MC9S08DV60AMLH - 8-bit MCU 60KB Flash 40MHz CAN LIN | NXP
Teilenummer: MC9S08DV60AMLH ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.2 | $6,20 |
| 10 | $5.6 | $56,00 |
| 100 | $4.95 | $495,00 |
| 500 | $4.4 | $2.200,00 |
| 1.000 | $3.85 | $3.850,00 |
MC9S08DV60AMLH Übersicht
A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, program memory, data RAM, and multiple peripheral functions such as timers, communication interfaces, and analog-to-digital converters on one die. MCUs sit at the heart of embedded systems within the broader hierarchy of semiconductors -> integrated circuits -> microcontrollers, providing complete, low-cost control logic for everything from automotive body modules to industrial sensors.
Key features of the MC9S08DV60AMLH include an on-chip MSCAN (Controller Area Network) module and LIN master support, making it a strong fit for automotive and industrial network nodes. The 16-channel, 12-bit ADC offers 2.5 microsecond conversion time, and the device provides 53 general-purpose I/O pins plus 1 input-only pin. The HCS08 core executes the HC08 instruction set with an added BGND instruction and supports up to 32 interrupt/reset sources.
Technically, the enhanced HCS08 family uses an external oscillator option and the CISC-style S08 architecture inherited from the HC08, with a background debug mode (BGND) for on-chip debugging without consuming target resources. The DV series integrates CAN and LIN communication peripherals that would otherwise require external transceiver-adjacent logic, reducing BOM count in networked nodes. Flash program memory is 60KB with 3KB of on-chip RAM for stack and variables.
Typical applications include automotive body electronics (door modules, seat control, lighting), LIN-master or CAN network gateways, industrial motor control panels, and building automation sensor nodes where a 3.3V/5V 8-bit MCU with on-chip CAN reduces system cost.
Design consideration: at 40MHz CPU operation the device is typically run from an external oscillator; verify ADC clocking and CAN bit-timing budgets early, as peripheral clock sources on S08 devices derive from the bus clock (20MHz).
This page synthesizes distributor pricing, drop-in same-family alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für MC9S08DV60AMLH – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08DV60AMLH (gleiche Bauform und Footprint) – abweichend in Package, Instruction Set, Core, RAM Size, Core Processor.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S08DV48AMLH
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.31 / Stück
Datenblatt ansehen →MC9S08DV32AMLH
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC9S08DV16AMLH
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC9S08DZ60MLH
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
S9S08DZ60F1VLH
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08DV60AMLH Grenzwerte & elektrische Eigenschaften
| Core Processor | S08 (HCS08), 8-bit |
| Core Size | 8-Bit |
| Speed | 40MHz CPU (20MHz bus) |
| Program Memory Size | 60KB (60K x 8) |
| Program Memory Type | FLASH |
| RAM Size | 3K x 8 |
| Number of I/O | 53 |
| Input-Only Pins | 1 |
| ADC Resolution | 12-bit |
| ADC Channels | 16 |
| ADC Conversion Time | 2.5 us |
| Connectivity | CAN (MSCAN), LIN master |
| Oscillator Type | External |
| Interrupt/Reset Sources | Up to 32 |
| Versorgungsspannung | 3.3V/5V |
| Gehäuse / Bauform | 64-LQFP (10x10 mm) |
| Montageart | Surface Mount |
| Packaging | Tray |
| Instruction Set | HC08 with added BGND instruction |
MC9S08DV60AMLH 64-lqfp (10x10 mm) Pinbelegungsleitfaden
Pinbelegung für MC9S08DV60AMLH (64-lqfp (10x10 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC9S08DV60AMLH.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC9S08DV60AMLH ist geeignet für 6 Anwendungs: Automotive Body Electronics, LIN Master Network Nodes, Industrial Motor Control Panels, Building Automation Sensor Nodes, CAN Gateways and Bridges, Lighting Control Modules.
Automotive Body Electronics
The MC9S08DV60AMLH fits automotive body modules such as door controllers, seat adjusters, and interior lighting because it combines the MSCAN controller and LIN master on a 5V-tolerant 8-bit core. Body nodes typically exchange small periodic messages on a LIN bus while reporting to a CAN backbone - exactly the dual-network capability this MCU provides on-chip. With 53 GPIO pins, one 64-LQFP device can directly drive relays, high-side switches, and LED loads without port expanders, and the 16-channel 12-bit ADC (2.5 us conversion) reads switch arrays, position sensors, and current-sense shunts. Flash of 60KB accommodates diagnostic stacks and failure logging that smaller DV variants cannot hold, making the DV60A the top-of-range choice for feature-rich body modules.
Empfohlen
LIN Master Network Nodes
As a LIN master, the MC9S08DV60AMLH schedules and supervises up to a LIN cluster of slave nodes in applications such as seat modules, mirror controls, HVAC dampers, and wiper systems. The integrated LIN master support means the scheduling table, baud-rate generation, and break/sync handling run from on-chip peripherals with modest CPU load on the 40MHz HCS08 core, leaving headroom for application logic and diagnostics. Its 60KB Flash holds the master schedule tables, DBC-derived signal handling, and UDS-style diagnostic handlers that LIN masters commonly require. A single external LIN transceiver (such as an MC33661-class part) completes the physical layer; the 12-bit ADC then reads feedback currents from the slave-controlled actuators for plausibility checking at the master node.
Empfohlen
Industrial Motor Control Panels
In industrial motor control panels, the MC9S08DV60AMLH sequences contactors, reads potentiometer speed commands, and communicates setpoints over CAN to drives and PLC I/O. The 20MHz bus clock executes PI-loop control code with deterministic latency, while the 16-channel 12-bit ADC samples current-shunt and back-EMF feedback at microsecond-scale conversion times (2.5 us per conversion) suitable for per-phase current monitoring. The 53 GPIO directly drive opto-isolated gate drivers and relay coils through transistor buffers. Because the device tolerates 3.3V/5V operation, it interfaces cleanly with both legacy 5V industrial signal levels and modern 3.3V logic. The 60KB Flash leaves ample room for fault tables, Modbus/CAN bridging firmware, and field-updatable parameter storage.
Empfohlen
Building Automation Sensor Nodes
Building automation nodes benefit from the MC9S08DV60AMLH's combination of a 12-bit ADC for temperature, humidity, and occupancy sensors and CAN/LIN networking for daisy-chained room controllers. The HCS08 core's low peripheral-driven interrupt overhead allows the MCU to sleep between scheduled samples, and the external oscillator supports accurate timekeeping for scheduling logic. Sixteen ADC channels let a single node aggregate multiple sensor inputs - for example, four temperature probes, a CO2 sensor, and a setpoint potentiometer - without a separate analog front end. The 64-LQFP 10x10mm footprint suits compact wall-box and ceiling-mount housings, and 60KB Flash supports BACnet-style message handling or proprietary CAN application layers with room for OTA-style firmware updates.
Empfohlen
CAN Gateways and Bridges
The MC9S08DV60AMLH serves as a compact CAN-to-LIN or CAN-to-UART gateway, translating between an automotive/industrial CAN backbone and low-cost LIN or serial sub-networks. The on-chip MSCAN module handles full CAN 2.0A/B frame buffering in hardware, while LIN master support manages the schedule-driven lower bus; the 40MHz HCS08 core performs the translation layer in between. Gateway code - frame filters, signal remapping, and timeout supervision - fits comfortably in 60KB Flash with 3KB RAM for message queues. Because the DV60A is a single-chip solution, gateway nodes can be built without external protocol controllers, reducing BOM cost and PCB area. Its 5V operation also simplifies interfacing with legacy 5V CAN transceivers common in industrial installations.
Empfohlen
Lighting Control Modules
Automotive and architectural LED lighting controllers use the MC9S08DV60AMLH to generate PWM dimming from its timer channels while monitoring LED current via the 12-bit ADC. The 53 GPIO outputs support per-string enable lines and diagnostic multiplexing, and the 60KB Flash stores dimming curves, temperature-derating tables, and fault latching logic required by automotive lighting specifications. Communication with the vehicle or building controller runs over the on-chip CAN or LIN master, receiving color/intensity commands and reporting open-circuit or over-temperature faults detected by the ADC. The device's 5V-tolerant I/O drives external high-side LED drivers directly, and the 20MHz bus gives sufficient headroom for closed-loop current regulation on multiple channels simultaneously.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S08DV60AMLH – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S08DV48AMLH | MC9S08DV32AMLH | MC9S08DZ60MLH | S9S08DZ60F1VLH |
|---|---|---|---|---|---|
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Program Flash | 60KB (60K x 8) | 48KB | 32KB | 60KB | 60KB (mask/program) |
| CPU Speed | 40MHz (20MHz bus) | 40MHz (20MHz bus) | 40MHz (20MHz bus) | 40MHz (20MHz bus) | S08 core, 40MHz class |
| CAN / LIN | MSCAN + LIN master | MSCAN + LIN master | MSCAN + LIN master | MSCAN + LIN | MSCAN + LIN |
| Automotive Grade | Automotive-oriented DV series (AEC-Q100 not confirmed in provided data) | Same family | Same family | Automotive DZ series | Yes (automotive S9 prefix) |
Wichtigste Unterscheidungsmerkmale
- Largest Flash in the DV family (vs. MC9S08DV48AMLH)
- Single-chip CAN + LIN master integration (vs. MC9S08DV32AMLH)
- DV-series simplicity vs DZ-series automotive overhead (vs. MC9S08DZ60MLH)
Designhinweise
The 64-LQFP (10x10 mm) footprint requires a standard 0.5mm-pitch land pattern per the NXP datasheet package drawing. Place the VDD/VSS decoupling pair (typically 100nF ceramic plus bulk capacitance) directly adjacent to each power pin pair, with a solid ground plane on layer 2. Route the CAN and LIN transceiver connections with short traces and place the transceiver close to the MCU pins; keep the crystal/oscillator traces short and guarded by ground. Expose adequate thermal relief via the ground plane - the LQFP has no thermal pad but the ground plane handles dissipation at this power level.
Do not confuse DV-series and DZ-series register maps: although the MC9S08DZ60MLH shares the 64-LQFP footprint and S08 core, peripheral register addresses differ, so existing DV60 firmware will not run unmodified on DZ silicon. Also verify oscillator startup: the MC9S08DV60AMLH uses an external oscillator option, and incorrect load capacitors are a common cause of unreliable boot in automotive environments. Finally, the ADC reference should be routed cleanly from VDDA with local filtering to preserve 12-bit accuracy.
The MC9S08DV60AMLH operates from 3.3V or 5V rails. Estimated: at 40MHz CPU / 20MHz bus with all peripherals clocked, S08-family core current is in the tens of milliamps (consult the datasheet electrical characteristics table for the exact IDD vs bus-frequency curve); size the 5V regulator accordingly and add margin for GPIO sink current driving LEDs or relays through buffers. Use a local LDO or system basis chip (for example MC33907-class) in automotive designs to handle load-dump and crank profiles on the supply rail.
For CAN networks, match the physical layer to the network type: use a high-speed transceiver (TJA1050-class) for 500kbps HS-CAN backbones or a fault-tolerant transceiver (TJA1055-class) for low-speed body CAN. Keep the split-termination and common-mode choke layout symmetrical, and route the MCU's CAN TX/RX traces away from the oscillator and ADC reference lines. LIN bus lines should reach the connector with a series pull-up/suppression network per the LIN specification to meet automotive EMI requirements.
Compliance-Informationen
Compliance data not explicitly stated in the provided web data. The MC prefix denotes a standard (non-automotive-suffix) part; the S9S08DZ60F1VLH alternative carries the automotive designation. Verify RoHS/REACH status on the official NXP product page.