A3P600-1FGG484I - 600K Gate Flash FPGA 235 I/O | Microchip
MPN: A3P600-1FGG484I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $118.5 | $118.50 |
| 10 | $108.2 | $1,082.00 |
| 100 | $96.4 | $9,640.00 |
| 500 | $87.9 | $43,950.00 |
| 1,000 | $79.6 | $79,600.00 |
Drop-in alternatives for A3P600-1FGG484I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3P600-1FGG484
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View Datasheet →A3P600-FGG484I
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View Datasheet →A3P600-2FGG484I
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View Datasheet →A3P600L-1FGG484I
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View Datasheet →A3P600L-FGG484I
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View Datasheet →A3P600L-1FG484I
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View Datasheet →A3P600-FG484I
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$25.4 / Unit
View Datasheet →A3P600-1FGG484I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3 |
| System Gates | 600000 |
| VersaTiles (D-flip-flops) | 13824 |
| User I/Os | 235 |
| Package | 484-ball FBGA (FGG484) |
| Speed Grade | -1 |
| Core Voltage | 1.5 V |
| Technology | 130 nm flash process |
| Logic Architecture | VersaTile (LUT / D-flip-flop / latch) |
| Configuration Memory | On-chip flash (nonvolatile, single chip) |
| System Performance | Up to approx. 231 MHz (per Utmel family comparison) |
| I/O Banks | 4 (A3P600 per Microchip migration note) |
| Operating Temperature | Industrial (-40C to +100C), I suffix |
| Mounting Type | Surface Mount |
| Reprogrammability | Live reprogrammable (in-system) |
A3P600-1FGG484I 484-ball fbga (fgg484) Pin Configuration Guide
Complete pinout information for A3P600-1FGG484I (484-ball fbga (fgg484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3P600-1FGG484I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3P600-1FGG484I is suitable for 6 applications: Industrial Automation Control, Military and Aerospace Subsystems, Medical Instrumentation, Communications Bridge Logic, Secure Embedded Control, Test and Measurement Equipment.
Industrial Automation Control
The A3P600-1FGG484I fits industrial automation control because its 600k system gates and 235 user I/Os provide enough logic and connectivity for PLC I/O scanning, motor interface bridging, and sensor aggregation in one device. The industrial temperature rating of -40C to +100C covers factory-floor and outdoor cabinet environments, while instant-on flash configuration means the controller is live the moment power is applied, eliminating configuration boot delay that SRAM FPGAs introduce. The four independent VCCIB banks allow 3.3V, 2.5V, and 1.8V I/O standards to coexist, simplifying interfacing with legacy 5V-tolerant-adjacent logic families and modern low-voltage peripherals. Placed as the deterministic glue between a host CPU and field I/O, the A3P600-1FGG484I adds no operating-system jitter and its approximately 231 MHz system performance headroom covers most sequencing and protocol-bridging tasks.
Recommended
Military and Aerospace Subsystems
Military and aerospace subsystems benefit from the A3P600-1FGG484I's on-chip flash configuration, which keeps the bitstream off the external bus and inherently resistant to readback attacks, a key reason ProASIC3 parts are positioned for defense applications by Microchip. The industrial -40C to +100C rating supports uncooled avionics bays and ground systems, and instant power-up matters in missions with strict time-to-ready requirements. With 600k gates and 13,824 VersaTiles, the device implements interface protocols, bus bridging, and signal preprocessing, while 235 user I/Os connect to mixed-voltage backplanes through four independent VCCIB banks. The flash fabric also shows deterministic single-event behavior relative to SRAM alternatives in many low-earth-orbit scenarios, though mission-specific radiation assessment remains the designer's responsibility per Microchip application guidance.
Recommended
Medical Instrumentation
Medical instrumentation such as patient monitors, diagnostic analyzers, and imaging front ends uses the A3P600-1FGG484I as deterministic control and data-path logic. The instant-on flash configuration ensures the instrument is operational immediately at power-up, important for devices with rapid startup expectations and for safety logic that must be active before a host processor boots. Its 235 user I/Os handle sensor arrays, touch panels, and communication interfaces, and the four independently supplied I/O banks allow clean separation of noisy digital domains from sensitive analog-adjacent control signals. Because the configuration is nonvolatile and secure on-chip, patient-data-handling hardware benefits from reduced bitstream exposure. The -1 speed grade at up to approximately 231 MHz comfortably covers typical acquisition sequencing and preprocessing rates while keeping power and cost below faster-binned equivalents.
Recommended
Communications Bridge Logic
In communications equipment, the A3P600-1FGG484I serves as bridge and glue logic between line cards, backplanes, and management controllers. The 600k-gate fabric implements multiple protocol interfaces concurrently, and approximately 231 MHz of system performance covers common link-layer tasks on the -1 speed grade. The four VCCIB banks let designers mix 3.3V legacy PHY interfaces with 1.8V or 2.5V modern serial-adjacent control signals on one chip, eliminating level-shifters and their latency. Instant-on flash configuration means links initialize without waiting for a bitstream load from external memory, reducing link-recovery time after power events, which matters in carrier infrastructure availability targets. The 484-ball FGG484 package provides the 235 usable I/Os needed for wide parallel buses and dense control planes in rack-mounted equipment.
Recommended
Secure Embedded Control
Secure embedded control systems, including encryption-key holders, anti-tamper controllers, and secure boot companions, exploit the A3P600-1FGG484I's on-chip flash configuration. Unlike SRAM FPGAs that expose the configuration bitstream on an external bus at every power-up, the ProASIC3 fabric is programmed through charge-trapping flash cells on the die itself, dramatically reducing interception opportunities. The device operates instantly, so secure state machines enforcing power-good and tamper-detect sequencing can be active before other system elements come alive. With 600k gates, designers can implement symmetric ciphers, hash functions, and stateful monitors alongside control logic, and 235 I/Os connect sensors, switches, and alert paths across four voltage banks. Per Microchip product positioning, low total cost of ownership and single-chip operation further reduce the physical attack surface of the bill of materials.
Recommended
Test and Measurement Equipment
Bench and modular test instruments use the A3P600-1FGG484I for timing generation, trigger routing, and interface adaptation. The 13,824 VersaTiles implement counters, delay lines, and pattern generators deterministically, and the -1 speed grade supports trigger pipelines well within its approximately 231 MHz fabric capability. The industrial -40C to +100C rating covers uncalibrated storage and transport conditions, while instant-on configuration ensures the instrument front end is controllable the moment power is applied, simplifying self-test sequencing. The 235 user I/Os fan out to relay banks, ADC control buses, and host interfaces (USB, LAN module bridges), and four independent VCCIB banks isolate noisy switching domains from precision timing I/O. Compared with an SRAM FPGA plus configuration flash, the single-chip flash solution reduces the instrument BOM and removes a field-update failure mode tied to external config memory corruption.
Recommended
Recommended Products Summary
Engineering reference data for A3P600-1FGG484I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3P600-1FGG484 | A3P600-FGG484I | A3P600-2FGG484I | A3P600L-1FGG484I |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (FGG484) | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same | 484-ball FBGA (FGG484) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| User I/Os | 235 | 235 | 235 | 235 | 235 |
| Speed Grade | -1 | -1 | Standard | -2 (faster) | -1 |
| Temperature Range | Industrial (-40C to +100C) | Commercial | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Configuration Memory | On-chip flash (nonvolatile) | On-chip flash (nonvolatile) | On-chip flash (nonvolatile) | On-chip flash (nonvolatile) | On-chip flash (nonvolatile) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V (low-power process) |
| Unit Price (qty 1, as of 2026-09-01) | $118.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Instant-on single-chip nonvolatile configuration (vs A2F500M3G-1FGG484I (SmartFusion))
- Cost-optimized -1 speed grade (vs A3P600-2FGG484I)
- Industrial temperature qualification (vs A3P600-1FGG484)
- Trade-off: higher static power than low-power variant (vs A3P600L-1FGG484I)
Design Notes
The A3P600-1FGG484I requires a 1.5V core supply plus separate VCCIBx supplies for each of its four I/O banks. Estimated: total power is dominated by dynamic switching and I/O loading; use Microchip's ProASIC3 power calculator in Libero SoC with your actual toggle rates rather than rule-of-thumb estimates. Sequence core and I/O rails per the datasheet power-up specification to avoid latch-up paths, and decouple each VCCIB bank locally with at least 10uF bulk plus 0.1uF ceramic capacitors placed at the bank supply balls.
Plan I/O bank assignment before routing: only I/Os with compatible voltage standards may share a VCCIB bank, per the Microchip migration application note which states 'package VCCIBx pins are routed through the corresponding banks of the devices' and that only compatible standards may be assigned to the same bank. Obtain the exact 484-ball ball map from the official Microchip ProASIC3 datasheet and lock your pin constraints in Libero SoC early, because changing a bank voltage after routing forces a PCB respin.
Estimated: a 484-ball FBGA with a 1.5V core dissipates modest heat at typical -1 speed-grade utilization; still, verify junction temperature using the theta-JA value from the datasheet package thermal table with your actual airflow. For conduction-cooled enclosures typical of defense builds, bond the board to a cold plate and confirm the die-junction-to-board resistance from the datasheet rather than assuming still-air values.
Do not substitute the commercial-temperature A3P600-1FGG484 into a design validated at -40C; only the I-suffix industrial parts cover the full industrial range. Conversely, upgrading from A3P600-1FGG484I to A3P600-2FGG484I improves timing margins but changes I/O timing parameters, so re-run I/O timing checks in Libero. Finally, the -1 part is carried by limited distribution (Octopart lists 1 distributor for this suffix), so secure production stock early.
Compliance Information
Compliance status not stated in retrieved data. Microchip ProASIC3 parts are generally RoHS-compliant in current FGG (lead-free ball) suffixes, but verify on the official Microchip product page before relying on this. Note: FGG vs FG suffixes may indicate lead-free (Green) packaging differences.
