M1AFS1500-2FGG676 - 1.5M Gate Fusion FPGA | Microchip
MPN: M1AFS1500-2FGG676 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $380.42 | $380.42 |
| 10 | $350 | $3,500.00 |
| 100 | $320 | $32,000.00 |
| 500 | $300 | $150,000.00 |
| 1,000 | $297.26 | $297,260.00 |
Drop-in alternatives for M1AFS1500-2FGG676 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M1AFS1500-2FGG676I
✅ Drop-In📋 Reference alternative (not in catalog)
M1AFS1500-2FGG676Y
✅ Drop-In📋 Reference alternative (not in catalog)
M1AFS1500-2FGG676YI
✅ Drop-In📋 Reference alternative (not in catalog)
M1AFS1500-FGG256K
✅ Drop-In✓ In Stock
$60.2 / Unit
View Datasheet →AFS1500-2FGG676
✅ Drop-In📋 Reference alternative (not in catalog)
M1AFS1500-2FGG676 Maximum Ratings & Electrical Characteristics
| Family | Fusion Mixed-Signal FPGA |
| Equivalent Gates | 1,500,000 |
| Logic Cells | 38,400 |
| Maximum Clock Frequency | 350 MHz |
| Number of I/Os | 252 I/O |
| Operating Supply Voltage | 1.5 V |
| Package / Case | 676-ball FBGA |
| Terminal Pitch | 1.00 mm |
| Technology | 130 nm CMOS |
| Maximum Operating Temperature | +70 °C |
| Minimum Operating Temperature | 0 °C |
| Mounting Style | SMD/SMT |
| Packaging | Tray |
| Series | M1AFS1500 |
| Analog Blocks | 12-bit ADC, analog comparators, voltage reference |
| Flash Memory | Up to 1 Mbit |
| RoHS Status | Compliant |
M1AFS1500-2FGG676 676-ball fbga Pin Configuration Guide
Complete pinout information for M1AFS1500-2FGG676 (676-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS1500-2FGG676.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS1500-2FGG676 is suitable for 6 applications: Industrial Control, Medical Devices, Aerospace and Defense, Automotive Electronics, Communication Systems, Test and Measurement.
Industrial Control
The M1AFS1500-2FGG676 is ideal for industrial control systems that require mixed-signal processing, such as motor control, process automation, and power monitoring. Its integrated 12-bit ADC and analog comparators allow direct interfacing with sensors and transducers, eliminating the need for external ADC chips. The FPGA fabric can implement custom control algorithms, while the flash memory stores configuration and calibration data. With 252 I/Os, it can interface with multiple peripherals and communication interfaces. The device's 1.5V core and low power consumption make it suitable for embedded industrial applications. Its flash-based architecture ensures instant-on operation and high reliability in harsh environments, with a commercial temperature range of 0°C to +70°C. For extended temperature ranges, the industrial-grade variant is recommended.
Recommended
Medical Devices
In medical devices, the M1AFS1500-2FGG676 provides a secure, reliable platform for patient monitoring, diagnostic equipment, and portable medical instruments. The integrated analog front-end with 12-bit ADC and comparators can process biosignals such as ECG, EEG, and temperature. The flash-based FPGA fabric is non-volatile, ensuring secure boot and preventing unauthorized tampering, which is critical for medical device security. The device's low power consumption extends battery life in portable devices. With 1.5M gates, it can handle complex signal processing algorithms, while the 252 I/Os allow interfacing with displays, sensors, and communication modules. The commercial temperature range is suitable for most medical environments, and the device's long-term availability makes it ideal for medical products with extended lifecycles.
Recommended
Aerospace and Defense
The M1AFS1500-2FGG676 is well-suited for aerospace and defense applications that require high reliability, security, and mixed-signal processing. Its flash-based FPGA fabric is inherently secure, with no external configuration bitstream to intercept, making it resistant to reverse engineering. The integrated analog blocks can interface with sensors for flight control, navigation, and telemetry. The device operates over a commercial temperature range, but for extreme environments, the industrial-grade variant is available. With 1.5M gates and 252 I/Os, it can implement complex avionics interfaces, including ARINC 429, MIL-STD-1553, and custom protocols. The 130nm CMOS technology provides a balance of performance and power efficiency, crucial for airborne systems. The device's long-term availability and radiation-tolerant options in the Fusion family make it a trusted choice for defense programs.
Recommended
Automotive Electronics
In automotive electronics, the M1AFS1500-2FGG676 can be used for body control modules, infotainment systems, and advanced driver-assistance systems (ADAS) that require mixed-signal processing. The integrated ADC and comparators can monitor battery voltage, current, and temperature. The FPGA fabric can implement custom communication interfaces such as CAN, LIN, and FlexRay. However, the standard commercial temperature range (0°C to +70°C) may not meet under-hood requirements, so the industrial-grade variant is recommended for engine compartment applications. The device's flash-based architecture provides instant-on operation, essential for safety-critical functions. With 1.5M gates, it can handle complex control algorithms, while the 252 I/Os allow interfacing with multiple sensors and actuators. For automotive-grade qualification, consider dedicated automotive FPGAs with AEC-Q100 certification.
Recommended
Communication Systems
The M1AFS1500-2FGG676 is suitable for communication systems such as base stations, routers, and network infrastructure that require high-speed data processing and mixed-signal capabilities. The FPGA fabric can implement protocol stacks, packet processing, and error correction, while the integrated analog blocks can interface with RF front-ends and power amplifiers. With a maximum clock frequency of 350 MHz and 1.5M gates, it can handle high-throughput data paths. The 252 I/Os support various high-speed interfaces like LVDS, PCIe, and Ethernet. The device's flash-based architecture ensures secure configuration and fast startup, critical for network equipment. The commercial temperature range is adequate for indoor communication equipment. For outdoor or harsh environments, the industrial-grade variant is recommended.
Recommended
Test and Measurement
The M1AFS1500-2FGG676 is ideal for test and measurement equipment such as oscilloscopes, data acquisition systems, and signal generators. Its integrated 12-bit ADC and analog comparators enable direct signal acquisition and triggering, reducing component count. The FPGA fabric can implement digital signal processing, waveform generation, and triggering logic. With 1.5M gates and 252 I/Os, it can interface with high-speed ADCs, DACs, and display controllers. The device's flash-based architecture provides instant-on operation and secure configuration, essential for reliable test equipment. The commercial temperature range is suitable for benchtop instruments. The device's low power consumption and small footprint make it ideal for portable test equipment. For high-speed data acquisition, the 350 MHz clock frequency supports fast sampling rates.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS1500-2FGG676 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS1500-2FGG676I | M1AFS1500-2FGG676Y | M1AFS1500-2FGG676YI | M1AFS1500-FGG256K | AFS1500-2FGG676 |
|---|---|---|---|---|---|---|
| Package | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA | 676-ball FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microsemi |
| Equivalent Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 |
| Logic Cells | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Maximum Clock Frequency | 350 MHz | 350 MHz | 350 MHz | 350 MHz | [DATA_NEEDED] | 350 MHz |
| Number of I/Os | 252 | 252 | 252 | 252 | 252 | 252 |
| Operating Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Range | 0°C to +70°C | -40°C to +100°C | 0°C to +70°C | -40°C to +100°C | 0°C to +70°C | 0°C to +70°C |
Key Differentiators
- Integrated mixed-signal capability (vs AFS1500-2FGG676)
- Industrial temperature grade option (vs M1AFS1500-2FGG676)
- Flash-based security (vs SRAM-based FPGAs)
Design Notes
The M1AFS1500-2FGG676 requires a 1.5V core supply. Use a low-dropout regulator (LDO) or a switching regulator with low ripple to provide this rail. Decouple each power pin with a 0.1uF ceramic capacitor and a 10uF bulk capacitor. The analog blocks require a separate, clean analog supply (AVDD) to minimize noise coupling. Refer to the Fusion FPGA datasheet for recommended power sequencing and decoupling guidelines.
For the 676-ball FBGA package, ensure adequate PCB routing and via placement. Use a multi-layer board with dedicated power and ground planes. Place decoupling capacitors as close to the BGA pads as possible, ideally on the opposite side of the board. For the analog blocks, use a star-ground topology to prevent digital noise from affecting ADC accuracy. Follow the manufacturer's layout recommendations for the FBGA package.
The M1AFS1500-2FGG676 dissipates power based on logic utilization and I/O activity. For high-density designs, use thermal vias under the BGA package to conduct heat to the PCB ground plane. The maximum junction temperature is typically 125°C, so ensure adequate airflow or heatsinking for high-power applications. The commercial temperature range is 0°C to +70°C, so ambient temperature must be considered in the thermal design.
Compliance Information
RoHS compliance is indicated by distributor listings. AEC-Q100 not applicable as this is not an automotive-qualified part. Other compliance data not explicitly provided.
