MAX1198ECM+TDG05 - Dual 8-Bit 100MSPS ADC, 3.3V | Analog Devices
Teilenummer: MAX1198ECM+TDG05 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $24.5 | $24,50 |
| 10 | $22.05 | $220,50 |
| 100 | $19.6 | $1.960,00 |
| 500 | $17.4 | $8.700,00 |
| 1.000 | $15.3 | $15.300,00 |
MAX1198ECM+TDG05 Übersicht
An analog-to-digital converter (ADC) is a mixed-signal integrated circuit that converts real-world analog voltages into discrete digital codes for processing by microcontrollers, DSPs, or FPGAs. The MAX1198 belongs to the high-speed, low-power dual pipeline ADC category within the data-converter hierarchy (ADC -> data converter -> signal chain IC -> mixed-signal semiconductor), and is typically used to digitize baseband I/Q or color-difference component signals in image and video pipelines.
Key differentiating features include 100 MSPS guaranteed sampling rate on both channels simultaneously, two fully differential wideband T/H front ends optimized for IF sampling, an internal 2.048 V precision reference that eliminates external reference components, CMOS-compatible parallel outputs for direct FPGA/ASIC connection, and an exposed thermal pad (EP) on the 48-TQFP package that lowers junction-to-ambient thermal resistance for reliable continuous operation.
Architecturally, the MAX1198 uses a pipelined multi-stage conversion core with internal digital error correction, allowing low-latency operation suitable for real-time signal acquisition. The internal reference is bandgap-derived and trimmed for low drift; combined with differential inputs and wideband T/H front ends, the ADC achieves ENOB and SFDR figures suitable for instrumentation, digital communication, and imaging applications.
Typical applications include CCD/CIS image sensor digitizers, digital oscilloscope front ends, IF/baseband sampling in communications receivers, medical imaging pre-processing, and portable test-and-measurement instruments. The wide 7 mm body keeps the part footprint compatible with dense multi-channel data acquisition cards.
When designing with this device, pay attention to analog input common-mode and differential drive impedance to maximize SFDR, and provide a solid ground plane plus local 0.1 uF + 10 uF decoupling near the AVDD pins. The exposed pad on the TQFP package must be soldered to the PCB ground plane to meet the datasheet thermal performance and ensure specified linearity.
This page synthesizes distributor pricing, drop-in alternatives drawn from Maxim family variants, and practical design notes not collected in the manufacturer datasheet alone.
Drop-in-Alternativen für MAX1198ECM+TDG05 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MAX1198ECM+TD
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MAX1198ECM+D
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MAX1198ECM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MAX1180ECM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MAX1198ECM+TDG05 Grenzwerte & elektrische Eigenschaften
| Auflösung | 8 bit |
| Number of Channels | 2 (dual) |
| Abtastrate | 100 MSPS |
| Architecture | Pipelined |
| Input Type | Fully differential, wideband track-and-hold |
| Versorgungsspannung | 3.3 V (3.0 V to 3.6 V) |
| Power Consumption | 264 mW (typical) |
| Internal Reference | Yes (2.048 V) |
| Output Interface | Parallel CMOS-compatible |
| Number of Inputs | 2 |
| Number of ADC Cores | 2 |
| Gehäuse | 48-TQFP-EP (7x7 mm) |
| Betriebstemperatur | -40 C to +85 C (industrial) |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Pin-Anzahl | 48 |
MAX1198ECM+TDG05 Pin-Konfiguration
| Pin 1 | IN1A+ — Channel 1 positive differential analog input |
| Pin 2 | IN1A- — Channel 1 negative differential analog input |
| Pin 3 | COMA — Channel 1 common-mode voltage bypass |
| Pin 4 | REFA — Channel 1 reference bypass |
| Pin 5 | AVDD — Analog supply voltage (3.3 V) |
| Pin 6 | AVSS — Analog ground |
| Pin 7 | IN2A+ — Channel 2 positive differential analog input |
| Pin 8 | IN2A- — Channel 2 negative differential analog input |
| Pin 9 | COMB — Channel 2 common-mode voltage bypass |
| Pin 10 | REFB — Channel 2 reference bypass |
| Pin 11 | DRVDD — Digital output driver supply |
| Pin 12 | DRVSS — Digital output driver ground |
| Pin 13 | D0A — Channel 1 digital output bit 0 (LSB) |
| Pin 14 | D1A — Channel 1 digital output bit 1 |
| Pin 15 | D2A — Channel 1 digital output bit 2 |
| Pin 16 | D3A — Channel 1 digital output bit 3 |
| Pin 17 | D4A — Channel 1 digital output bit 4 |
| Pin 18 | D5A — Channel 1 digital output bit 5 |
| Pin 19 | D6A — Channel 1 digital output bit 6 |
| Pin 20 | D7A — Channel 1 digital output bit 7 (MSB) |
| Pin 21 | D0B — Channel 2 digital output bit 0 (LSB) |
| Pin 22 | D1B — Channel 2 digital output bit 1 |
| Pin 23 | D2B — Channel 2 digital output bit 2 |
| Pin 24 | D3B — Channel 2 digital output bit 3 |
| Pin 25 | D4B — Channel 2 digital output bit 4 |
| Pin 26 | D5B — Channel 2 digital output bit 5 |
| Pin 27 | D6B — Channel 2 digital output bit 6 |
| Pin 28 | D7B — Channel 2 digital output bit 7 (MSB) |
| Pin 29 | OEA — Channel 1 output enable |
| Pin 30 | OEB — Channel 2 output enable |
| Pin 31 | CLK — Conversion clock input |
| Pin 32 | CLKDUTY — Clock duty-cycle adjust |
| Pin 33 | REFP — Internal reference positive bypass |
| Pin 34 | REFN — Internal reference negative bypass |
| Pin 35 | REFOUT — Internal reference output (2.048 V) |
| Pin 36 | REFIN — External reference input (bypass for internal ref) |
| Pin 37 | PD — Power-down (active high) |
| Pin 38 | RESET — Digital reset |
| Pin 39 | T/B — Output mode select: top/bottom binary |
| Pin 40 | GND — Digital ground |
| Pin 41 | DVDD — Digital supply voltage (3.3 V) |
| Pin 42 | DVSS — Digital ground |
| Pin 43 | NC — Not connected (internally pulled to ground per datasheet) |
| Pin 44 | NC — Not connected (internally pulled to ground per datasheet) |
| Pin 45 | NC — Not connected (internally pulled to ground per datasheet) |
| Pin 46 | NC — Not connected (internally pulled to ground per datasheet) |
| Pin 47 | NC — Not connected (internally pulled to ground per datasheet) |
| Pin 48 | NC — Not connected (internally pulled to ground per datasheet) |
| Pin 49 | EP — Exposed thermal pad - solder to PCB ground |
Typische Anwendungen
MAX1198ECM+TDG05 ist geeignet für 6 Anwendungs: CCD / CIS Image Sensor Digitizer, IF / Baseband Sampling in Communications Receivers, Portable Digital Oscilloscope Input Channel, Ultrasound Beamformer Front-End, Industrial Data Acquisition Module, Radar / Lidar Pulse Capture.
CCD / CIS Image Sensor Digitizer
The MAX1198ECM+TDG05 fits CCD/CIS image sensor digitization because its two fully differential wideband T/H inputs simultaneously sample the two color-difference component outputs of CCD or CIS imagers at up to 100 MSPS per channel, capturing full-resolution video frames in a single pass. With 8-bit resolution and an internal 2.048 V reference, the part eliminates an external reference component, reducing BOM and PCB area for compact camera modules. Its 264 mW typical power at 3.3 V keeps thermal rise manageable in sealed optical assemblies. Placed between the CCD output drivers and the FPGA image pipeline, the ADC provides parallel CMOS data the FPGA can capture without an external serializer, simplifying the FPGA I/O budget versus LVDS-output ADCs.
Empfohlen
IF / Baseband Sampling in Communications Receivers
The MAX1198ECM+TDG05 is suitable for IF/baseband sampling in communications receivers because its wideband differential track-and-hold can digitize intermediate-frequency signals up to approximately 100 MHz with 8-bit resolution, enabling direct-IF digitization that moves the ADC closer to the antenna. Its 3.3 V single-supply operation simplifies power-tree design in portable handset or base-station receiver cards, and the internal precision reference holds SFDR stable across temperature. With two channels, the part captures both I and Q simultaneously, supporting quadrature demodulation in software-defined radio and digital receiver architectures. Power dissipation at 264 mW is acceptable for chassis-mounted receiver cards with airflow.
Empfohlen
Portable Digital Oscilloscope Input Channel
The MAX1198ECM+TDG05 is a strong fit for portable digital oscilloscope input channels where dual 100 MSPS conversion at 8-bit resolution enables 200 MSPS equivalent single-channel time-interleaved sampling when two ADCs are cascaded or for two simultaneous probe channels at full speed. The 48-TQFP-EP 7 mm x 7 mm package keeps the front-end compact, freeing PCB area for the FPGA capture memory and display driver. The exposed thermal pad lowers junction-to-ambient resistance, allowing continuous sampling without thermal shutdown in lab instruments. Its parallel CMOS outputs integrate directly with mid-range FPGAs used in entry-level oscilloscope designs without requiring an LVDS deserializer.
Empfohlen
Ultrasound Beamformer Front-End
The MAX1198ECM+TDG05 supports ultrasound beamformer front ends because its dual-channel 100 MSPS conversion captures two adjacent transducer element signals in parallel, supporting phased-array beam steering in mid-range diagnostic ultrasound carts. The fully differential inputs reject common-mode noise from long coaxial probe cables, while the internal precision reference ensures channel-to-channel gain matching critical for accurate beamforming. Its 264 mW per channel power is acceptable for 32 to 64-channel carts with proper thermal design. Parallel CMOS outputs feed the FPGA delay-and-sum beamforming engine without serializer latency, enabling real-time imaging at clinically useful frame rates.
Empfohlen
Industrial Data Acquisition Module
The MAX1198ECM+TDG05 suits industrial data acquisition modules because its dual 8-bit 100 MSPS conversion handles two high-speed sensor signals simultaneously, such as vibration and position feedback in servo drives. The wideband differential inputs reject industrial electrical noise common on factory floors, and the internal 2.048 V reference avoids calibration drift over industrial temperature ranges of -40 C to +85 C. Industrial-grade temperature rating and a small 48-TQFP-EP 7x7 mm footprint allow dense multi-channel acquisition cards in PLC and motion-control chassis. The parallel CMOS outputs interface directly with industrial FPGAs and microcontrollers for closed-loop control loops.
Empfohlen
Radar / Lidar Pulse Capture
The MAX1198ECM+TDG05 captures radar and lidar return pulses because its dual 100 MSPS 8-bit conversion can digitize two baseband return channels at high sample rates, enabling accurate pulse-shape analysis in automotive and industrial ranging systems. The wideband differential T/H preserves fast-rising pulse edges, and the 3.3 V single-supply operation eases power-tree design in 12 V or 24 V vehicle systems after the front-end buck regulator. Two channels capture both the I and Q return paths in a coherent radar receiver, supporting Doppler velocity extraction in firmware. The 48-TQFP-EP package with exposed pad supports thermally demanding continuous-scan lidar applications.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MAX1198ECM+TDG05 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MAX1198ECM+TD | MAX1198ECM+D | MAX1198ECM | MAX1180ECM |
|---|---|---|---|---|---|
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Package | 48-TQFP-EP (7x7 mm) | 48-TQFP-EP (7x7 mm) - same | 48-TQFP-EP (7x7 mm) - same | 48-TQFP-EP (7x7 mm) - same | 48-TQFP-EP (7x7 mm) - same |
| Resolution | 8 bit | 8 bit | 8 bit | 8 bit | 10 bit (+25%) |
| Sampling Rate | 100 MSPS | 100 MSPS | 100 MSPS | 100 MSPS | 105 MSPS |
| Number of Channels | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Internal Reference | Yes (2.048 V) | Yes (2.048 V) | Yes (2.048 V) | Yes (2.048 V) | Yes |
| Input Type | Differential T/H | Differential T/H | Differential T/H | Differential T/H | Differential T/H |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Wichtigste Unterscheidungsmerkmale
- Pin-compatible 10-bit upgrade path on same footprint (vs. MAX1180ECM)
- Integrated 2.048 V internal precision reference (vs. MAX1198ECM (no suffix))
- Dual fully differential wideband T/H on 48-TQFP-EP (vs. MAX1198ECM+TD)
Designhinweise
Place 0.1 uF ceramic decoupling capacitors as close as possible to each AVDD, DVDD, and DRVDD pin, with a shared 10 uF bulk tantalum or ceramic capacitor on each supply rail. Use a solid uninterrupted ground plane under the ADC and avoid routing digital output traces beneath the analog input pins or the exposed thermal pad. The exposed pad (EP) on the 48-TQFP-EP MUST be soldered to the PCB ground plane with multiple thermal vias to meet specified AC electrical performance.
Drive the analog inputs with a fully differential source impedance below 100 ohm to preserve SFDR at 100 MSPS. Use controlled-impedance differential traces (typically 100 ohm differential) from the input driver to the INxA+/INxA- pins, and place the COMA and COMB common-mode bypass capacitors immediately adjacent to the IC. The CLK trace must be routed with 50 ohm controlled impedance and kept away from analog input traces to avoid coupling conversion-clock noise into the analog front end.
The MAX1198 N.C. pins are internally pulled to ground, which allows the part to be a drop-in replacement for the 10-bit MAX1180 per the manufacturer datasheet. If a customer requires 10-bit dynamic range, populating the MAX1180 in a MAX1198 socket or footprint provides an upgrade path without PCB rework. For 8-bit applications, both parts are interchangeable.
Estimated: at full 100 MSPS dual-channel operation with 3.3 V supply, the MAX1198ECM+TDG05 dissipates approximately 264 mW (per Analog Devices datasheet typical figure). On a 4-layer JEDEC-standard test PCB the junction-to-ambient theta_JA is approximately 35 C/W, yielding a junction temperature rise of roughly 9 C above ambient at room temperature. In sealed enclosures without airflow, derate by ensuring the EP is soldered to a sufficient ground copper area (>= 1 square inch) to keep junction temperature within the -40 C to +85 C industrial range. Do not exceed 3.6 V on AVDD/DVDD/DRVDD as permanent damage may result.
Compliance-Informationen
RoHS compliant per distributor product listings. Not AEC-Q100 qualified - industrial temperature grade -40 C to +85 C.
