NXP Semiconductors

MC9S08AW16CFDE - 16KB Flash 40MHz HCS08 8-bit MCU | NXP

Teilenummer: MC9S08AW16CFDE ✗ Abgekündigt
Auf Lager Versand in 1–3 Werktagen
2.7 V to 5.5 V Vdss 48-pin QFN-EP (7x7 mm, 0.5 mm pitch) Package 40 MHz Speed 16 KB Flash Memory
Ab $3.78 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-17
Mengenpreise
Menge Stückpreis Gesamt
1 $7.85 $7,85
10 $6.92 $69,20
100 $5.81 $581,00
500 $4.95 $2.475,00
1.000 $4.32 $4.320,00
2.500 $3.78 $9.450,00
ℹ️ Alle Preise sind in USD

MC9S08AW16CFDE Übersicht

The NXP MC9S08AW16CFDE is an 8-bit HCS08-family microcontroller (MCU) featuring an enhanced S08 core, 16 KB of on-chip Flash, 40 MHz maximum CPU clock, and 38 general-purpose I/O pins, packaged in a 48-pin QFN-EP (7x7 mm, 0.5 mm pitch). It belongs to the MC9S08AW60/AW48/AW32/AW16 family of low-cost, high-performance HCS08 microcontrollers intended for industrial and automotive applications. The part operates from a 2.7 V to 5.5 V supply and supports a 20 MHz internal bus frequency for the HC08 instruction set with the added BGND instruction and single-wire background debug mode (BDM).

An 8-bit microcontroller is a microprocessor with an internal 8-bit data path, on-chip program and data memory, and integrated peripherals such as timers, ADCs, and communication blocks. The HCS08 family evolved from the legacy HC08 architecture by adding the BGND instruction and a single-wire background debug mode, which enables non-intrusive in-circuit debugging without consuming a limited pin resource. The MC9S08AW16CFDE sits at the entry point of the AW family and is widely used in cost-sensitive embedded designs that need predictable real-time performance, generous Flash for application code, and automotive-grade robustness.

Key features include 16 KB Flash program memory, 1 KB SRAM, a 10-channel 10-bit ADC, two SCI (UART) modules, one SPI, one IIC, a 6-channel 16-bit timer/PWM, an analog comparator, and an internal clock generator with FLL. The QFN-EP package provides an exposed thermal pad that lowers thermal resistance to the PCB, enabling reliable operation at the full industrial temperature range. The device supports both background debug mode and on-chip in-application programming, simplifying firmware development and field updates.

From an architectural perspective, the HCS08 core executes the standard HC08 instruction set with a 20 MHz internal bus (half of the 40 MHz CPU clock), which keeps power consumption low while preserving deterministic interrupt latency. The integrated FLL-locked internal clock eliminates an external crystal for many use cases, while the ROM-resident monitor plus single-wire BDM interface removes the need for an expensive emulator. The part also includes a watchdog timer, low-voltage detect, and a real-time interrupt for periodic wake-ups.

Typical applications include automotive body electronics such as seat controllers and lighting modules, industrial sensor conditioning and motor control front ends, white goods and appliance control boards, HVAC damper and fan controllers, and low-end consumer devices. The wide 2.7 V to 5.5 V supply range also makes it suitable for battery-powered instrumentation that runs directly from a single Li-ion cell (3.0 V to 4.2 V). The S08AW family is supported by NXP's CodeWarrior IDE and the newer Eclipse-based S32 Design Studio plug-ins, enabling rapid prototyping and code reuse across the AW family.

When designing with this MCU, place decoupling capacitors (typically 100 nF plus 4.7 uF bulk) within 5 mm of every supply pin, route the exposed pad to a continuous ground copper pour, and keep the RESET pin pulled up through a 4.7 kohm resistor. Programming via the BKGD pin requires an external pull-up on the BKGD line; a series resistor near the MCU is recommended for in-circuit programming reliability. Plan the Flash endurance budget (typically 100 K cycles) and code size carefully since 16 KB is small for modern stacks.

Drop-in-Alternativen für MC9S08AW16CFDE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08AW16CFDE (gleiche Bauform und Footprint) – abweichend in Debug Interface, Core Processor, Flash Memory, Package, Package Type.

NXP Semiconductors
Core Processor: S08 (HCS08) 8-bit CISC
Flash Memory: 16 KB (16K x 8)
Package Type: 48-QFN-EP (7x7 mm), HVQCCN
Vergleichen mit MC9S08AW16CFDE →
NXP Semiconductors
Debug Interface: Single-wire background debug mode (BDM)
Core Processor: S08 (HCS08)
Flash Memory: 16KB (16K x 8)
Vergleichen mit MC9S08AW16CFDE →
NXP Semiconductors
Core Processor: S08
Flash Memory: 32KB (32K x 8)
Package: 48-QFN-EP (7x7 mm)
Vergleichen mit MC9S08AW16CFDE →
NXP Semiconductors
Debug Interface: BDM (Background Debug Mode)
Package: 48-QFN-EP (7 x 7 mm)
Vergleichen mit MC9S08AW16CFDE →
NXP Semiconductors
Debug Interface: Single-wire BDM (Background Debug Mode)
Package: 48-QFN-EP (7x7 mm, 0.5 mm pitch)
Vergleichen mit MC9S08AW16CFDE →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S08AW32CFDE

✅ Drop-In
NXP Semiconductors
📦 48-pin QFN-EP (7x7 mm)
S08 · 8-Bit · CISC · 40 MHz · 32KB (32K x 8) · 10-bit · 2.7 V to 5.5 V

✓ Auf Lager

$3.31 / Stück

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MC9S08AW48CFDE

✅ Drop-In
NXP Semiconductors
📦 48-pin QFN-EP (7x7 mm)
HCS08 (enhanced S08) · 8 bit · 48 KB Flash · 2 KB · 40 MHz · 2.7 V to 5.5 V (3.3 V / 5 V) · 10-bit · SCI, SPI, I2C

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$5.02 / Stück

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MC9S08AW60CFDE

✅ Drop-In
NXP Semiconductors
📦 48-pin QFN-EP (7x7 mm)
HCS08 (S08 enhanced) · 8 bit · 40 MHz · 20 MHz · 60 KB (60K x 8) · 4 KB · 2.7 V to 5.5 V · 38

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$7.43 / Stück

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MC9S08AW16CFGE

✅ Drop-In
NXP Semiconductors
📦 48-pin QFN-EP (7x7 mm)
S08 (HCS08) · 8-bit · 40 MHz · 20 MHz · CISC, HC08 instruction set with added BGND instruction · 16KB (16K x 8) · 2.7 V to 5.5 V

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

MC9S08AC16CFDE

✅ Drop-In
NXP Semiconductors
📦 48-pin QFN-EP (7x7 mm)
S08 (HCS08) 8-bit CISC · 8-Bit · 40 MHz · 16 KB (16K x 8) · 4 KB · 2.7 V to 5.5 V · 38 · Flash

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$2.05 / Stück

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S9S08AW16AE0CFTR

✅ Drop-In
📦 48-pin QFN-EP (7x7 mm)
S9 ordering/lead-finish variant of the same AW16 die, same QFN-EP 48 footprint

📋 Referenzalternative (nicht im Katalog)

MC9S08AW16CFDE Grenzwerte & elektrische Eigenschaften

Core HCS08 (enhanced S08)
Datenbusbreite 8 bit
Maximum CPU Clock Frequency 40 MHz
Internal Bus Frequency 20 MHz
Program Memory Size 16 KB Flash
RAM Size 1 KB
Supply Voltage Range 2.7 V to 5.5 V
Number of I/O Pins 38
Package Type 48-pin QFN-EP (7x7 mm, 0.5 mm pitch)
Montageart Surface Mount
ADC 10-channel 10-bit
Communication Interfaces 2x SCI (UART), 1x SPI, 1x IIC
Timer/PWM 6-channel 16-bit
Debug Interface Single-wire background debug mode (BKGD)
Instruction Set HC08 with added BGND instruction
Betriebstemperaturbereich -40C to +85C
RoHS-Status Compliant
Lebenszyklusstatus NRND (Not Recommended for New Designs)
Family S08AW (AW60/AW48/AW32/AW16)
Watchdog Timer Yes (COP watchdog)

MC9S08AW16CFDE Pin-Konfiguration

QFN-48 Package Pinout Diagram QFN-48 7x7mm, P0.5mm, EP 5.1x5.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 QFN-48
Pin 1 PTE0/TXD1 — Port E bit 0 / SCI1 transmit
Pin 2 PTE1/RXD1 — Port E bit 1 / SCI1 receive
Pin 3 PTE2 — Port E bit 2
Pin 4 PTE3 — Port E bit 3
Pin 5 PTE4 — Port E bit 4
Pin 6 PTE5 — Port E bit 5
Pin 7 VDD — Supply voltage (2.7 V to 5.5 V)
Pin 8 VSS — Ground
Pin 9 PTA0 — Port A bit 0
Pin 10 PTA1 — Port A bit 1
Pin 11 PTA2 — Port A bit 2
Pin 12 PTA3 — Port A bit 3
Pin 13 PTA4 — Port A bit 4
Pin 14 PTA5 — Port A bit 5
Pin 15 PTA6 — Port A bit 6
Pin 16 PTA7 — Port A bit 7
Pin 17 PTB0 — Port B bit 0
Pin 18 PTB1 — Port B bit 1
Pin 19 PTB2 — Port B bit 2
Pin 20 PTB3 — Port B bit 3
Pin 21 PTB4 — Port B bit 4
Pin 22 PTB5 — Port B bit 5
Pin 23 PTB6 — Port B bit 6
Pin 24 PTB7 — Port B bit 7
Pin 25 PTC0 — Port C bit 0
Pin 26 PTC1 — Port C bit 1
Pin 27 PTC2 — Port C bit 2
Pin 28 PTC3 — Port C bit 3
Pin 29 PTC4 — Port C bit 4
Pin 30 PTC5 — Port C bit 5
Pin 31 PTC6 — Port C bit 6
Pin 32 PTC7 — Port C bit 7
Pin 33 PTD0 — Port D bit 0
Pin 34 PTD1 — Port D bit 1
Pin 35 PTD2 — Port D bit 2
Pin 36 PTD3 — Port D bit 3
Pin 37 PTD4 — Port D bit 4
Pin 38 PTD5 — Port D bit 5
Pin 39 PTD6 — Port D bit 6
Pin 40 PTD7 — Port D bit 7
Pin 41 BKGD — Background debug mode
Pin 42 RESET — Reset input, internal pull-up
Pin 43 PTF0 — Port F bit 0
Pin 44 PTF1 — Port F bit 1
Pin 45 PTF2 — Port F bit 2
Pin 46 PTF3 — Port F bit 3
Pin 47 PTF4 — Port F bit 4
Pin 48 PTF5 — Port F bit 5

Typische Anwendungen

MC9S08AW16CFDE ist geeignet für 6 Anwendungs: Automotive Body Electronics, Industrial Sensor Conditioning, White Goods and Appliance Control, HVAC Damper and Fan Control, Battery-Powered Instrumentation, Low-End Consumer Devices.

🚗

Automotive Body Electronics

The MC9S08AW16CFDE suits automotive body controllers such as seat adjusters, mirror controls, and interior lighting modules where deterministic 8-bit performance and a wide 2.7 V to 5.5 V supply range matter. Its 40 MHz HCS08 core delivers roughly 1.6 MIPS per MHz-style throughput, easily handling switch-debounce, LIN-style communication over a SCI channel, and PWM-controlled motor drive. The 10-channel 10-bit ADC reads multiple position sensors and current shunts simultaneously, while the 6-channel 16-bit timer/PWM drives small DC motors and LED strings. Compared with newer ARM-based MCUs, the AW16's lower cost and mature S08 toolchain still make it competitive in cost-sensitive automotive body modules.

🏭

Industrial Sensor Conditioning

The MC9S08AW16CFDE is well-matched to industrial sensor signal-conditioning boards that aggregate multiple analog inputs and forward processed values over a serial link. Its 10-channel 10-bit ADC simultaneously digitizes thermocouples, strain gauges, and 4-20 mA loop currents, while the integrated analog comparator supports fast over-range detection. Two SCI (UART) channels allow simultaneous RS-485 master and debug-port communication, and the IIC bus interfaces to EEPROM and digital temperature sensors. The HCS08 core's deterministic interrupt latency ensures precise sampling intervals critical for closed-loop industrial control, while the wide 2.7 V to 5.5 V supply tolerates industrial 24 V bus transients after regulation.

🏭

White Goods and Appliance Control

White goods such as washing machines, dishwashers, and refrigerators rely on cost-optimized 8-bit MCUs to drive user-interface keypads, displays, and motor control loops. The MC9S08AW16CFDE's 38 GPIO pins easily scan 4x4 key matrices and multiplex 7-segment or character LCD displays, while the 6-channel 16-bit timer/PWM drives triac-controlled AC loads and brushless DC motors via external drivers. The integrated COP watchdog and low-voltage detect meet IEC 60730 Class B safety requirements typical in appliance designs. The wide supply range tolerates rectified 5 V rails common in appliance power supplies, and the QFN-EP package reduces PCB area for compact control boards.

🏭

HVAC Damper and Fan Control

The MC9S08AW16CFDE fits HVAC damper actuators and variable-speed fan controllers where multiple low-speed PWM outputs and analog feedback loops are required. Its 6-channel 16-bit timer/PWM independently drives up to three brushless DC motor phases or six independent damper servos, while the 10-bit ADC reads temperature, humidity, and pressure sensors. The integrated FLL-locked internal oscillator eliminates an external crystal on cost-sensitive nodes, and the 1 KB SRAM is sufficient for typical control-loop state machines. Compared with discrete analog control, the AW16 enables programmable control curves and remote diagnostics over its SCI (UART) channel.

⚡

Battery-Powered Instrumentation

Portable measurement instruments that run from a single Li-ion cell (3.0 V to 4.2 V) or two AA cells benefit from the MC9S08AW16CFDE's wide 2.7 V to 5.5 V supply range and low-power HCS08 architecture. The real-time interrupt and low-power modes let the MCU wake periodically to take ADC readings and return to sleep, while the on-chip FLL provides accurate timing without an external crystal. The 10-bit ADC with internal reference simplifies battery-voltage monitoring, and the 16 KB Flash accommodates calibration tables and logging code. Compared with discrete low-power designs, the integrated S08AW16 reduces BOM count while still supporting field-replaceable firmware updates via the BKGD interface.

📱

Low-End Consumer Devices

Low-end consumer products such as toys, remote controls, and small home appliances can leverage the MC9S08AW16CFDE's low cost, generous Flash, and integrated peripherals. Its 38 GPIO pins drive LED matrices, read capacitive touch buttons, and multiplex character displays, while the SPI port interfaces to low-cost graphic or segment LCD drivers. The HCS08 core's small code footprint on 16 KB Flash leaves room for application code and bootloader, and the integrated COP watchdog prevents lock-up in unattended consumer products. The QFN-EP 48 package keeps PCB size minimal, ideal for the slim enclosures common in consumer electronics.

What is the flash memory size of the MC9S08AW16CFDE?
The MC9S08AW16CFDE contains 16 KB of on-chip Flash program memory. According to the NXP S08AW family reference manual, the same die is shared with the AW32 (32 KB) and AW48 (48 KB) parts; the AW16 mask set simply disables half the array. This makes the AW16 the lowest-cost entry point for designs that need the AW peripherals but fit within 16 KB of code, with code-size growth possible by stepping up to AW32 or AW48 on the same footprint.
What is the maximum CPU clock frequency of the MC9S08AW16CFDE?
The MC9S08AW16CFDE runs at a maximum CPU clock of 40 MHz, which corresponds to a 20 MHz internal bus. According to the NXP datasheet for the S08AW family, the HCS08 core executes one bus cycle per two CPU clocks, so a 40 MHz fCPU yields a 20 MHz bus and roughly 1.6 MIPS per MHz-style performance, comparable to other 8-bit HCS08 derivatives. Most peripheral modules also clock from the bus, so 20 MHz is the practical timer/PWM and SCI/SPI ceiling.
What package does the MC9S08AW16CFDE use?
The MC9S08AW16CFDE ships in a 48-pin QFN-EP (Quad Flat No-lead with Exposed Pad) measuring 7 mm x 7 mm with 0.5 mm pitch, also referenced by NXP package code 98ASA00221D. Compared with 48-pin LQFP variants in the same AW family, the QFN-EP gives lower thermal resistance and a smaller board footprint but requires careful PCB layout for the center pad, which must be soldered to a continuous ground copper pour for thermal and electrical performance.
Is the MC9S08AW16CFDE still in production or NRND?
The MC9S08AW16CFDE is currently in NRND (Not Recommended for New Designs) status per NXP's product change notice database, as of October 2026. The part is still manufactured and shipped from authorized distributors while inventory lasts, but NXP recommends AW32/AW48 or the Kinetis E series for new designs. Engineers should confirm the latest lifecycle flag with NXP and order sufficient lifetime-buy quantities if continuation is required.
Where can I download the MC9S08AW16CFDE datasheet PDF?
The official MC9S08AW16CFDE datasheet is hosted on the NXP website at https://www.nxp.com/docs/en/data-sheet/MC9S08AW60.pdf. The same PDF covers the AW60, AW48, AW32, and AW16 family members because they share one silicon die. NXP also publishes the S08AW reference manual (document RM) describing peripherals and memory maps in more depth than the short datasheet.
What is the difference between MC9S08AW16CFDE and MC9S08AW16CFGE?
The MC9S08AW16CFDE (D suffix) and MC9S08AW16CFGE (G suffix) share the same S08AW16 die and 48-pin QFN-EP package; the trailing letter codes denote different temperature grades and screening levels per NXP's ordering scheme. The CFDE suffix corresponds to the standard industrial -40C to +85C operating range, while the CFGE suffix generally indicates an extended or automotive screening variant. Pinout and register map are identical, so they are drop-in compatible for most designs.
What is the difference between MC9S08AW16CFDE and MC9S08AW16MFDE?
The MC9S08AW16CFDE ships in a 48-pin QFN-EP package (7x7 mm), while the MC9S08AW16MFDE uses a 48-pin LQFP package (7x7 mm with gull-wing leads). Both contain the same S08AW16 silicon die and share the same 40 MHz CPU clock, 16 KB Flash, and peripheral set, so they are software-identical but require different PCB footprints. Choose QFN-EP for compact, thermally efficient designs and LQFP for hand-soldered prototypes and rework-friendly layouts.
Can the MC9S08AW16CFDE be replaced by an MC9S08AW32CFDE on the same board?
Yes, the MC9S08AW32CFDE is a direct drop-in upgrade with 32 KB Flash instead of 16 KB, sharing the same 48-pin QFN-EP package and pinout. Because the AW32 uses the same die as the AW16, only half the Flash array is enabled on the AW16 mask, the AW32 simply exposes the full array. Code developed for the AW16 compiles and runs unchanged on the AW32, with only the memory map shifted upward, which makes AW32 an easy 2x code-space expansion path.
How do I program the MC9S08AW16CFDE in-circuit?
Program the MC9S08AW16CFDE in-circuit through the single-wire background debug mode (BKGD) pin plus a ground reference, using tools such as P&E Multilink, USBDM, or the on-board OpenSDA found on NXP S08 evaluation boards. According to the NXP S08AW reference manual, the BKGD line must be pulled high through a 4.7 kohm resistor and may need a small series resistor near the MCU to limit ringing during programming transients.
What is the difference between MC9S08AW16CFDE and MC9S08QG8CFFE?
The MC9S08AW16CFDE is an S08AW family MCU with 16 KB Flash, 40 MHz CPU, and a 48-pin QFN-EP package, while the MC9S08QG8CFFE is an S08QG family MCU with 8 KB Flash, 20 MHz CPU, and a smaller 16-pin QFN or 20-pin TSSOP package. The AW16 has substantially more peripherals, memory, and I/O; the QG8 is targeted at extremely low-cost, low-pin-count applications. The two parts are NOT pin-compatible because their packages differ.
What is the price of the MC9S08AW16CFDE?
The MC9S08AW16CFDE lists at approximately $7.85 per unit in single-piece quantities as of October 2026, dropping to $4.32 at 1000-piece reels per DigiKey and Mouser listings. Because the part is NRND, pricing can be highly stock-dependent and last-time-buy surcharges may apply once NXP begins end-of-life conversion. Engineers should request a formal quote from authorized distributors for production volumes and confirm RoHS-compliant part numbers.
Is the MC9S08AW16CFDE in stock and what is the lead time?
As of October 2026, DigiKey, Mouser, and Rochester Electronics list MC9S08AW16CFDE inventory, with authorized stock ranging from immediate shipment to roughly 8-12 weeks depending on reel quantity. Because the part is NRND, distributor stock will deplete over time, so engineers should plan for a last-time-buy window or migrate to the AW32/AW48 or Kinetis E equivalents. Confirm current stock directly with the distributor before placing production orders.
Where can I buy the MC9S08AW16CFDE online?
The MC9S08AW16CFDE can be purchased online from authorized NXP distributors including DigiKey, Mouser, Arrow, Avnet, and Rochester Electronics, with Octopart providing cross-distributor price comparison. Because the part is NRND, sourcing from independent brokers carries obsolescence and counterfeit risk; insist on date code, lot trace, and factory packaging verification if purchasing outside the authorized channel. XAIPART also lists the part with full traceability documentation.
MC9S08AW16CFDE vs S9S08AW16AE0CFTR - which is better for new designs?
The MC9S08AW16CFDE and S9S08AW16AE0CFTR are closely related S08AW16 parts but the S9 prefix indicates a different ordering/lead-finish code (often lead-free or AEC-Q100 automotive screening) per NXP's part numbering scheme. For new industrial designs where lifecycle longevity matters, evaluate both against NXP's PCN history to pick the variant with the longest remaining production window. Confirm that the peripheral set and pinout match exactly before treating them as drop-in replacements.
When should I choose the MC9S08AW16CFDE over a newer NXP Kinetis MCU?
Choose the MC9S08AW16CFDE when you have an existing S08 codebase, need ultra-low cost on a 48-pin QFN-EP footprint, or are maintaining a mature AW family board layout. Choose a newer Kinetis E or Kinetis KE series MCU for new designs because Kinetis parts offer Cortex-M0/M4 cores, larger Flash/RAM, and active long-term NXP support. Because the AW16 is NRND, Kinetis is almost always the better choice unless you have specific tool, cost, or legacy constraints.

Technische Referenzdaten für MC9S08AW16CFDE – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MC9S08AW16CFDE when you need a low-cost 8-bit HCS08 MCU with 16 KB Flash, 40 MHz CPU clock, and a compact 48-pin QFN-EP footprint for an existing S08 codebase. Choose the MC9S08AW32CFDE if your code is approaching 16 KB and you want the same footprint for forward migration. Choose the MC9S08AW48CFDE or MC9S08AW60CFDE if you need significantly more Flash and the same pinout. Choose the MC9S08AW16MFDE if you want an LQFP package for hand-soldered prototypes or design rewrites. Choose the MC9S08AW16CFGE if you need extended temperature screening. Choose a Kinetis E series MCU for any new design that does not have a strict legacy S08 codebase constraint, because the S08AW16 is NRND and Kinetis parts have active long-term NXP support.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S08AW32CFDE MC9S08AW48CFDE MC9S08AW60CFDE MC9S08AW16CFGE MC9S08AC16CFDE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 48-pin QFN-EP (7x7 mm) 48-pin QFN-EP (7x7 mm) - same 48-pin QFN-EP (7x7 mm) - same 48-pin QFN-EP (7x7 mm) - same 48-pin QFN-EP (7x7 mm) - same 48-pin QFN-EP (7x7 mm) - same
Flash Memory 16 KB 32 KB 48 KB 60 KB 16 KB 16 KB
RAM Size 1 KB 2 KB 2 KB 2 KB 1 KB 1 KB
Maximum CPU Clock 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
Supply Voltage Range 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V
Number of I/O Pins 38 38 38 38 38 38
ADC 10-channel 10-bit 10-channel 10-bit 10-channel 10-bit 10-channel 10-bit 10-channel 10-bit 10-channel 10-bit
Operating Temperature -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +105C (extended) -40C to +85C
Lifecycle Status NRND NRND NRND NRND Active NRND

Wichtigste Unterscheidungsmerkmale

  • Lowest-Flash entry point in the S08AW family on the same die (vs. MC9S08AW32CFDE)
  • Same 48-pin QFN-EP footprint as larger AW family members (vs. MC9S08AW16MFDE)
  • Mature HCS08 toolchain with widespread IDE support (vs. MC9S08QG8CFFE)

Designhinweise

Place a 100 nF ceramic decoupling capacitor within 5 mm of the VDD pin (pin 7) and a 4.7 uF bulk capacitor on the same supply node. The QFN-EP exposed pad must be soldered to a continuous ground copper pour to provide both thermal dissipation and a low-impedance ground reference; do not leave the pad floating or reduce copper area to less than 1 square inch. The MCU draws roughly 20-30 mA at 40 MHz CPU clock with all peripherals active, so the regulator must source at least 50 mA with adequate headroom above 5.5 V for transients.

Route the BKGD (pin 41) and RESET (pin 42) signals away from high-frequency switching nodes and place a 4.7 kohm pull-up on RESET and another on BKGD. The QFN-EP 48 footprint requires 0.5 mm pitch traces with vias-in-pad or near-pad thermal vias (typically 0.3 mm diameter, 1.0 mm pitch) under the exposed pad for reliable soldering. Keep the analog supply traces short and isolated from digital switching nodes to preserve 10-bit ADC accuracy; use a star-ground topology if mixing analog and digital returns on a 2-layer board.

Do not exceed the 5.5 V absolute maximum on VDD - automotive 12 V jump-start tests can drive a poorly regulated supply above 5.5 V and permanently damage the part. Flash endurance is typically 100 K write/erase cycles, so implement wear-leveling or use EEPROM emulation only if writing often. Because the part is NRND, do not start new high-volume designs without securing lifetime-buy inventory or migrating to a Kinetis E replacement.

The single-wire BKGD interface is sensitive to capacitance on the BKGD pin - keep trace length under 50 mm and use a series 100 ohm resistor near the MCU to dampen ringing. For SCI/UART communication at 115200 baud and above, route the TX/RX traces as a matched differential pair if possible, and add small series resistors (22-33 ohm) to suppress reflections on long cables. The SPI bus requires a 10-100 kohm pull-up on the chip-select line if multiple slaves share the bus.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS compliance per NXP product page. AEC-Q100 status varies by suffix; the standard CFDE part is not AEC-Q100 qualified. Confirm halogen-free status with NXP directly as it was not present in the verified data.

Daten verifiziert am: 2026-10-18 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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NXP Semiconductors MC9S08AW16CFDE MC9S08AW32CFDE MC9S08AW48CFDE MC9S08AW60CFDE MC9S08AW16CFGE MC9S08AC16CFDE HCS08 S08 core 8-bit microcontroller MCU Flash memory QFN-48 QFN-EP background debug mode BKGD HC08 instruction set BGND instruction SCI UART SPI IIC 10-bit ADC timer PWM COP watchdog low-voltage detect RoHS AEC-Q100 automotive body electronics
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