LPC55S69JBD100K vs MCXN556TCDFT Vergleich

Detaillierter Direktvergleich von LPC55S69JBD100K von NXP Semiconductors und MCXN556TCDFT von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
LPC55S69JBD100K LPC55S69JBD100K - Dual Cortex-M33 150MHz MCU, 640KB Flash | NXP

LPC55S69JBD100K - Dual Cortex-M33 150MHz MCU, 640KB Flash | NXP

LPC55S69JBD100K ✓ Aktiv
NXP Semiconductors
MCXN556TCDFT MCXN556TCDFT - MCX N556 MCU 184MHz 250KB VFBGA-184 | NXP

MCXN556TCDFT - MCX N556 MCU 184MHz 250KB VFBGA-184 | NXP

MCXN556TCDFT ✓ Aktiv

Spezifikationsvergleich

Parameter LPC55S69JBD100K MCXN556TCDFT
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $4,12 $5,22
Core Dual ARM Cortex-M33 (Armv8-M) —
Maximale Taktfrequenz 150 MHz —
Flash Memory 640 KB (640K x 8) —
SRAM 320 KB —
Gehäuse 100-pin HLQFP (14x14 mm) VFBGA-184 (9 mm x 9 mm x 0.86 mm, 0.5 mm pitch)
Montageart Surface Mount Surface Mount
JEDEC Package Code S-PQFP-G100 —
Betriebstemperatur -40C to +105C —
Versorgungsspannung [DATA_NEEDED: VDD range] 1.8 V to 3.6 V [DATA_NEEDED: exact VDD range from datasheet]
USB USB High-Speed with on-chip PHY —
Security TrustZone-M, secure boot, PRINCE, TRNG, CASPER —
Hardware Accelerators PowerQuad (DSP), CASPER (crypto) —
Communication Interfaces Flexcomm (USART/SPI/I2C/I2S), USB HS, SDIO, CAN-FD —
ADC [DATA_NEEDED: ADC channels and resolution] 12-bit [DATA_NEEDED: number of ADC channels, sample rate]
RoHS-Status Compliant Compliant [DATA_NEEDED: confirm per NXP product page]
MSL-Level [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL classification per JEDEC J-STD-020]
GPIO Count [DATA_NEEDED: GPIO count] —
Core Architecture — Arm Cortex-M33 + Cortex-M0+ (dual-core)
Maximum Main Core Frequency — 250 MHz
Maximum Low-Power Core Frequency — 150 MHz
On-Chip SRAM — 250 KB
Ball Count — 184
Betriebstemperaturbereich — -40C to +105C [DATA_NEEDED: confirm full operating range from datasheet]
Connectivity — USB, CAN-FD, I3C, FlexIO, UART, SPI, I2C [DATA_NEEDED: count of peripheral instances]
Security Features — Secure boot, cryptographic accelerators [DATA_NEEDED: confirm full security IP block list]
Series — MCX N (MCXN556)
Program Memory — [DATA_NEEDED: Flash size from datasheet]
Low-Power Modes — Multiple low-power states [DATA_NEEDED: full power-mode current values]

Datenblätter & Ressourcen

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