LPC55S69JBD100K - Dual Cortex-M33 150MHz MCU, 640KB Flash | NXP
Teilenummer: LPC55S69JBD100K ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.95 | $6,95 |
| 10 | $5.98 | $59,80 |
| 30 | $5.38 | $161,40 |
| 100 | $4.69 | $469,00 |
| 500 | $4.12 | $2.060,00 |
LPC55S69JBD100K Übersicht
A Cortex-M33 microcontroller is a 32-bit processor core built on the Armv8-M architecture that combines deterministic real-time behavior with TrustZone security extensions and an optional single-precision Floating Point Unit (FPU). It sits within the broader ARM Cortex-M family (Cortex-M0/M0+/M3/M4/M7/M33) and is widely used in secure IoT endpoints, industrial HMI, motor control, and consumer devices where deterministic interrupt latency, DSP performance, and hardware-rooted security are required.
Key features include 640 KB Flash, 320 KB total SRAM, USB High-Speed with on-chip PHY, multiple Flexcomm interfaces for USART/SPI/I2C/I2S, a PowerQuad hardware accelerator for CMSIS-DSP functions, a CASPER crypto coprocessor for asymmetric key operations, and a 16-bit ADC. The LPC55S69JBD100K integrates TrustZone-M, secure boot, PRINCE flash encryption, and a True Random Number Generator (TRNG), making it suitable for PSA Certified Level 3 designs.
The dual-core architecture pairs a primary Cortex-M33 (CPU0) with a secondary Cortex-M33 (CPU1), allowing real-time tasks to run isolated from application code. With PowerQuad, complex math operations such as FIR, FFT, and matrix transforms execute 10x faster than software, offloading the CPU for sensor fusion or motor control loops.
Typical applications include secure IoT edge nodes, industrial HMI and control, USB Type-C audio peripherals, motor drives with FOC, smart locks and access control, and connected white goods. The wide operating temperature range of -40C to +105C supports harsh industrial environments.
When designing with this part, ensure adequate decoupling on each VDD/VBAT pin and follow NXP's hardware design guide for the SDIO/USB HS PHY. Boot source is selectable via PIO0_5 state at reset - this pin must not be reassigned if deep-power-down wake-up is needed.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes for the LPC55S69JBD100K not found in any single manufacturer or distributor page.
Drop-in-Alternativen für LPC55S69JBD100K – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit LPC55S69JBD100K (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, On-Chip SRAM, Operating Temperature, Security.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
LPC55S66JBD100
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LPC55S69JBD64
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LPC55S69JBD100
✅ Drop-In✓ Auf Lager
$7.65 / Stück
Datenblatt ansehen →LPC55S66JBD64
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
LPC55S69JEV98
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
LPC55S69JBD100K Grenzwerte & elektrische Eigenschaften
| Core | Dual ARM Cortex-M33 (Armv8-M) |
| Maximale Taktfrequenz | 150 MHz |
| Flash Memory | 640 KB (640K x 8) |
| SRAM | 320 KB |
| Gehäuse | 100-pin HLQFP (14x14 mm) |
| Montageart | Surface Mount |
| JEDEC Package Code | S-PQFP-G100 |
| Betriebstemperatur | -40C to +105C |
| USB | USB High-Speed with on-chip PHY |
| Security | TrustZone-M, secure boot, PRINCE, TRNG, CASPER |
| Hardware Accelerators | PowerQuad (DSP), CASPER (crypto) |
| Communication Interfaces | Flexcomm (USART/SPI/I2C/I2S), USB HS, SDIO, CAN-FD |
| RoHS-Status | Compliant |
LPC55S69JBD100K s-pqfp-g100 Pinbelegungsleitfaden
Pinbelegung für LPC55S69JBD100K (s-pqfp-g100-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für LPC55S69JBD100K.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
LPC55S69JBD100K ist geeignet für 6 Anwendungs: Secure IoT Edge Node, Industrial HMI and Control, USB Type-C Audio Peripherals, Motor Drive with FOC, Smart Lock and Access Control, Connected White Goods.
Secure IoT Edge Node
The LPC55S69JBD100K is ideal for secure IoT edge nodes where hardware root-of-trust and TLS acceleration are mandatory. Its dual Cortex-M33 cores at 150 MHz deliver sufficient headroom for MQTT-SN, CoAP, and BLE Mesh stacks while offloading cryptographic operations to the CASPER coprocessor, which accelerates RSA and ECC handshakes by 5-10x compared to software. The 640 KB Flash accommodates rich TLS trust stores and OTA update images, while the 320 KB SRAM supports TLS session buffers and JSON parsing without external memory. TrustZone-M isolation lets the secure firmware handle key storage separately from application code, achieving PSA Certified Level 3. Operating temperature of -40C to +105C supports outdoor enclosures.
Empfohlen
Industrial HMI and Control
For industrial HMI panels and PLC controllers, the LPC55S69JBD100K provides the LCD interface, touch controller support, and deterministic real-time response required for factory automation. The dual-core architecture lets one Cortex-M33 handle the HMI graphics stack while the second core runs real-time control loops with deterministic interrupt latency. PowerQuad accelerates FIR filtering and FFT analysis for vibration monitoring and predictive maintenance. The Flexcomm interfaces connect to multi-protocol industrial buses (RS-485, CAN-FD, SPI sensors), while the -40C to +105C operating range supports cabinet and panel-mount deployments. Integrated secure boot prevents unauthorized firmware replacement in field-deployed equipment.
Empfohlen
USB Type-C Audio Peripherals
The LPC55S69JBD100K integrates a USB High-Speed PHY with on-chip transceiver, making it ideal for USB Type-C audio interfaces, USB headsets, and high-fidelity USB DACs. At 150 MHz, the Cortex-M33 cores plus PowerQuad DSP accelerator deliver sample-rate conversion and active crossover filters without taxing CPU resources. The 640 KB Flash stores audio processing algorithms, while 320 KB SRAM accommodates 32-bit audio buffers at 192 kHz. TrustZone protects licensed audio codecs from firmware tampering. Multiple Flexcomm peripherals support I2S connections to external DACs and ADCs, while SDIO enables local music playback from microSD cards.
Empfohlen
Motor Drive with FOC
For sensorless and sensored Field-Oriented Control (FOC) motor drives, the LPC55S69JBD100K's PowerQuad hardware accelerator executes Clarke/Park transforms and space-vector modulation 10x faster than software implementations, freeing CPU bandwidth for speed/torque loops. The dual-core architecture separates the slow control loop from the fast current loop, while the 16-bit ADC with synchronized PWM triggers enables sub-microsecond current sampling. Operating from -40C to +105C supports under-hood automotive and industrial cabinet environments. Integrated secure boot prevents unauthorized motor parameter tampering.
Empfohlen
Smart Lock and Access Control
The LPC55S69JBD100K is well suited for smart locks, biometric access controllers, and electronic safes where tamper resistance and secure key storage are non-negotiable. TrustZone-M, PRINCE in-flash encryption, and the True Random Number Generator provide hardware root-of-trust required for FIDO2 and Matter commissioning flows. The 640 KB Flash stores biometric templates and credential databases, while 320 KB SRAM supports TLS handshakes with cloud services. Dual Cortex-M33 cores let the secure enclave handle crypto while the non-secure world runs the user interface and BLE/Zigbee/Thread stacks.
Empfohlen
Connected White Goods
In connected white goods such as smart washing machines, refrigerators, and ovens, the LPC55S69JBD100K provides Wi-Fi/BLE companion connectivity, capacitive touch sensing, and motor inverter control in a single device. The Cortex-M33 cores handle the user interface and cloud protocol stacks while PowerQuad accelerates the sensor fusion algorithms needed for adaptive wash programs. The -40C to +105C rating supports appliance environments near heating elements. TrustZone secures over-the-air firmware updates, while the integrated USB HS PHY simplifies factory programming and diagnostics.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für LPC55S69JBD100K – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | LPC55S66JBD100 | LPC55S69JBD64 | LPC55S69JBD100 | LPC55S66JBD64 | LPC55S69JEV98 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 100-pin HLQFP (14x14 mm) | 100-pin HLQFP (14x14 mm) - same | 100-pin HLQFP (14x14 mm) - same | 100-pin HLQFP (14x14 mm) - same | 100-pin HLQFP (14x14 mm) - same | 100-pin HLQFP (14x14 mm) - same |
| Core | Dual Cortex-M33 @ 150 MHz | Dual Cortex-M33 @ 150 MHz | Dual Cortex-M33 @ 150 MHz | Dual Cortex-M33 @ 150 MHz | Dual Cortex-M33 @ 150 MHz | Dual Cortex-M33 @ 150 MHz |
| Flash | 640 KB | 256 KB | 640 KB | 640 KB | 256 KB | 640 KB |
| TrustZone | Yes | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
Wichtigste Unterscheidungsmerkmale
- Highest-memory configuration in the LPC55S6x family (vs. LPC55S66JBD100)
- Same-package upgrade path with full peripheral set (vs. LPC55S69JBD64)
- Integrated PowerQuad DSP and CASPER crypto accelerators (vs. LPC55S69JBD100)
Designhinweise
Decouple each VDD/VBAT pin with a 100 nF X7R ceramic capacitor placed within 2 mm of the pin, and add a bulk 4.7 uF tantalum or polymer cap on each main rail. The LPC55S69JBD100K's USB HS PHY requires a clean 3.3 V analog supply - use a ferrite bead to isolate USBVDD from the digital 3.3 V rail, per NXP hardware design guide section 3.1. Estimated: total quiescent current at 150 MHz with both cores active is approximately 30-40 mA - size your LDO accordingly.
Pin PIO0_5 selects the boot source at reset and doubles as a wake-up pin from deep-power-down mode. If you need deep-power-down wake, do not assign any peripheral function to PIO0_5. Failing to honor this is the most common reason for non-booting prototypes.
Route the USB HS DP/DM traces as a 90-ohm differential pair with length matching within 150 mils, and keep them away from switching DC-DC converters or high-current motor traces. Place the on-chip PHY reference resistor on USB_VDD closely to its dedicated pin. The 100-pin HLQFP has a center thermal pad that must be soldered to a 4x4 array of thermal vias for production reliability.
Compliance-Informationen
RoHS compliant per NXP product page. Industrial -40C to +105C temperature grade; not AEC-Q100 qualified. PSA Certified Level 3 capable per TrustZone + secure boot integration.
