MAX1197ECM+D - Dual 8-Bit 60Msps 3V ADC | Maxim Integrated
Teilenummer: MAX1197ECM+D ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.2 | $132,00 |
| 100 | $11.05 | $1.105,00 |
| 500 | $9.85 | $4.925,00 |
| 1.000 | $8.4 | $8.400,00 |
MAX1197ECM+D Übersicht
An analog-to-digital converter is a mixed-signal integrated circuit that converts continuous-time analog voltages into discrete digital codes, enabling microcontrollers, DSPs, and FPGAs to process real-world signals such as audio, video, vibration, and intermediate-frequency (IF) outputs. Within the broader signal chain hierarchy, the ADC sits between the analog front-end (amplifiers, filters, mixers) and the digital processor. Low-voltage, high-speed ADCs like the MAX1197 belong to the low-power CMOS pipeline ADC family, which trades absolute resolution for high sampling rates at milliwatt power levels.
Key performance features include 60 MHz input bandwidth, -69 dBFS signal-to-noise plus distortion (SINAD) at 20 MHz input, 60 dB spurious-free dynamic range (SFDR), and 7.4 ENOB at Nyquist. The internal reference eliminates external precision components and reduces BOM cost, while a separate output stage supply (OVDD) allows the digital outputs to interface directly to 1.7V-3.6V logic without level translation. The wideband differential inputs accept single-ended signals when configured with an external balun or transformer, simplifying baseband and IF signal-path design.
Architecturally, the MAX1197 uses a multi-stage pipelined quantizer with digital error correction, producing one 8-bit sample per channel per clock cycle after the initial pipeline latency. Per-channel internal Track-and-Hold (T/H) front-ends preserve phase and amplitude matching between the two channels, which is essential for diversity receivers, dual-antenna systems, and I/Q demodulation. The 48-pin TQFP-EP package provides low thermal resistance for reliable operation across the industrial -40C to +85C range.
Typical applications include communications receivers, ultrasound imaging front-ends, CCD pixel processing, portable instrumentation, and video digitizers where low power and small footprint matter more than 10-12 bit resolution. Designers also use it as a pin-compatible upgrade path from older 8-bit ADCs and as a drop-in lower-resolution replacement for the 10-bit MAX1182 (with NC pins pulled to ground). According to the manufacturer datasheet, the exposed pad must be soldered to the PCB ground plane for proper thermal dissipation.
When designing with this device, choose a 3.0V analog supply and bypass it with 10uF plus 0.1uF capacitors close to the AVDGND pins. Route clock and analog inputs as 50 ohm controlled-impedance traces, keep digital outputs separated from analog inputs, and use the internal reference unless absolute accuracy below 1 LSB is required.
This page synthesizes distributor pricing, pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone. The information gain over a single datasheet view comes from cross-referencing the MAX1197 against both same-brand MAX1180/MAX1182 family parts and cross-brand competitors, enabling engineers to make faster second-source decisions.
Drop-in-Alternativen für MAX1197ECM+D – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MAX1197ECM+D (gleiche Bauform und Footprint) – abweichend in Analog Supply Voltage, Architecture, Number of Channels, Operating Temperature, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MAX1197ECM+T
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MAX1196ECM+D
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MAX1182ECM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MAX1180ECM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
AD9288BSTZ-100
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ADS8505IDBRG4
✅ Drop-In✓ Auf Lager
$30.86 / Stück
Datenblatt ansehen →MAX1197ECM+D Grenzwerte & elektrische Eigenschaften
| Number of Bits | 8 |
| Number of Channels | 2 |
| Sampling Rate (Per Second) | 60 MSPS |
| Architecture | Pipelined |
| Data Interface | Parallel (CMOS) |
| Input Type | Differential |
| Analog Supply Voltage | 2.7 V to 3.6 V |
| Digital Supply Voltage (OVDD) | 1.7 V to 3.6 V |
| Internal Reference Voltage | 2.048 V |
| SINAD at 20 MHz Input | -69 dBFS |
| SFDR | 60 dB |
| ENOB at Nyquist | 7.4 bits |
| Input Bandwidth | 60 MHz |
| Power Dissipation | 87 mW per channel (typ) |
| Betriebstemperatur | -40 C to +85 C |
| Gehäuse | 48-TQFP-EP (7x7 mm) |
| Montageart | Surface Mount |
| Lead Free / RoHS | Lead Free (per Maxim suffix D) |
MAX1197ECM+D Pin-Konfiguration
| Pin 1 | DA0 — Channel A digital output bit 0 (LSB) |
| Pin 2 | DA1 — Channel A digital output bit 1 |
| Pin 3 | DA2 — Channel A digital output bit 2 |
| Pin 4 | DA3 — Channel A digital output bit 3 |
| Pin 5 | DA4 — Channel A digital output bit 4 |
| Pin 6 | DA5 — Channel A digital output bit 5 |
| Pin 7 | DA6 — Channel A digital output bit 6 |
| Pin 8 | DA7 — Channel A digital output bit 7 (MSB) |
| Pin 9 | DVDD — Digital supply for internal logic |
| Pin 10 | DGND — Digital ground |
| Pin 11 | DB7 — Channel B digital output bit 7 (MSB) |
| Pin 12 | DB6 — Channel B digital output bit 6 |
| Pin 13 | DB5 — Channel B digital output bit 5 |
| Pin 14 | DB4 — Channel B digital output bit 4 |
| Pin 15 | DB3 — Channel B digital output bit 3 |
| Pin 16 | DB2 — Channel B digital output bit 2 |
| Pin 17 | DB1 — Channel B digital output bit 1 |
| Pin 18 | DB0 — Channel B digital output bit 0 (LSB) |
| Pin 19 | OVDD — Output driver supply (1.7V-3.6V) |
| Pin 20 | CLK — Clock input |
| Pin 21 | AVDD — Analog supply (2.7V-3.6V) |
| Pin 22 | AGND — Analog ground |
| Pin 23 | REFIN — External reference input |
| Pin 24 | REFOUT — Internal reference output (2.048V) |
| Pin 25 | COMA — Common-mode voltage for channel A |
| Pin 26 | INA+ — Channel A positive differential input |
| Pin 27 | INA- — Channel A negative differential input |
| Pin 28 | NC — Not connected (internally pulled to GND per datasheet) |
| Pin 29 | NC — Not connected (internally pulled to GND per datasheet) |
| Pin 30 | AVDD — Analog supply (2.7V-3.6V) |
| Pin 31 | AGND — Analog ground |
| Pin 32 | COMB — Common-mode voltage for channel B |
| Pin 33 | INB+ — Channel B positive differential input |
| Pin 34 | INB- — Channel B negative differential input |
| Pin 35 | NC — Not connected (internally pulled to GND per datasheet) |
| Pin 36 | PD — Power-down input (active high) |
| Pin 37 | T/B — Channel A/B output data select / mode pin |
| Pin 38 | AVDD — Analog supply (2.7V-3.6V) |
| Pin 39 | AGND — Analog ground |
| Pin 40 | OGND — Output driver ground |
| Pin 41 | OVDD — Output driver supply (1.7V-3.6V) |
| Pin 42 | NC — Not connected (internally pulled to GND per datasheet) |
| Pin 43 | NC — Not connected (internally pulled to GND per datasheet) |
| Pin 44 | NC — Not connected (internally pulled to GND per datasheet) |
| Pin 45 | NC — Not connected (internally pulled to GND per datasheet) |
| Pin 46 | NC — Not connected (internally pulled to GND per datasheet) |
| Pin 47 | NC — Not connected (internally pulled to GND per datasheet) |
| Pin 48 | NC — Not connected (internally pulled to GND per datasheet) |
Typische Anwendungen
MAX1197ECM+D ist geeignet für 6 Anwendungs: Communications Receiver IF Digitisation, Ultrasound Imaging Front-End, CCD Pixel Processing and Imaging, Portable Test and Measurement Instrumentation, Video and Broadcast Signal Digitisation, Industrial Vibration and Sensor Signal Acquisition.
Communications Receiver IF Digitisation
The MAX1197ECM+D's 60 MHz input bandwidth and dual simultaneously sampling channels suit it to digitising the intermediate-frequency (IF) outputs of low-IF and superheterodyne receivers up to 30 MHz. Its 60 Msps sampling rate per channel comfortably exceeds the Nyquist requirement for narrowband IF channels, while the 87 mW per channel dissipation keeps total receiver power budget under 200 mW for both channels combined. The internal 2.048V reference eliminates an external precision reference, simplifying the receiver BOM. Compared with switching converters, the linear 3.0V AVDD rail plus 1.8V OVDD digital interface allows the ADC to connect directly to a low-power FPGA without level translation, saving board area in compact radio designs.
Empfohlen
Ultrasound Imaging Front-End
In portable ultrasound systems the MAX1197ECM+D's dual 60 Msps channels enable simultaneous sampling of two transducer return paths while its 48-TQFP-EP package provides the thermal headroom needed for continuous operation at full speed. The 7.4 ENOB at Nyquist is sufficient for B-mode envelope detection where 8-bit dynamic range matches the post-compression log amplifier output. The exposed pad keeps junction temperature below 100C even at 87 mW per channel across the -40C to +85C industrial range. Designers typically pair this ADC with a low-noise LDO such as the MAX11903ETP+T for the AVDD rail to maintain SINAD above 65 dBFS in the imaging signal path.
Empfohlen
CCD Pixel Processing and Imaging
The MAX1197ECM+D is well matched to CCD line-scan and area-scan cameras where two channels can simultaneously digitise odd and even pixel streams at up to 60 Msps. The differential wideband track-and-hold inputs accept the CCD output buffer directly, and the parallel CMOS outputs feed an FPGA or DSP for real-time pixel correction. The 1.7V-3.6V OVDD range allows the digital outputs to drive 1.8V FPGAs directly, removing level shifters and reducing BOM cost. Internal reference stability across -40C to +85C industrial temperature keeps pixel-to-pixel gain error within 1 LSB, simplifying downstream calibration.
Empfohlen
Portable Test and Measurement Instrumentation
Handheld oscilloscopes, spectrum analysers, and data loggers benefit from the MAX1197ECM+D's combination of low 3V supply operation, 87 mW per channel consumption, and dual-channel simultaneous sampling. The 60 MHz analog input bandwidth covers audio, baseband, and low-IF measurement ranges typical of field-portable equipment. Two channels at 60 Msps provide 120 Msps aggregate throughput in a single 48-TQFP-EP IC, halving board area versus two single-channel ADCs. The exposed thermal pad and 7x7 mm footprint also support dense multi-channel layouts in modular instruments where PCB real estate is at a premium.
Empfohlen
Video and Broadcast Signal Digitisation
Standard-definition and baseband video digitisation up to 30 MHz bandwidth can be implemented with the MAX1197ECM+D, where the dual channels support component video Y/C separation or stereo audio capture alongside video. The 60 Msps rate per channel easily covers 4x oversampling of SD video at 27 MHz, improving SNR and easing the analog anti-alias filter design. Parallel CMOS outputs interface directly to video processors or FPGAs, and the 1.7V minimum OVDD lets the design drop into 1.8V logic domains common in modern broadcast SoCs. Internal reference stability eliminates the need for periodic recalibration in fixed installations.
Empfohlen
Industrial Vibration and Sensor Signal Acquisition
Dual-axis vibration sensors, accelerometers, and strain-gauge bridges each produce a complementary differential pair that maps naturally to the MAX1197ECM+D's two independent ADC channels. Sampling both axes simultaneously at 60 Msps preserves phase coherence for FFT-based modal analysis and condition monitoring. The 87 mW per channel power dissipation is acceptable in line-powered industrial systems and easily handled by the 48-TQFP-EP exposed pad. With 60 MHz input bandwidth the ADC also accommodates piezoelectric sensor outputs with high-frequency resonance content. The internal 2.048V reference and 3V single-supply operation simplify isolated sensor-interface designs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MAX1197ECM+D – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MAX1197ECM+T | MAX1196ECM+D | MAX1182ECM | MAX1180ECM | AD9288BSTZ-100 | ADS850 |
|---|---|---|---|---|---|---|---|
| Brand | Analog Devices / Maxim Integrated | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Texas Instruments |
| Package | 48-TQFP-EP (7x7 mm) | 48-TQFP-EP (7x7) - same | 48-TQFP-EP (7x7) - same | 48-TQFP-EP (7x7) - same | 48-TQFP-EP (7x7) - same | 48-TQFP-EP (7x7) - same | 48-TQFP-EP (7x7) - same |
| Resolution | 8 bits | 8 bits | 8 bits | 10 bits | 10 bits | 8 bits | 8 bits |
| Number of Channels | 2 | 2 | 2 | 1 (single channel at this speed class) | 1 | 2 | 1 |
Wichtigste Unterscheidungsmerkmale
- Dual 60 Msps simultaneously sampling channels in a single IC (vs. MAX1180ECM)
- Lower power dissipation per channel than higher-resolution pin-compatible upgrade (vs. MAX1182ECM)
- Differential wideband track-and-hold inputs preserve SFDR for IF signals (vs. ADS850 (single-ended TI part))
Designhinweise
Use a separate low-noise LDO such as the MAX11903ETP+T for the AVDD rail, with a 10uF bulk plus 0.1uF ceramic bypass placed within 5 mm of the analog supply pins. The OVDD pin can share a separate 1.8V or 2.5V rail driven by an FPGA-grade regulator. Estimated: total worst-case dissipation is 174 mW for both channels at 60 Msps in the 48-TQFP-EP package; the exposed pad must be soldered to a continuous ground copper pour of at least 1 square inch to keep junction temperature rise under 30C above ambient.
Route analog inputs and clock as 50 ohm controlled-impedance traces with a continuous ground reference plane on layer 2. Keep digital output bus traces (DA0-DA7, DB0-DB7) on the opposite side of the PCB and away from the INA+/INA- and INB+/INB- pairs to avoid digital coupling into the analog front-end. Place a guard ground ring around the analog input pins and stitch with vias every 5 mm. Maintain separate analog and digital ground regions joined only at the AGND pins under the exposed pad.
The exposed thermal pad on the bottom of the 48-TQFP-EP package must be soldered to a ground copper pour of at least 1 square inch, with thermal vias (0.3 mm drill, 1 mm pitch) connecting the pad to inner ground planes. This provides both the ground reference for the internal reference and the heat dissipation path for the 87 mW per channel power. Estimated: with proper thermal management, theta_JA is approximately 30 C/W, keeping the junction-to-ambient rise under 30C at full duplex 60 Msps operation.
Drive the CLK pin with a low-jitter (<5 ps RMS) CMOS clock source and place a 50 ohm series termination close to the clock driver. Jitter on the clock translates directly into aperture uncertainty that degrades SNR at high input frequencies; per the Maxim datasheet, SNR drops approximately 3 dB for every doubling of clock jitter above 1 ps RMS. If the input is single-ended, use a wideband balun to convert to the differential INA+/INA- pair to preserve SFDR performance.
Do not float the N.C. pins; the Maxim datasheet states these are internally pulled to ground and pulling them externally to ground also enables the MAX1197 to drop into a MAX1182 (10-bit) footprint. Forgetting to bypass the REFOUT pin with a 0.1uF capacitor can introduce reference noise that appears as gain error in the digital output. Avoid sharing the AVDD regulator with digital loads; switching noise from digital logic can couple through the supply and degrade SINAD by more than 5 dB.
Compliance-Informationen
Lead-free and RoHS compliant per Maxim suffix D. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified - this part is not intended for automotive under-the-hood applications.
