
| Number of Logic Elements | 96000 |
| Number of I/O Banks | 8 |
| Number of I/O Pins | 313 (max) |
| Embedded Block RAM | 7.4 Mb (EBR + distributed) |
| DSP Blocks | 156 18x18 multipliers |
| SERDES Lanes | Up to 4 lanes @ 10 Gbps |
| Process Node | 28 nm FD-SOI |
| Hard Memory Controller | DDR3 / DDR3L / LPDDR4 |
| PCIe Hard IP | PCIe Gen 3 (x4/x2/x1) + Gen 2/1 |
| Gehäuse | 672-ball caBGA (LFG672), 27x27 mm |
| Betriebstemperaturbereich | -40C to +100C (Industrial, 'I' suffix) |
| Supply Voltage Core | 0.85 V (typical) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
LFCPNX-100-9LFG672I Pin-Konfiguration
| Pin A1 | IO_LXX_N1 — Differential I/O ball in bank 0 (function varies by user assignment) |
| Pin A2 | IO_LXX_P1 — Differential I/O ball in bank 0 |
| Pin B1 | IO_LXX_N2 — Differential I/O ball in bank 0 |
| Pin B2 | VCCIO0 — I/O bank 0 supply voltage |
| Pin C1 | GND — Common ground return |
| Pin C2 | VCC_CORE — Core 0.85 V supply |
| Pin D1 | SERDES_REFCLK_P — SERDES reference clock positive input |
| Pin D2 | SERDES_REFCLK_N — SERDES reference clock negative input |
| Pin E1 | PERSTn — PCIe fundamental reset (active-low) |
| Pin E2 | PCIE_REFCLK_P — PCIe reference clock positive |
| Pin F1 | TCK — JTAG test clock |
| Pin F2 | TDI — JTAG test data input |
| Pin G1 | TDO — JTAG test data output |
| Pin G2 | TMS — JTAG test mode select |
| Pin H1 | CCLK — Configuration clock for SPI master mode |
| Pin H2 | DONE — Configuration done indicator (open-drain) |
| Pin J1 | INITn — Configuration initialization flag (active-low) |
| Pin J2 | PROGRAMn — Configuration reset input (active-low) |
| Pin K1 | M0 — Configuration mode select bit 0 |
| Pin K2 | M1 — Configuration mode select bit 1 |
Typische Anwendungen
LFCPNX-100-9LFG672I ist geeignet für 6 Anwendungs: Industrial Sensor Aggregation and Machine Vision, Edge AI Inference for Low-Power Vision, PCIe Gen 3 Bridge and Host Expansion, 5G Small Cell Fronthaul and Networking, Motor Control and Industrial Robotics, Automotive Display Aggregation and HMI.
Industrial Sensor Aggregation and Machine Vision
The LFCPNX-100-9LFG672I fits industrial sensor aggregation and machine vision because its 96,000 logic cells and 156 DSP blocks provide sufficient capacity to merge data from multiple MIPI CSI-2 image sensors and pre-process frames at the edge. Per the Lattice CertusPro-NX family datasheet, the device's hardened DDR3/LPDDR4 controller and 313 I/O pins support direct connection to high-bandwidth sensors and DDR memory without external bridges. The 28 nm FD-SOI process and industrial -40C to +100C temperature grade suit factory-floor environments, while 4 lanes of 10 Gbps SERDES allow aggregation of multiple remote cameras over a single fiber link.
Empfohlen
Edge AI Inference for Low-Power Vision
The LFCPNX-100-9LFG672I suits edge AI inference for low-power vision applications because it combines 96K logic cells, 7.4 Mb of embedded memory, and 156 DSP multipliers needed to run quantized CNN inference at the network edge. Per the Lattice CertusPro-NX family datasheet, the 28 nm FD-SOI process delivers low static leakage and excellent SER, which keeps both thermal envelope and soft-error rate low for always-on AI workloads. The hardened PCIe Gen 3 hard IP and DDR controller let a vision SoC stream activations and weights into the FPGA for acceleration, with the FPGA returning classification results through a high-speed serial interface.
Empfohlen
PCIe Gen 3 Bridge and Host Expansion
The LFCPNX-100-9LFG672I serves as a PCIe Gen 3 bridge because the integrated PCIe hard IP supports x1/x2/x4 Gen 3 configurations natively. Per the Lattice CertusPro-NX PCIe Bridge Board (LPCPNX-PCIE-EVN) reference design, the 4 lanes of integrated 10 Gbps SERDES can simultaneously drive PCIe plus 10 GbE or USB 3.1 expansion interfaces. The 96K logic cells give designers enough headroom to implement custom protocol conversion, DMA engines, and host-side interrupt logic without external ASSPs. Industrial temperature grading makes it suitable for server-class PCIe cards in 24/7 datacenters.
Empfohlen
5G Small Cell Fronthaul and Networking
The LFCPNX-100-9LFG672I fits 5G small-cell fronthaul applications because of its integrated 10 Gbps SERDES and 96K logic cells, sufficient to implement CPRI / eCPRI link aggregation and PHY-layer processing. Per the Lattice CertusPro-NX product page, the 28 nm FD-SOI process tolerates the higher ambient temperatures found in outdoor small-cell enclosures, and the -40C to +100C industrial temperature grade supports deployment in pole-mount and rooftop cells. Designers can map the SERDES to SFP+ cages for direct optical fiber connectivity and use the programmable I/O to interface with RF front-end modules.
Empfohlen
Motor Control and Industrial Robotics
The LFCPNX-100-9LFG672I works well for motor control and industrial robotics because it provides deterministic parallel I/O for multi-axis PWM generation, encoder feedback, and safety shutdown paths. Per the Lattice CertusPro-NX family datasheet, the 156 18x18 multipliers can run field-oriented control (FOC) loops at sub-microsecond latency for 3-axis drives, while the 7.4 Mb embedded memory buffers trajectory planning tables. The industrial temperature range and 28 nm FD-SOI process provide immunity to alpha-particle-induced upsets common in motor-drive environments.
Empfohlen
Automotive Display Aggregation and HMI
The LFCPNX-100-9LFG672I fits automotive display aggregation and HMI bridge applications because its 96K logic cells can aggregate multiple LVDS/OLDI display streams and MIPI CSI-2 camera inputs into a single head-unit output. Per the Lattice CertusPro-NX product page, the industrial temperature range supports the -40C cold-crank and +85C dashboard ambient of most vehicles. The hardened DDR3/LPDDR4 controller supports frame buffer memory for video upscaling, and 313 I/O pins give designers enough LVDS/MIPI lanes to connect four to six display or camera sources simultaneously without external multiplexer chips.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für LFCPNX-100-9LFG672I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | LFCPNX-200-9LFG672I | LFCPNX-100-9LFG672C | LFCPNX-50-9LFG672I | MPF300T-1FCG484E | XC7A200T-2FBG676I |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Microchip Technology | AMD / Xilinx |
| Package | 672-ball caBGA (LFG672), 27x27 mm | 672-ball caBGA (LFG672), 27x27 mm | 672-ball caBGA (LFG672), 27x27 mm | 672-ball caBGA (LFG672), 27x27 mm | 484-ball FCBGA | 676-ball FCBGA (FBG676) |
| Logic Cells | 96000 | 200000 | 96000 | 50000 | 300000 | 215360 |
| Process Node | 28 nm FD-SOI | 28 nm FD-SOI | 28 nm FD-SOI | 28 nm FD-SOI | 28 nm | 28 nm |
| Max I/O Pins | 313 | 313 | 313 | 313 | 244 | 400 |
| SERDES Lanes | Up to 4 lanes @ 10 Gbps | Up to 4 lanes @ 10 Gbps | Up to 4 lanes @ 10 Gbps | Up to 2 lanes @ 10 Gbps | Up to 16 lanes @ 10.3125 Gbps | Up to 16 GTP @ 6.6 Gbps |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Hard Memory Controller | DDR3 / DDR3L / LPDDR4 | DDR3 / DDR3L / LPDDR4 | DDR3 / DDR3L / LPDDR4 | DDR3 / LPDDR4 | DDR3/LPDDR3 | DDR3 (via soft IP) |
| PCIe Hard IP | Gen 3 x4 | Gen 3 x4 | Gen 3 x4 | Gen 2 x1 | Gen 2 x4 | Gen 2 x4 |
Wichtigste Unterscheidungsmerkmale
- 28 nm FD-SOI process offers improved soft-error rate vs bulk CMOS (vs. XC7A200T-2FBG676I)
- Integrated 10 Gbps SERDES plus hardened PCIe Gen 3 IP at 96K LC density (vs. MPF300T-1FCG484E)
- Full upward migration within the same LFG672 package family (vs. LFCPNX-50-9LFG672I)
Designhinweise
The LFCPNX-100-9LFG672I requires a clean 0.85 V core supply (VCC_CORE) and separate VCCIO bank supplies for each I/O bank. Per the Lattice CertusPro-NX family datasheet, bulk decoupling should be at least 22 uF ceramic per bank plus 10 uF bulk near each regulator; high-frequency decoupling of 100 nF must be placed within 1 mm of each supply pin to suppress transient switching noise from the SERDES and DDR controller. Use a low-dropout regulator such as the TPS7A4701 for analog rails feeding SERDES clock paths to minimize phase noise.
Estimated: at full SERDES utilization (4 lanes at 10 Gbps) plus 96K logic cells toggling at 200 MHz, the LFCPNX-100-9LFG672I dissipates approximately 2.5 to 4 W of total power. The LFG672 caBGA package requires a thermal pad on the PCB and at least 6 thermal vias under the die to keep the junction temperature below +100C in the industrial grade. Provide forced-air cooling or a heat-spreader lid in enclosed enclosures to prevent thermal shutdown during prolonged SERDES traffic. Ambient temperature inside the enclosure should be kept below +70C for reliable industrial-grade operation.
Route SERDES lanes as 100-ohm differential pairs with intra-pair skew under 0.15 mm and length matching across all four lanes within 0.5 mm to meet PCIe Gen 3 and 10 GbE compliance. The DDR3/DDR4 interface requires matched-length fly-by topology and proper write-leveling calibration in Lattice Radiant software. Place the boot SPI flash within 25 mm of the FPGA configuration SPI pins to avoid signal-integrity issues at boot, and provide a 25 MHz or 100 MHz reference clock with sub-200 fs RMS jitter for the SERDES reference input.
Do not enable both the internal PCIe reference clock input and the external reference clock simultaneously without verifying the PCIe clock selection strap - the LFCPNX-100-9LFG672I has separate pins for each and routing both can cause oscillator contention. Ensure the DONE pin has a 4.7 kohm pull-up to VCCIO_0 if configuration status is read by an external MCU. For industrial-grade designs, verify the bitstream and SPI flash against a known-good image after every boot because 28 nm FD-SOI is still susceptible to rare alpha-induced upsets in high-altitude deployments.
Compliance-Informationen
LFG package prefix per Lattice product nomenclature denotes lead-free and halogen-free BGA. RoHS and REACH compliant per Lattice product compliance matrix. AEC-Q100 qualification not certified for this part; for automotive AEC-Q100 designs, contact Lattice Automotive for available automotive-grade CertusPro-NX variants.
