M7AFS600-FGG484 - 600K Gate Fusion FPGA, 484-BGA | Microchip
Teilenummer: M7AFS600-FGG484 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $273.99 | $273,99 |
| 10 | $261.29 | $2.612,90 |
| 100 | $247.99 | $24.799,00 |
| 500 | $239 | $119.500,00 |
| 1.000 | $232.9 | $232.900,00 |
M7AFS600-FGG484 Übersicht
A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks and programmable interconnects that an engineer configures after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices - above CPLDs in capacity and below ASICs in volume economics - and the Fusion family adds a unique mixed-signal analog layer (analog I/O, flash memory, and an ARM hard core) that turns the FPGA into a single-chip system controller.
Key features of the M7AFS600-FGG484 include 600,000 system gates of flash-based programmable logic, 172 user I/O pins, an ARM CoreMP7 hard processor core running up to 1098.9 MHz as listed by distributors, and flash fabric that is inherently non-volatile, secure, and immune to configuration-readback - eliminating the need for an external boot flash.
Technically, the Fusion family integrates programmable analog circuitry, configurable flash blocks, and the Actel flash-switch fabric process. Because the configuration cell is flash rather than SRAM, the device powers up instantly, draws no configuration current from external memory, and resists cloning - a significant advantage in industrial and defense designs.
Typical applications include industrial automation and smart motor control, power management and intelligent system monitoring, portable instrumentation, and embedded single-chip controllers consolidating FPGA logic plus microcontroller functions.
Design consideration: the FGG suffix denotes lead-free (Pb-free) solder balls; the drop-in FG variant uses standard balls, so always match the ball metallurgy to your assembly process (RoHS vs leaded reflow).
This page synthesizes distributor pricing, pin-compatible same-family drop-in alternatives, design notes, and application guidance not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für M7AFS600-FGG484 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit M7AFS600-FGG484 (gleiche Bauform und Footprint) – abweichend in Package, System Gates, Process Technology, Family, Configuration Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
M7AFS600-FGG484I
✅ Drop-In✓ Auf Lager
$219.2 / Stück
Datenblatt ansehen →M7AFS600-2FGG484I
✅ Drop-In✓ Auf Lager
$243.75 / Stück
Datenblatt ansehen →M7AFS600-1FGG484I
✅ Drop-In✓ Auf Lager
$228 / Stück
Datenblatt ansehen →M7AFS600-1FG484
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$181.3 / Stück
Datenblatt ansehen →M1AFS600-FG484I
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →M1AFS1500-1FGG484I
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →M7AFS600-FGG484 Grenzwerte & elektrische Eigenschaften
| Family | Fusion (Mixed-Signal FPGA) |
| System Gates | 600 K |
| Embedded Processor | ARM CoreMP7 (hard core) |
| Technology | 130 nm flash-based |
| Core Voltage | 1.5 V |
| User I/O | 172 |
| Maximum Operating Frequency | 1098.9 MHz (distributor-listed) |
| Configuration Memory | Flash (non-volatile, secure) |
| Gehäuse | 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm |
| Ball Pitch | 1 mm |
| Montageart | Surface Mount |
| Packaging | Tray |
| RoHS-Status | Compliant (Pb-free balls, FGG suffix) |
| Total RAM Bits | 110592 (per DigiKey listing) |
M7AFS600-FGG484 484-ball fbga (fgg484), 23 x 23 x 2.44 mm Pinbelegungsleitfaden
Pinbelegung für M7AFS600-FGG484 (484-ball fbga (fgg484), 23 x 23 x 2.44 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für M7AFS600-FGG484.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
M7AFS600-FGG484 ist geeignet für 6 Anwendungs: Industrial Automation and Motor Control, Intelligent Power Management and Monitoring, Portable and Battery-Powered Instrumentation, Aerospace and Defense Secure Embedded Control, Embedded Networking and Communication Cards, Smart Medical and Lab Device Controllers.
Industrial Automation and Motor Control
The M7AFS600-FGG484 fits industrial automation because it fuses a 600K-gate deterministic flash fabric with an ARM CoreMP7 hard processor, letting one chip run the real-time control loop and the supervisory HMI/communication tasks simultaneously. Its 172 user I/O interface PWM bridges, encoders, and fieldbus PHYs directly, while the Fusion family's programmable analog blocks sample current and voltage feedback without external ADCs. Because the configuration is flash-based, the controller is live within microseconds of power-up - essential for safe sequencing of drives and actuators. In a typical topology, the fabric implements the PWM generators and protection interlocks at sub-microsecond latency while the CoreMP7 executes the fieldbus stack and diagnostics, eliminating a separate microcontroller and cutting BOM count and board area in 24V industrial systems.
Empfohlen
Intelligent Power Management and Monitoring
Power-management applications favor the M7AFS600-FGG484 because Fusion's mixed-signal architecture was purpose-built for system power supervision: programmable analog I/O monitors multiple rails, and the flash fabric enforces sequencing and fault interlocks in hardware with deterministic timing. The 1.5V core keeps device consumption moderate, while the non-volatile configuration means power-good and brown-out logic is active before software loads - a hard requirement in multi-rail server and base-station supplies. Designers typically wire the analog monitoring inputs through the on-chip analog mux into fabric comparators, with the ARM CoreMP7 logging events and driving PMBus-style communication. The 172 available I/O handle fan control, hot-swap signaling, and LED fault indication, and the 23 x 23 mm 484-ball FBGA consolidates what would otherwise need an MCU, a CPLD, and a supervisor IC.
Empfohlen
Portable and Battery-Powered Instrumentation
Handheld and portable instruments benefit from the M7AFS600-FGG484's single-chip integration: the ARM CoreMP7 runs the user interface and data logging, the 600K-gate fabric implements the acquisition engine and digital signal conditioning, and Fusion's low-cost 130nm flash process keeps the device price near $274 in single units per LCSC's 2026-09-02 listing. Instant-on flash configuration matters in battery instruments because measurements are available the moment power is applied, with no configuration time penalty typical of SRAM FPGAs. The 172 user I/O connect displays, touch controls, and sensor front ends, while the mixed-signal blocks digitize battery voltage and temperature for fuel-gauging. Designers should budget the 1.5V core rail plus I/O bank supplies and exploit fabric clock gating to keep average current low in sleep-dominant duty cycles.
Empfohlen
Aerospace and Defense Secure Embedded Control
The M7AFS600-FGG484 suits defense and aerospace control electronics because flash-based configuration provides inherent resistance to configuration readback and bitstream cloning - a recognized security advantage over SRAM FPGAs - and because the fabric tolerates the single-event and total-dose environment better than deep-submicron SRAM alternatives of its era. The ARM CoreMP7 executes flight software while the 600K-gate fabric implements deterministic interfaces such as MIL-STD-1553-style protocols, discrete I/O, and safety interlocks across the 172 user I/O. Industrial-temperature variants (M7AFS600-FGG484I) extend the operating envelope beyond commercial ranges. Because the device powers up instantly from non-volatile memory, no external configuration flash is exposed on the flight board, simplifying TAM/SEU hardening and reducing component count in high-reliability single-string architectures.
Empfohlen
Embedded Networking and Communication Cards
Line cards, industrial Ethernet nodes, and bridge controllers use the M7AFS600-FGG484 where glue logic, a processor, and moderate datapath logic must coexist on one die. The 600K-gate fabric implements MAC wrappers, FIFOs, and bus bridges at up to the 1098.9 MHz internal rating cited by distributors, while the ARM CoreMP7 runs protocol stacks and management firmware. Flash configuration gives instant link availability after power-on, and configuration security protects proprietary firmware in network equipment deployed in the field. The 484-ball FBGA with 1 mm pitch offers 172 I/O for PHY interfaces, MDIO buses, LED banks, and backplane signaling, enabling a compact 23 x 23 mm footprint for dense rack hardware. Designers should follow the datasheet's bank voltage rules when mixing 3.3V, 2.5V, and 1.8V I/O standards across banks.
Empfohlen
Smart Medical and Lab Device Controllers
Benchtop medical devices and lab instruments adopt the M7AFS600-FGG484 to consolidate control, acquisition, and safety logic: the flash fabric enforces hardware interlocks (door sensors, emergency stop, over-range cutoff) with deterministic response independent of software state, a compliance-friendly property for device risk analysis. The ARM CoreMP7 handles the touch UI, protocol interfaces, and data export, while Fusion's analog monitors supply rails and sensor bias integrity. Instant-on operation means the instrument is ready the moment mains power is applied, and the non-volatile, secure configuration protects calibration and firmware IP. With 172 user I/O in a 23 x 23 mm FBGA, one chip replaces the typical MCU-plus-CPLD pair, shortening the BOM. The industrial-grade M7AFS600-FGG484I variant is recommended for designs targeting wide environmental margins.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für M7AFS600-FGG484 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | M7AFS600-FGG484I | M7AFS600-2FGG484I | M7AFS600-1FGG484I | M7AFS600-1FG484 | M1AFS600-FG484I | M1AFS1500-1FGG484I |
|---|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (FGG484), 23 x 23 x 2.44 mm | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FG484) - same footprint, leaded balls | 484-ball FBGA (FG484) - same footprint, leaded balls | 484-ball FBGA (FGG484) - same |
| Brand | Microchip Technology (Microsemi/Actel Fusion) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600 K | 600 K | 600 K | 600 K | 600 K | 600 K | 1500 K |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Ball Metallurgy | Pb-free (FGG) | Pb-free (FGG) | Pb-free (FGG) | Pb-free (FGG) | Standard (FG, leaded) | Standard (FG, leaded) | Pb-free (FGG) |
Wichtigste Unterscheidungsmerkmale
- Non-volatile flash fabric with no external configuration device (vs. SRAM FPGAs (e.g., Xilinx/Intel))
- Integrated ARM CoreMP7 hard processor saves a separate MCU (vs. A3P600-1FGG484I)
- Lead-free (FGG) balls for RoHS assembly (vs. M7AFS600-1FG484)
- Extended temperature availability (vs. M7AFS600-2FGG484I)
- Trade-off: moderate logic density (vs. M1AFS1500-1FGG484I)
Designhinweise
The M7AFS600-FGG484 requires a 1.5V core rail plus separate I/O bank supplies; sequence supplies per the Fusion datasheet power-up specification and hold I/O pins tri-stated until rails stabilize. Estimated: a 600K-gate flash fabric switching at moderate toggle rates typically draws hundreds of milliamps on the core rail, so budget a regulator with at least 50% headroom over your Libero power-calculator result and add bulk (100 uF) plus per-pin 0.1 uF decoupling at all supply balls.
The 1 mm pitch 484-ball FBGA (23 x 23 mm body) is routable with via-in-pad dog-bone escape on 0.15 mm drilled vias; a 6-layer stack (two dedicated ground planes) keeps I/O return paths short and manages the die's thermal path through the ball array. Provide at least 4 x 4 via arrays under the corner GND balls and connect them to a solid plane. Follow Microchip's Fusion PCB layout application note for ball-out escape routing patterns before finalizing footprint generation in your CAD tool.
Do not mix FGG and FG suffixes blindly: FGG devices use Pb-free balls requiring lead-free reflow profiles, while FG parts with standard balls suit Sn/Pb assembly - using an FGG part on a leaded profile or vice versa risks ball joint defects. Also, speed-grade suffixes matter: a standard-grade part cannot guarantee timing closure for a design implemented on the faster -1 grade (1.28205 GHz vs 1.0989 MHz-class ratings per Xecor). Always re-run Libero timing analysis after any suffix substitution.
With 172 user I/O on a 1 mm-pitch BGA, group fast-switching outputs (parallel buses, clock fanout) onto banks adjacent to GND balls and keep stub lengths under trace-rise-time fractions. Use series termination (estimated 22-33 ohm based on typical 3.3V CMOS output impedance) on clocks leaving the device, and reference switching signals to the adjacent ground plane to limit simultaneous-switching noise on the mixed-signal analog inputs that Fusion shares with the fabric.
Compliance-Informationen
Newark Electronics lists 'RoHS Compliant: Yes'; FGG suffix denotes Pb-free solder balls per Microchip Fusion ordering conventions. REACH, halogen-free, and conflict-minerals status not stated in provided data.
