MC9S08DN60ACLH - 8-bit S08 60KB Flash MCU, 40MHz, CAN | NXP
Teilenummer: MC9S08DN60ACLH ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.4 | $8,40 |
| 10 | $7.56 | $75,60 |
| 100 | $6.72 | $672,00 |
| 500 | $5.88 | $2.940,00 |
| 1.000 | $5.21 | $5.210,00 |
MC9S08DN60ACLH Übersicht
An 8-bit microcontroller (MCU) is a small computer-on-a-chip integrating a CPU, memory (Flash/RAM/EEPROM), peripherals, and I/O on a single die. The 8-bit class targets cost-sensitive, deterministic embedded applications where peripherals and real-time response matter more than raw compute throughput. Within the hierarchy: MCU -> microcontroller -> 8-bit MCU -> HCS08 family -> S08DN sub-family (CAN + USB + on-chip debug). S08DN devices are positioned for automotive body, industrial control, and LIN/CAN-attached sensor nodes.
Key features include a 16-channel, 12-bit ADC with 2.5 us conversion time, 53 general-purpose I/O pins, an external oscillator interface, and 32 interrupt/reset sources. Integrated peripherals include CAN 2.0A/B, USB 2.0 full-speed, SCI, SPI, I2C, and a 6-channel PWM timer. The on-chip BDM (Background Debug Mode) interface enables non-intrusive in-circuit emulation and Flash programming without an external emulator.
Architecturally, the S08DN combines a von Neumann-style unified memory map, a 20 MHz internal bus, and a multi-channel interrupt controller with programmable priority. The CAN and USB engines are independent peripheral blocks, allowing simultaneous USB device traffic and CAN message exchange without CPU loading, which is unusual for an 8-bit class part.
Typical applications include CAN-based automotive body controllers (door modules, seat controllers, climate control), industrial sensor hubs with USB diagnostics, LIN-to-CAN bridges, building automation gateways, and low-cost USB-CAN interface dongles. Its AEC-Q100 grade and CAN integration make it well suited to in-cabin network nodes.
When designing with this MCU, allocate sufficient decoupling (100 nF per VDD pin plus 4.7 uF bulk) close to the package, keep the EXTAL/XTAL traces short, and respect the 5V-tolerant I/O limits on the USB pins. The 64-LQFP package has standard JTAG-style footprint compatibility with the wider S08/S12 family, easing layout reuse.
Drop-in-Alternativen für MC9S08DN60ACLH – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08DN60ACLH (gleiche Bauform und Footprint) – abweichend in Instruction Set, RAM Size, Connectivity, Core Processor, Program Memory Size.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
S9S08DZ60F1CLH
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$5.95 / Stück
Datenblatt ansehen →S9S08DZ60F2CLH
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S9S08DZ60F2MLHR
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$4.08 / Stück
Datenblatt ansehen →MC9S08DN60AMLH
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$8.5845 / Stück
Datenblatt ansehen →MC9S08DV60AMLH
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$3.85 / Stück
Datenblatt ansehen →MC9S08DV128CLH
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$4.42 / Stück
Datenblatt ansehen →MC9S08MM32CLH
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Datenblatt ansehen →MC9S08DN60ACLH Grenzwerte & elektrische Eigenschaften
| Core | HCS08 (S08 core) |
| Datenbusbreite | 8 bit |
| CPU Frequency | 40 MHz |
| Bus Frequency | 20 MHz |
| Program Memory (Flash) | 60 KB (60K x 8) |
| RAM Size | 2 KB (2K x 8) |
| Number of I/O | 53 |
| Gehäuse / Bauform | 64-LQFP (10x10 mm) |
| Montageart | Surface Mount |
| ADC | 16-channel, 12-bit, 2.5 us conversion |
| Communication Interfaces | CAN 2.0A/B, USB 2.0 FS, SCI, SPI, I2C |
| Oscillator Type | External |
| Interrupt Sources | Up to 32 |
| Packaging | Tray |
| RoHS-Status | Compliant |
| Instruction Set | HC08 + BGND instruction |
| On-Chip Debug | BDM (Background Debug Mode) |
MC9S08DN60ACLH 64-lqfp (10x10 mm) Pinbelegungsleitfaden
Pinbelegung für MC9S08DN60ACLH (64-lqfp (10x10 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC9S08DN60ACLH.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC9S08DN60ACLH ist geeignet für 6 Anwendungs: Automotive CAN Body Controller, Industrial CAN/USB Sensor Hub, LIN-to-CAN Gateway, USB-CAN Diagnostic Dongle, Building Automation Gateway, Consumer Appliance Control Board.
Automotive CAN Body Controller
The MC9S08DN60ACLH is purpose-built for automotive body-electronics nodes, where its integrated CAN 2.0A/B controller and 40 MHz HCS08 core deliver deterministic message handling on a vehicle network. With 60 KB Flash it can host a full CAN-based body control stack including window/lock/seat logic, while the 12-bit 16-channel ADC reads sensor inputs (temperature, current, switch position). The 64-LQFP package offers 53 GPIO, enough to drive relays and H-bridges directly. Compared with newer S32K parts, the DN60 keeps BOM cost low while still offering on-chip CAN, making it ideal for low-speed CAN body networks at 125-500 kbps.
Empfohlen
Industrial CAN/USB Sensor Hub
In industrial sensor hubs the MC9S08DN60ACLH combines CAN 2.0A/B and USB 2.0 full-speed on a single 8-bit core, the rare combination that lets a factory-floor node simultaneously publish sensor data on a CAN bus and expose a USB diagnostics port for technicians. The 12-bit resolution ADC at 2.5 us conversion supports up to 16 analog channels, adequate for pressure, flow, and temperature sensors. Its 53 GPIO handle digital inputs and outputs including relays and opto-isolated interfaces. Engineers appreciate the on-chip BDM debug for in-circuit firmware updates without removing the node from the line.
Empfohlen
LIN-to-CAN Gateway
A common use case for the MC9S08DN60ACLH is a low-cost gateway that aggregates LIN-attached sensors (door modules, mirror switches, seat position) and re-publishes them on the CAN bus. The S08 core can handle the SCI/LIN master protocol and CAN 2.0A/B simultaneously thanks to independent interrupt vectors and DMA-style peripheral channels. The 2 KB RAM is sufficient for short message buffers, and the 60 KB Flash hosts the gateway firmware plus a small diagnostic stack. Its 64-LQFP footprint and 5V-tolerant I/O simplify PCB integration with 12V automotive rails.
Empfohlen
USB-CAN Diagnostic Dongle
Engineers building USB-to-CAN interface dongles for vehicle diagnostics (OBD-II, CANopen, DeviceNet) rely on the MC9S08DN60ACLH's integrated USB 2.0 full-speed device and CAN 2.0A/B controllers on a single chip. The 40 MHz HCS08 core and 2 KB RAM can drive a USB HID/CDC class device plus a CAN listener at 1 Mbps with low CPU overhead. The 12-bit ADC and 53 GPIO can be repurposed for dongle-side status LEDs and configuration inputs. Drop-in compatibility with the active S9S08DZ60F1CLH keeps the supply chain healthy.
Empfohlen
Building Automation Gateway
Building automation gateways often need to bridge between BACnet, Modbus, or KNX fieldbuses and a USB service interface. The MC9S08DN60ACLH provides the SPI, SCI, and I2C peripherals for those protocols, the CAN and USB for upstream/downstream links, and 60 KB Flash for the gateway protocol stack. Its industrial -40C to +85C operating range covers unheated equipment rooms. The 64-LQFP footprint makes hand-rework feasible during field servicing, and BDM debug enables on-site firmware updates via the integrated USB port.
Empfohlen
Consumer Appliance Control Board
White-goods and HVAC control boards benefit from the MC9S08DN60ACLH's 8-bit cost structure combined with USB for service diagnostics and CAN for premium appliance networking. The 16-channel 12-bit ADC at 2.5 us conversion handles multiple temperature, humidity, and motor-current sensors simultaneously. Its 60 KB Flash supports graphical LCD or segment display drivers plus a small RTOS or bare-metal scheduler. The 64-LQFP package's 53 GPIO can drive triac interfaces, relay coils, and rotary encoder inputs without external expanders.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S08DN60ACLH – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | S9S08DZ60F1CLH | S9S08DZ60F2CLH | MC9S08DV60AMLH | |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | |
| Package | 64-LQFP (10x10) | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same | 64-LQFP (10x10) - same |
| Core | HCS08 8-bit | HCS08 8-bit - same | HCS08 8-bit - same | HCS08 8-bit - same | HCS08 8-bit - same |
| CPU Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash Memory | 60 KB | 60 KB | 60 KB | 60 KB | 128 KB |
| RAM Size | 2 KB | 2 KB | 2 KB | 2 KB | 8 KB |
| CAN Controller | Yes (CAN 2.0A/B) | Yes (CAN 2.0A/B) | Yes (CAN 2.0A/B) | Yes (CAN 2.0A/B) | Yes (CAN 2.0A/B) |
| USB Controller | Yes (USB 2.0 FS) | Yes (USB 2.0 FS) | Yes (USB 2.0 FS) | Yes (USB 2.0 FS) | Yes (USB 2.0 FS) |
| Lifecycle Status | NRND | Active | Active | NRND | NRND |
Wichtigste Unterscheidungsmerkmale
- Integrated CAN 2.0A/B plus USB 2.0 full-speed on a single 8-bit core (vs. MC9S08AW60CPUE)
- Newer active mask-set replacement available with same footprint (vs. S9S08DZ60F1CLH)
- On-chip BDM debug without external emulator (vs. Legacy HC08 parts without BDM)
Designhinweise
Place a 100 nF decoupling capacitor on every VDD pin and a 4.7 uF bulk capacitor near the package. The MC9S08DN60ACLH has multiple VDD/VSS pairs; bypassing each pair independently prevents digital switching noise from coupling into the ADC reference. For automotive 12V supply designs, add a reverse-battery and load-dump protection network upstream of the LDO feeding the MCU.
Do not leave unused I/O pins floating on the MC9S08DN60ACLH. Configure unused pins as outputs or enable internal pull-ups to avoid parasitic current draw and ESD sensitivity. The USB pins (D+ / D-) require series 22R or 33R resistors and the D+ line typically needs a 1.5 k pull-up to signal full-speed attach; confirm these against the USB 2.0 specification, not the bare datasheet.
Keep EXTAL/XTAL traces as short as possible (under 5 mm) and route them over a continuous ground plane. The MC9S08DN60ACLH uses an external oscillator; a noisy crystal layout will cause CAN bit-timing errors. Place the load capacitors within 3 mm of the EXTAL/XTAL pins and use matched capacitance values per the crystal datasheet.
Compliance-Informationen
RoHS and REACH compliance per NXP product page; conflict-minerals statement per NXP corporate policy. AEC-Q100 grade not explicitly stated on the NXP product page for the C temperature grade - verify exact qualification with NXP for automotive designs. The 64-LQFP package is lead-free and matte-tin finished.