HINWEIS ZUR LETZTEN BESTELLMÖGLICHKEIT: MC9S08AC16CFDE nähert sich dem End-of-Life. Letztes Bestelldatum: Kontaktieren Sie uns. Verfügbare Alternativbauteile ansehen →
NXP Semiconductors

MC9S08AC16CFDE - 8-bit S08 MCU 16KB Flash 40MHz QFN-48 | NXP

Teilenummer: MC9S08AC16CFDE ✗ Abgekündigt
Auf Lager Versand in 1–3 Werktagen
2.7 V to 5.5 V Vdss 48-QFN-EP (7x7 mm), HVQCCN Package 40 MHz Speed 16 KB (16K x 8) Memory
Ab $2.05 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-18
Mengenpreise
Menge Stückpreis Gesamt
1 $3.2 $3,20
10 $2.88 $28,80
100 $2.55 $255,00
500 $2.3 $1.150,00
1.000 $2.05 $2.050,00
ℹ️ Alle Preise sind in USD

MC9S08AC16CFDE Übersicht

The NXP Semiconductors MC9S08AC16CFDE is an 8-bit microcontroller unit (MCU) based on the HCS08 (S08) CISC core, running at up to 40 MHz with 16 KB of Flash memory and 4 KB of RAM, housed in a 48-pin QFN with exposed pad (48-QFN-EP, 7x7 mm) package. Supply voltage spans 2.7 V to 5.5 V, and the device provides 38 general-purpose I/O lines.

An 8-bit MCU is a single-chip computer whose CPU processes data 8 bits at a time. Within the embedded hierarchy, the MC9S08AC16CFDE belongs to the HCS08 family, a lineage of low-cost, high-performance 8-bit MCUs originally developed by Freescale Semiconductor (now part of NXP). MCUs of this class sit below 16-bit and 32-bit controllers in compute power but offer lower cost, simpler tooling, and strong EMC behavior, making them the workhorse of high-volume embedded control.

Key features include the 40 MHz S08 bus-capable CPU, in-circuit, in-application programmable Flash (16 KB), 4 KB of on-chip RAM for variables and stack, a 2.7 V to 5.5 V single-supply operating range, and 38 general-purpose I/O ports for button matrices, relay drives, and serial peripherals. The AC family is the third family in the Flexis series and is pin-compatible with 32-bit device duos, offering an upgrade path to ColdFire-class performance without a PCB redesign.

Architecturally, the S08 core uses CISC-style instructions with an enhanced stack pointer, background debug mode (BDM) via a single pin, and integrated system peripherals typical of the AC family including timers and ADC (per the manufacturer datasheet for detailed peripheral counts). The exposed-pad QFN package provides excellent thermal performance and low inductance for EMI-sensitive designs.

Typical applications include small appliance and home automation control, automotive body electronics, battery chargers and power supplies, and industrial sensor nodes where a 5 V tolerant, low-cost MCU is required.

When designing with this part, note the NXP product page lists the device as End of Life; plan a last-time-buy or select a drop-in family variant for new designs.

This page synthesizes verified distributor data, drop-in alternatives, lifecycle status, and practical design notes not found in the manufacturer datasheet.

Drop-in-Alternativen für MC9S08AC16CFDE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08AC16CFDE (gleiche Bauform und Footprint) – abweichend in Communication Interfaces, Package, RoHS Status, Lifecycle Status, Core Processor.

NXP Semiconductors
Communication Interfaces: SCI (UART), SPI, IIC
Package: 44-LQFP (10x10 mm)
RoHS Status: Compliant
Vergleichen mit MC9S08AC16CFDE →
NXP Semiconductors
Communication Interfaces: SCI (UART) and SPI
Package: 48-QFN-EP (7x7 mm) with exposed thermal pad
Lifecycle Status: NRND (Not Recommended for New Designs, per NXP product page)
Vergleichen mit MC9S08AC16CFDE →
NXP Semiconductors
Package: 48-QFN-EP (7x7 mm) / 48-VFQFN Exposed Pad
Lifecycle Status: NRND (Not Recommended for New Designs)
Core Processor: S08 (HCS08)
Vergleichen mit MC9S08AC16CFDE →
NXP Semiconductors
Communication Interfaces: 2x SCI (LIN 2.0, SAE J2602), SPI, IIC
Package: 48-QFN-EP (7x7 mm), 48-VFQFN Exposed Pad
RoHS Status: ROHS COMPLIANT (per distributor datasheet listing)
Vergleichen mit MC9S08AC16CFDE →
NXP Semiconductors
Communication Interfaces: SCI (UART), SPI
Package: 48-VFQFN Exposed Pad (QFN-EP, 7x7 mm)
RoHS Status: Compliant
Vergleichen mit MC9S08AC16CFDE →
NXP Semiconductors
Communication Interfaces: 2x SCI (UART), 1x SPI, 1x IIC
RoHS Status: Compliant
Lifecycle Status: NRND (Not Recommended for New Designs)
Vergleichen mit MC9S08AC16CFDE →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S08AC8CFDE

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 48-QFN-EP (7x7 mm)
Flash 8 KB vs 16 KB (-50%), RAM reduced accordingly; identical 40 MHz S08 core, 2.7-5.5 V supply, 38 I/O, pin-to-pin

📋 Referenzalternative (nicht im Katalog)

MC9S08AC32CFDE

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 48-QFN-EP (7x7 mm)
S08 (HCS08 family, 8-bit CISC) · 32 KB · 1 KB · 40 MHz · 2.7 V to 5.5 V · -40 C to +125 C (automotive grade) · 38 · 48-QFN-EP (7x7 mm) with exposed thermal pad

✓ Auf Lager

$3.02 / Stück

Datenblatt ansehen →

MC9S08AC48CFDE

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 48-QFN-EP (7x7 mm)
S08 (HCS08) · 8-Bit · 40 MHz CPU / 20 MHz internal bus · 48KB (48K x 8) · 8KB · 2.7 V to 5.5 V · 38 · 48-QFN-EP (7x7 mm) / 48-VFQFN Exposed Pad

✓ Auf Lager

$4.76 / Stück

Datenblatt ansehen →

MC9S08AC60CFDE

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 48-QFN-EP (7x7 mm)
S08 (HCS08), 8-bit CISC · 8-bit · 40 MHz · 20 MHz · 60 KB (60K x 8) · 2.7 V to 5.5 V · 3.3 V / 5 V · 38

✓ Auf Lager

$8.6 / Stück

Datenblatt ansehen →

MC9S08AC16CFGE

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 48-QFN-EP (7x7 mm)
HCS08 (8-bit) · 40 MHz · 20 MHz · 16 KB (16K x 8) · 2.7 V to 5.5 V · 38 · 44-LQFP (10x10 mm)

✓ Auf Lager

$2.6 / Stück

Datenblatt ansehen →

MC9S08AC16CFDE Grenzwerte & elektrische Eigenschaften

Core Processor S08 (HCS08) 8-bit CISC
Core Size 8-Bit
Maximale Taktfrequenz 40 MHz
Flash Memory 16 KB (16K x 8)
RAM Size 4 KB
Supply Voltage Range 2.7 V to 5.5 V
Number of I/O 38
Program Memory Type Flash
Package Type 48-QFN-EP (7x7 mm), HVQCCN
Montageart Surface Mount
Series S08AC (Flexis series)
Life Cycle Stage End of Life (per NXP product page)
RoHS-Status RoHS Compliant
Package Pin Count 48
Packaging Tray

MC9S08AC16CFDE 48 Pinbelegungsleitfaden

Pinbelegung für MC9S08AC16CFDE (48-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für MC9S08AC16CFDE im 48-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für MC9S08AC16CFDE.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

MC9S08AC16CFDE ist geeignet für 6 Anwendungs: Home Appliance Control, Battery Chargers and Power Supplies, Automotive Body Electronics, Industrial Sensor Nodes and Monitoring, Lighting Control and LED Drivers, Legacy Maintenance and EOL Replacement.

🧩

Home Appliance Control

The MC9S08AC16CFDE fits appliance control boards - washing machines, rice cookers, fans, and small HVAC units - where its 38 general-purpose I/O lines drive relays, triacs, keys, and 7-segment displays directly at 5 V logic levels. The 2.7 V to 5.5 V supply range allows the MCU to run from a simple transformer or capacitive-dropper supply, and the 40 MHz S08 core handles keypad scanning and timer sequencing with large margins. The 48-QFN-EP (7x7 mm) exposed-pad package gives good thermal and EMI behavior on single-layer-heavy cost-driven boards. Its 16 KB Flash is sufficient for state-machine control plus fault diagnostics, and in-application Flash programming permits factory calibration data storage on the same die, removing an external EEPROM from the bill of materials.

⚡

Battery Chargers and Power Supplies

In smart chargers and AC-DC power supply supervision, the MC9S08AC16CFDE provides the control loop intelligence: ADC sampling of voltage and current (per the AC family peripheral set - confirm channel count in the manufacturer datasheet), PWM generation for regulation, and serial communication for status reporting. The 5 V-tolerant I/O simplifies interfacing with op-amps and comparators running from the same rail, and the industrial temperature grade supports enclosed converter environments. The 16 KB Flash accommodates multi-chemistry charging algorithms (Li-ion, NiMH, lead-acid) with safety timers and fault logging. The exposed-pad QFN package dissipates the MCU's modest power easily, and BDM single-wire debugging lets engineers tune charge parameters on the bench without removing the device from the board.

🚗

Automotive Body Electronics

S08AC-family devices have been widely used in automotive body functions such as seat control, mirror adjustment, lighting modules, and window lifters. The MC9S08AC16CFDE's 38 I/O lines handle switch matrices, relay and H-bridge commands, and LIN-type serial links; the 2.7 V to 5.5 V range tolerates automotive 5 V regulated rails with brown-out margin. The Flexis series positioning of the AC family gives suppliers a pin-compatible migration path to 32-bit performance when feature content grows, protecting PCB investment across vehicle programs. Designers should verify AEC qualification status of the specific suffix with NXP before use in safety-relevant positions, and apply standard load-dump protection on all inputs connected to vehicle harnesses.

🏭

Industrial Sensor Nodes and Monitoring

For factory sensors, level switches, and condition-monitoring nodes, the MC9S08AC16CFDE combines ADC-based measurement, UART/SPI peripheral connectivity, and 16 KB of Flash for linearization tables and diagnostics. The industrial temperature grade (per Partstack listing) and 5 V operation match legacy 4-20 mA transmitter architectures and PLC I/O signaling directly. Its 40 MHz S08 core executes filtering and threshold logic well ahead of real-time requirements, while the low-power stop modes (see manufacturer datasheet for exact figures) extend battery life in wireless-attached variants. The exposed-pad QFN also improves noise immunity in electrically noisy motor-control cabinets, and the device's RoHS-compliant lead-free package keeps new industrial installations compliant with environmental directives.

💡

Lighting Control and LED Drivers

Dimmable LED luminaires, emergency-exit signs, and architectural lighting controllers use the MC9S08AC16CFDE for PWM generation, DALI/DMX-style serial decode, and human-interface control. Its 40 MHz bus operation produces fine-resolution PWM at flicker-free frequencies, and the 38 I/O lines drive button panels, presence-detector inputs, and multiple LED channels through external drivers. The 16 KB Flash stores dimming curves and self-test routines, and in-application programming enables field updates of lighting scenes. Because the MCU runs directly at 5 V, it interfaces cleanly with optocoupled DMX inputs and legacy 12 V aux rails via simple regulators. The compact 7x7 mm QFN fits into driver enclosures and track-head housings where PCB area is constrained.

🔧

Legacy Maintenance and EOL Replacement

A substantial ongoing use of the MC9S08AC16CFDE is sustaining production of existing designs now that NXP has moved the part to End of Life. Manufacturers of meters, chargers, and appliance controls must either execute a last-time-buy or qualify a pin-compatible sibling - typically MC9S08AC32CFDE or MC9S08AC60CFDE, which use the identical 48-QFN-EP footprint and peripheral map. Authorized aftermarket sources such as Rochester Electronics supply the original MPN for legacy support, while XAIPART provides quote-based access to remaining stock as of 2026-10-18. When requalifying a family variant, firmware re-verification is limited to Flash/RAM linker settings, since pinout, electrical ratings, and debugging infrastructure are unchanged across the AC family.

What is the MC9S08AC16CFDE microcontroller?
The MC9S08AC16CFDE is an NXP (formerly Freescale) 8-bit HCS08 microcontroller with a 40 MHz S08 CPU, 16 KB of Flash memory, and 4 KB of RAM in a 48-pin QFN exposed-pad (7x7 mm) package. It operates from a 2.7 V to 5.5 V supply and provides 38 general-purpose I/O. According to the NXP product page, the device belongs to the S08AC family, part of the Flexis series, and is now listed as End of Life.
Is MC9S08AC16CFDE still in production?
No. According to the NXP official product page, the MC9S08AC16CFDE is listed under End of Life with discontinuance and replacement information published. Distributors such as Rochester Electronics may still supply remaining inventory, and excess-stock channels (e.g., ExcessChip) list new-original units. For new designs, engineers should consider the pin-compatible variants in the S08AC family, or budget a last-time-buy for existing products before production ceases.
What is the price of MC9S08AC16CFDE?
As of 2026-10-18, XAIPART lists the MC9S08AC16CFDE from 3.20 USD at quantity 1, stepping down to 2.05 USD at quantity 1000. Octopart compares bulk discounts from 8 distributors for this part, so final pricing varies by stock location and date. Because the device is End of Life, remaining stock can command premiums; verify live pricing at the time of order.
Where can I buy MC9S08AC16CFDE online?
The MC9S08AC16CFDE can be purchased from XAIPART directly, and it has historically been stocked at Mouser, DigiKey, Newark, and through Rochester Electronics (DigiKey Marketplace) for legacy support. Octopart tracks 8 distributors for this MPN. Since NXP lists the part as End of Life, availability concentrates in residual and authorized-aftermarket channels; XAIPART offers quote-based ordering for volume requirements as of 2026-10-18.
What is the difference between MC9S08AC16CFDE and MC9S08AC8CFDE?
The primary difference is Flash memory: the MC9S08AC16CFDE provides 16 KB of Flash and 4 KB of RAM, while the MC9S08AC8CFDE provides 8 KB of Flash with a smaller RAM block. Both use the same 40 MHz S08 core, the same 2.7 V to 5.5 V supply range, and the same 48-pin QFN-EP package, making the AC8 a pin-compatible lower-memory sibling. If firmware fits in 8 KB, the AC8 variant is a drop-in option with lower cost.
What is a drop-in replacement for MC9S08AC16CFDE?
The closest drop-in replacements are same-family S08AC variants in the identical 48-QFN-EP package: MC9S08AC8CFDE (8 KB Flash), MC9S08AC32CFDE (32 KB Flash), MC9S08AC48CFDE (48 KB Flash), and MC9S08AC60CFDE (60 KB Flash). All share the 40 MHz S08 core, 2.7 V to 5.5 V supply, 38 I/O, and the same footprint, so no PCB change is needed - only verify Flash/RAM sizing against your firmware.
What is the best NXP equivalent for MC9S08AC16CFDE in the same package?
The best NXP equivalents are the same-family AC-series parts: MC9S08AC32CFDE if you need more code headroom, or MC9S08AC8CFDE if you need to reduce cost. Both are pin-to-pin compatible in the 48-QFN-EP (7x7 mm) footprint and share the 40 MHz S08 core and 2.7 V to 5.5 V operating range. Note the entire S08AC family is aged; confirm lifecycle status on the NXP page for each candidate before committing a new design.
Is MC9S08AC16CFDE the same as MC9S08QG8CFFE?
No. The MC9S08QG8CFFE is a different, smaller S08 device in a much smaller package (QFN/DFN, not 48-pin QFN-EP) with 8 KB Flash. The two are compared on component sites for their shared S08 core, but they are not pin-compatible and cannot substitute each other on an existing PCB. The MC9S08AC16CFDE has 16 KB Flash, 4 KB RAM, 38 I/O in a 48-QFN-EP package, while the QG8 is aimed at ultra-low-pin-count designs.
When should I choose MC9S08AC16CFDE over a 32-bit MCU?
Choose the MC9S08AC16CFDE when your firmware is simple control logic - button scanning, relay or LED control, simple ADC sampling and UART communication - that fits comfortably in 16 KB of Flash. The S08 core at 40 MHz, 5 V operation, and low unit cost beat a 32-bit MCU on price and EMC simplicity for these tasks. Choose a 32-bit device (for example the Flexis 32-bit pin-compatible companions or Kinetis parts) when you need floating-point math, complex stacks, or larger memory.
Is MC9S08AC16CFDE suitable for 5V industrial applications?
Yes. The MC9S08AC16CFDE operates from a 2.7 V to 5.5 V single supply, which makes it directly compatible with 5 V industrial logic levels - no level shifting needed when interfacing to 5 V sensors, relays, and legacy peripherals. The 38 I/O lines and industrial-grade family positioning (Partstack lists Temperature Grade: INDUSTRIAL) support harsh-environment control boards. Always verify the exact temperature rating in the manufacturer datasheet for your suffix before deployment.
Where can I download the MC9S08AC16CFDE datasheet PDF?
The authoritative MC9S08AC16CFDE documentation is on the NXP product page at nxp.com/part/MC9S08AC16CFDE, which links the technical data sheet under the Data Sheet section. Archive copies also exist on alldatasheet.com and digchip.net, but always prefer the manufacturer source for the latest revision. The document covers the full S08AC family electrical specifications, register maps, and package mechanical drawings.
What are the key specifications of MC9S08AC16CFDE engineers should know?
Core facts: 8-bit HCS08 (S08) CISC CPU at 40 MHz, 16 KB Flash, 4 KB RAM, 38 general-purpose I/O, and a 2.7 V to 5.5 V supply range. Package is a 48-pin QFN with exposed pad measuring 7x7 mm (HVQCCN, surface mount, RoHS compliant). The device is a member of the S08AC family in the Flexis series and is listed by NXP as End of Life. These figures come from the NXP product page and distributor listings from Mouser and DigiKey.
Does MC9S08AC16CFDE support in-circuit programming and debugging?
Yes. HCS08 family devices like the MC9S08AC16CFDE include NXP's single-wire Background Debug Mode (BDM), which allows flash programming and real-time debugging through a low-cost BDM pod - no removed chip or dedicated programmer socket is required. The on-chip Flash is also in-application programmable, enabling field firmware updates. Confirm the exact BDM pin allocation on the 48-QFN package in the NXP technical data sheet for your layout.
What is the lead time and stock situation for MC9S08AC16CFDE?
Because NXP has designated the MC9S08AC16CFDE as End of Life, standard factory lead times no longer apply; supply depends entirely on residual distribution and authorized aftermarket stock. Rochester Electronics lists the part for legacy support, and Octopart tracks 8 distributor sources. XAIPART offers quote-based availability as of 2026-10-18. For production programs, request a formal quotation with quantity commitment rather than relying on spot stock.
Is MC9S08AC16CFDE RoHS compliant?
Yes. Distributor and datasheet aggregator data describe the MC9S08AC16CFDE as ROHS COMPLIANT in the QFN-48 lead-free package, consistent with the CF suffix conventions of the S08AC family. The lead-free, halogen-constrained construction suits current EU RoHS requirements. For formal REACH and conflict-minerals declarations, request the certificate of conformance directly from NXP or your authorized distributor, as these statements are not fully reproduced in third-party listings.

Technische Referenzdaten für MC9S08AC16CFDE – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MC9S08AC16CFDE when you must sustain an existing 48-QFN-EP design and its firmware occupies well under 16 KB of Flash - it remains available through residual stock and authorized aftermarket despite its End of Life status. Choose MC9S08AC8CFDE for pure cost reduction on fixed firmware, MC9S08AC32CFDE when you need growth headroom, and MC9S08AC60CFDE when protocol stacks or extensive diagnostics demand maximum memory in the same footprint. Choose MC9S08AC16CFGE instead of the CFDE only when your environment requires the extended temperature grade. Do not attempt to substitute smaller-pin S08 parts such as the MC9S08QG8CFFE - they are not pin-compatible. For genuinely new designs, weigh the entire S08AC family's age and evaluate NXP's newer Kinetis-based MCUs, accepting a PCB respin in exchange for long-term lifecycle security.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S08AC8CFDE MC9S08AC32CFDE MC9S08AC60CFDE MC9S08AC16CFGE
Package 48-QFN-EP (7x7 mm) 48-QFN-EP (7x7 mm) - same 48-QFN-EP (7x7 mm) - same 48-QFN-EP (7x7 mm) - same 48-QFN-EP (7x7 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core / Clock S08 8-bit, 40 MHz S08 8-bit, 40 MHz S08 8-bit, 40 MHz S08 8-bit, 40 MHz S08 8-bit, 40 MHz
Flash Memory 16 KB 8 KB 32 KB 60 KB 16 KB
Supply Voltage 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V 2.7 V to 5.5 V
I/O Count 38 38 38 38 38
Lifecycle Status End of Life (NXP) Aged family - verify on NXP page Aged family - verify on NXP page Aged family - verify on NXP page Aged family - verify on NXP page

Wichtigste Unterscheidungsmerkmale

  • Balanced 16 KB Flash / 4 KB RAM point in the AC family (vs. MC9S08AC8CFDE)
  • Lower cost than higher-memory siblings for compact firmware (vs. MC9S08AC32CFDE)
  • Flexis-series pin-compatible upgrade path to 32-bit (vs. MC9S08AC60CFDE)

Designhinweise

This part is End of Life per the NXP product page. Before committing a new or continuing design, verify remaining stock life with your distributor and pre-qualify a same-footprint sibling (MC9S08AC32CFDE or MC9S08AC60CFDE) as a contingency. These family variants are pin-to-pin and peripheral-map compatible, so second-sourcing within the AC family requires only linker/memory-map changes in firmware, not a PCB respin.

The 2.7 V to 5.5 V supply range permits direct 5 V or 3.3 V operation, but brown-out behavior differs across the range. Place a 100 nF ceramic capacitor at each VDD/VSS pin pair plus bulk 10 uF at the regulator output. If the design must survive automotive load-dump events on an unprotected rail, add series resistance and a TVS diode ahead of the local regulator - never rely on the MCU's internal protection.

The exposed pad of the 48-QFN-EP package should be soldered to a grounded copper pour for mechanical reliability and EMC performance; a thermal-relief-free via array (3x3 minimum) to the ground plane is standard practice for QFN-EP devices. Keep the BDM debug pad accessible on a test point even in production layouts - single-wire background debugging is the only flashing method without removing the device.

Compliance-Informationen

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Unknown

RoHS compliant per distributor/datasheet aggregator listings (QFN-48 lead-free package). REACH, halogen-free, and conflict-minerals status not stated in provided data - request declaration from NXP.

Daten verifiziert am: 2026-10-18 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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MC9S08AC16CFDE MC9S08AC16CFDE datasheet PDF NXP MC9S08AC16CFDE MC9S08AC16CFDE equivalent substitute MC9S08AC16 drop-in replacement 48-QFN MC9S08AC16CFDE price buy HCS08 8-bit microcontroller 16KB flash 40MHz MC9S08AC16CFDE vs MC9S08AC8CFDE S08AC family end of life replacement MC9S08AC16CFDE QFN-48 pinout 5V 8-bit MCU industrial control Freescale MC9S08AC16 legacy supply

Verwandte Bauteile & Begriffe

NXP Semiconductors Freescale Semiconductor MC9S08AC16CFDE MC9S08AC8CFDE MC9S08AC32CFDE MC9S08AC60CFDE MC9S08QG8CFFE HCS08 S08 core 8-bit microcontroller MCU Flexis series QFN-48 HVQCCN exposed pad package surface mount RoHS BDM (Background Debug Mode) industrial control battery charger in-application programming Flash memory End of Life
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