M1AFS1500-2FGG676 - 1.5M Gate Fusion FPGA | Microchip
Teilenummer: M1AFS1500-2FGG676 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $380.42 | $380,42 |
| 10 | $350 | $3.500,00 |
| 100 | $320 | $32.000,00 |
| 500 | $300 | $150.000,00 |
| 1.000 | $297.26 | $297.260,00 |
M1AFS1500-2FGG676 Übersicht
A Field-Programmable Gate Array (FPGA) is an integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs are part of the programmable logic family, which sits above application-specific integrated circuits (ASICs) in flexibility but below them in performance and power efficiency for high-volume production. The Fusion family uniquely combines FPGA fabric with analog blocks, flash memory, and clock management, making it a system-on-chip (SoC) solution for mixed-signal applications.
Key features include 1.5M system gates, 38,400 logic elements, 252 user I/Os, and an operating supply voltage of 1.5 V. The device supports a maximum clock frequency of 350 MHz and is built on 130 nm CMOS technology. The Fusion architecture integrates a 12-bit ADC, analog comparators, and large flash memory blocks, enabling true mixed-signal design in a single device. The 676-ball FBGA package provides excellent thermal and electrical performance for high-density designs.
Technically, the M1AFS1500-2FGG676 uses a flash-based FPGA fabric, which is non-volatile and secure, retaining configuration even without power. This eliminates the need for external configuration memory and provides instant-on operation. The integrated analog block includes a 12-bit successive approximation register (SAR) ADC with sample rates up to 600 kSPS, along with analog comparators and a voltage reference. The device also features up to 1 Mbit of flash memory for data storage and boot code.
Typical applications include industrial control, medical devices, automotive electronics, and aerospace systems where mixed-signal processing, reliability, and security are critical. The Fusion FPGA's ability to handle both analog and digital functions reduces board space and BOM cost, making it ideal for compact, high-reliability designs.
When designing with this device, ensure proper power supply decoupling on the 1.5 V core and I/O banks. The flash-based fabric requires no external configuration device, simplifying the design, but careful attention to analog block routing and grounding is essential to maintain ADC accuracy.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a comprehensive resource for evaluating the M1AFS1500-2FGG676.
Drop-in-Alternativen für M1AFS1500-2FGG676 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit M1AFS1500-2FGG676 (gleiche Bauform und Footprint) – abweichend in Package / Case, Technology, Family, RoHS Status, Logic Cells.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
M1AFS1500-2FGG676I
✅ Drop-In✓ Auf Lager
$59.6 / Stück
Datenblatt ansehen →M1AFS1500-2FGG676Y
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M1AFS1500-2FGG676YI
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M1AFS1500-FGG256K
✅ Drop-In✓ Auf Lager
$60.2 / Stück
Datenblatt ansehen →AFS1500-2FGG676
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
M1AFS1500-2FGG676 Grenzwerte & elektrische Eigenschaften
| Family | Fusion Mixed-Signal FPGA |
| Equivalent Gates | 1,500,000 |
| Logic Cells | 38,400 |
| Maximale Taktfrequenz | 350 MHz |
| Number of I/Os | 252 I/O |
| Betriebsversorgungsspannung | 1.5 V |
| Gehäuse / Bauform | 676-ball FBGA |
| Terminal Pitch | 1.00 mm |
| Technology | 130 nm CMOS |
| Maximum Operating Temperature | +70 °C |
| Minimum Operating Temperature | 0 °C |
| Montagestil | SMD/SMT |
| Packaging | Tray |
| Series | M1AFS1500 |
| Analog Blocks | 12-bit ADC, analog comparators, voltage reference |
| Flash Memory | Up to 1 Mbit |
| RoHS-Status | Compliant |
M1AFS1500-2FGG676 676-ball fbga Pinbelegungsleitfaden
Pinbelegung für M1AFS1500-2FGG676 (676-ball fbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für M1AFS1500-2FGG676.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
M1AFS1500-2FGG676 ist geeignet für 6 Anwendungs: Industrial Control, Medical Devices, Aerospace and Defense, Automotive Electronics, Communication Systems, Test and Measurement.
Industrial Control
The M1AFS1500-2FGG676 is ideal for industrial control systems that require mixed-signal processing, such as motor control, process automation, and power monitoring. Its integrated 12-bit ADC and analog comparators allow direct interfacing with sensors and transducers, eliminating the need for external ADC chips. The FPGA fabric can implement custom control algorithms, while the flash memory stores configuration and calibration data. With 252 I/Os, it can interface with multiple peripherals and communication interfaces. The device's 1.5V core and low power consumption make it suitable for embedded industrial applications. Its flash-based architecture ensures instant-on operation and high reliability in harsh environments, with a commercial temperature range of 0°C to +70°C. For extended temperature ranges, the industrial-grade variant is recommended.
Empfohlen
Medical Devices
In medical devices, the M1AFS1500-2FGG676 provides a secure, reliable platform for patient monitoring, diagnostic equipment, and portable medical instruments. The integrated analog front-end with 12-bit ADC and comparators can process biosignals such as ECG, EEG, and temperature. The flash-based FPGA fabric is non-volatile, ensuring secure boot and preventing unauthorized tampering, which is critical for medical device security. The device's low power consumption extends battery life in portable devices. With 1.5M gates, it can handle complex signal processing algorithms, while the 252 I/Os allow interfacing with displays, sensors, and communication modules. The commercial temperature range is suitable for most medical environments, and the device's long-term availability makes it ideal for medical products with extended lifecycles.
Empfohlen
Aerospace and Defense
The M1AFS1500-2FGG676 is well-suited for aerospace and defense applications that require high reliability, security, and mixed-signal processing. Its flash-based FPGA fabric is inherently secure, with no external configuration bitstream to intercept, making it resistant to reverse engineering. The integrated analog blocks can interface with sensors for flight control, navigation, and telemetry. The device operates over a commercial temperature range, but for extreme environments, the industrial-grade variant is available. With 1.5M gates and 252 I/Os, it can implement complex avionics interfaces, including ARINC 429, MIL-STD-1553, and custom protocols. The 130nm CMOS technology provides a balance of performance and power efficiency, crucial for airborne systems. The device's long-term availability and radiation-tolerant options in the Fusion family make it a trusted choice for defense programs.
Empfohlen
Automotive Electronics
In automotive electronics, the M1AFS1500-2FGG676 can be used for body control modules, infotainment systems, and advanced driver-assistance systems (ADAS) that require mixed-signal processing. The integrated ADC and comparators can monitor battery voltage, current, and temperature. The FPGA fabric can implement custom communication interfaces such as CAN, LIN, and FlexRay. However, the standard commercial temperature range (0°C to +70°C) may not meet under-hood requirements, so the industrial-grade variant is recommended for engine compartment applications. The device's flash-based architecture provides instant-on operation, essential for safety-critical functions. With 1.5M gates, it can handle complex control algorithms, while the 252 I/Os allow interfacing with multiple sensors and actuators. For automotive-grade qualification, consider dedicated automotive FPGAs with AEC-Q100 certification.
Empfohlen
Communication Systems
The M1AFS1500-2FGG676 is suitable for communication systems such as base stations, routers, and network infrastructure that require high-speed data processing and mixed-signal capabilities. The FPGA fabric can implement protocol stacks, packet processing, and error correction, while the integrated analog blocks can interface with RF front-ends and power amplifiers. With a maximum clock frequency of 350 MHz and 1.5M gates, it can handle high-throughput data paths. The 252 I/Os support various high-speed interfaces like LVDS, PCIe, and Ethernet. The device's flash-based architecture ensures secure configuration and fast startup, critical for network equipment. The commercial temperature range is adequate for indoor communication equipment. For outdoor or harsh environments, the industrial-grade variant is recommended.
Empfohlen
Test and Measurement
The M1AFS1500-2FGG676 is ideal for test and measurement equipment such as oscilloscopes, data acquisition systems, and signal generators. Its integrated 12-bit ADC and analog comparators enable direct signal acquisition and triggering, reducing component count. The FPGA fabric can implement digital signal processing, waveform generation, and triggering logic. With 1.5M gates and 252 I/Os, it can interface with high-speed ADCs, DACs, and display controllers. The device's flash-based architecture provides instant-on operation and secure configuration, essential for reliable test equipment. The commercial temperature range is suitable for benchtop instruments. The device's low power consumption and small footprint make it ideal for portable test equipment. For high-speed data acquisition, the 350 MHz clock frequency supports fast sampling rates.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für M1AFS1500-2FGG676 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | M1AFS1500-2FGG676I | M1AFS1500-2FGG676Y | M1AFS1500-2FGG676YI | M1AFS1500-FGG256K | AFS1500-2FGG676 |
|---|---|---|---|---|---|---|
| Package | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microsemi |
| Equivalent Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Number of I/Os | 252 | 252 | 252 | 252 | 252 | 252 |
| Operating Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Range | 0°C to +70°C | -40°C to +100°C | 0°C to +70°C | -40°C to +100°C | 0°C to +70°C | 0°C to +70°C |
Wichtigste Unterscheidungsmerkmale
- Integrated mixed-signal capability (vs. AFS1500-2FGG676)
- Industrial temperature grade option (vs. M1AFS1500-2FGG676)
- Flash-based security (vs. SRAM-based FPGAs)
Designhinweise
The M1AFS1500-2FGG676 requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a switching regulator with low ripple to provide this rail. Decouple each power pin with a 0.1uF ceramic capacitor and a 10uF bulk capacitor. The analog blocks require a separate, clean analog supply (AVDD) to minimize noise coupling. Refer to the Fusion FPGA datasheet for recommended power sequencing and decoupling guidelines.
For the 676-ball FBGA package, ensure adequate PCB routing and via placement. Use a multi-layer board with dedicated power and ground planes. Place decoupling capacitors as close to the BGA pads as possible, ideally on the opposite side of the board. For the analog blocks, use a star-ground topology to prevent digital noise from affecting ADC accuracy. Follow the manufacturer's layout recommendations for the FBGA package.
The M1AFS1500-2FGG676 dissipates power based on logic utilization and I/O activity. For high-density designs, use thermal vias under the BGA package to conduct heat to the PCB ground plane. The maximum junction temperature is typically 125°C, so ensure adequate airflow or heatsinking for high-power applications. The commercial temperature range is 0°C to +70°C, so ambient temperature must be considered in the thermal design.
Compliance-Informationen
RoHS compliance is indicated by distributor listings. AEC-Q100 not applicable as this is not an automotive-qualified part. Other compliance data not explicitly provided.
