MC9S08DV60AMLC - 8-bit S08 MCU, 60KB Flash, 40MHz | NXP
Teilenummer: MC9S08DV60AMLC ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $3.85 | $3,85 |
| 10 | $3.45 | $34,50 |
| 100 | $3.05 | $305,00 |
| 500 | $2.72 | $1.360,00 |
| 1.000 | $2.45 | $2.450,00 |
MC9S08DV60AMLC Übersicht
An 8-bit microcontroller unit (MCU) is a single-chip computer that integrates a processor core, program memory, data memory, and peripheral modules on one silicon die. Within the embedded-system hierarchy, the MCU sits at the device level of power management, motor control, and communication nodes - below 32-bit application processors but above discrete logic. The HCS08 family is an evolution of Freescale (now NXP) 68HC08 lineage, executing the HC08 instruction set with an added BGND background-debug instruction.
Key features of the MC9S08DV60AMLC include support for up to 32 interrupt and reset sources, on-chip emulation and debug via background debug mode (BDM), and flash memory density suited to applications that outgrow 32 KB parts. The DV family is notable as one of the first 8-bit MCU families with an embedded CAN module, embedded EEPROM-class nonvolatile storage behavior, and on-chip debug, targeting automotive and industrial markets.
Architecturally, the HCS08 core uses a fixed 8-bit data path with a 16-bit address bus and stacked-pointer architecture. Operating the CPU at 40 MHz while the bus runs at 20 MHz allows single-cycle internal accesses for most instructions, keeping interrupt latency deterministic - a critical trait in CAN-networked automotive body and industrial control nodes.
Typical applications include automotive body electronics such as door modules, seat control, and lighting control, industrial CAN nodes, HVAC blower and damper control, and small motor control systems where the integrated CAN peripheral removes the need for an external CAN controller.
A key design consideration: NXP lists this device as NRND (Not Recommended for New Designs), so new designs should evaluate MC9S08DV-series successors or migrate to pin-compatible alternatives, while existing designs can rely on continued production for existing programs.
This page synthesizes distributor listings, lifecycle status, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für MC9S08DV60AMLC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08DV60AMLC (gleiche Bauform und Footprint) – abweichend in RAM Size, Instruction Set, Core Processor, Number of I/O, Supply Voltage.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S08DV48AMLC
✅ Drop-In✓ Auf Lager
$4.73 / Stück
Datenblatt ansehen →S9S08DV32F1MLC
✅ Drop-In✓ Auf Lager
$2.74 / Stück
Datenblatt ansehen →MC9S08DV60AMLH
✅ Drop-In✓ Auf Lager
$3.85 / Stück
Datenblatt ansehen →MC9S08DV60AMLC Grenzwerte & elektrische Eigenschaften
| Core Processor | S08 (HCS08) |
| Core Size | 8-Bit |
| Maximum CPU Frequency | 40 MHz (20 MHz bus) |
| Flash Memory | 60 KB (60K x 8) |
| RAM Size | 3 KB |
| Gehäuse | 32-LQFP (7 x 7 mm) |
| Montageart | Surface Mount |
| Interrupt/Reset Sources | Up to 32 |
| Instruction Set | HC08 with added BGND instruction |
| On-Chip Debug | Background Debug Mode (BDM) emulation/debug |
| Communication Interface | Embedded CAN |
| Target Markets | Automotive and industrial |
| Lebenszyklusstatus | NRND (Not Recommended for New Designs) |
MC9S08DV60AMLC 32-lqfp (7 x 7 mm) Pinbelegungsleitfaden
Pinbelegung für MC9S08DV60AMLC (32-lqfp (7 x 7 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC9S08DV60AMLC.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC9S08DV60AMLC ist geeignet für 6 Anwendungs: Automotive Body Electronics, Industrial CAN Nodes, HVAC Blower and Damper Control, Small Motor Control, Lighting Control Modules, Legacy Board Maintenance and Repair.
Automotive Body Electronics
The MC9S08DV60AMLC fits automotive body modules such as door controllers, seat adjusters, and interior lighting directly because NXP developed the DV family specifically for the automotive market and embedded a CAN module on-chip. A 60 KB flash budget accommodates feature-rich body firmware including window lift sequencing, mirror control, and lamp diagnostics, while the 40 MHz S08 core keeps interrupt latency deterministic for CAN message handling across up to 32 interrupt sources. In a typical node, the MCU drives high-side lamp drivers through PWM peripherals and reads switch states through ADC channels, communicating with the body controller over a 500 kbit/s CAN bus without any external CAN controller, reducing board area and component count in cost-sensitive modules.
Empfohlen
Industrial CAN Nodes
In factory automation, the MC9S08DV60AMLC serves as an intelligent CAN node for sensors, actuators, and I/O expanders. The embedded CAN peripheral removes the need for an external CAN controller, and the DV family was among the first 8-bit MCUs to integrate this feature for industrial markets. With 60 KB flash, the part stores protocol stacks, node configuration tables, and diagnostic logs, while 3 KB RAM handles message buffers and stack depth for layered protocols. The 40 MHz core with 20 MHz bus executes control loops and CRC checking within CAN frame timing. Because the device is NRND, new industrial designs should verify long-term supply, but existing CAN node boards benefit from the pin-compatible DV48 variant if firmware fits 48 KB flash.
Empfohlen
HVAC Blower and Damper Control
HVAC systems use the MC9S08DV60AMLC to control blower motors, damper actuators, and temperature feedback loops in building equipment. The 8-bit S08 core at 40 MHz provides ample throughput for PI control loops running at kilohertz rates, while the on-chip ADC reads NTC thermistor networks for zone temperature measurement. The 60 KB flash accommodates multiple operating profiles, damper calibration tables, and Modbus- or CAN-based supervisory communication. PWM outputs drive triac or DC blower stages with closed-loop speed regulation. The on-chip debug (BDM) capability lets field engineers reflash firmware during commissioning. Designers must provide an external CAN/LIN transceiver for networked thermostats and observe the NRND status when qualifying new production runs.
Empfohlen
Small Motor Control
The MC9S08DV60AMLC supports DC and BLDC motor control in appliances, pumps, and fans where an 8-bit controller suffices. The S08 core executes commutation and speed-loop code within 50 us control periods at its 20 MHz bus clock, and its 60 KB flash leaves room for sensorless startup algorithms, fault tables, and serial diagnostics. PWM modules generate the phase drive signals while the ADC samples back-EMF and bus current for closed-loop commutation. The embedded CAN interface allows networked motor modules in conveyors and HVAC air handlers to report speed and fault status to a supervisory controller. Overcurrent protection should be implemented in hardware external to the MCU, since response time of software-only protection is too slow for short-circuit events.
Empfohlen
Lighting Control Modules
Automotive and architectural lighting controllers benefit from the MC9S08DV60AMLC's combination of CAN connectivity and PWM generation. Interior lighting modules use the MCU to interpret switch and LIN/CAN commands, execute fade-in and fade-out curves stored in the 60 KB flash, and drive LED strings or incandescent loads via external drivers. The 40 MHz core time-multiplexes multiple channels with microsecond resolution, supporting color-mixing and breathing effects. Diagnostics such as open-load and short-circuit detection run in firmware between PWM cycles, using the on-chip ADC to monitor current-sense amplifiers. The 32-LQFP 7 x 7 mm package keeps PCB area small for integration into lamp housings. Verify AEC qualification level requirements for the specific lighting program.
Empfohlen
Legacy Board Maintenance and Repair
Because the MC9S08DV60AMLC is NRND but still shipped by NXP, it plays a key role in maintaining existing automotive and industrial boards rather than new designs. Repair shops and end-of-line service organizations source the part through DigiKey and Mouser to repair ECU-style modules, CAN nodes, and control boards already deployed in the field. The same-family 32-LQFP variants MC9S08DV48AMLC (48 KB) and DV32 (32 KB) provide backup substitution paths when 60 KB stock runs out, provided the deployed firmware image fits the smaller flash. When re-flashing replacements, use the BDM background debug interface with NXP's CodeWarrior or third-party S08 programmers, and preserve the original calibration data from the failed unit.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S08DV60AMLC – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S08DV48AMLC | S9S08DV32F1MLC | MC9S08DV60AMLH |
|---|---|---|---|---|
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 64-LQFP - different pinout |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Memory | 60 KB | 48 KB | 32 KB | 60 KB |
| CPU Frequency | 40 MHz (20 MHz bus) | 40 MHz | 40 MHz | 40 MHz |
| Embedded CAN | Yes | Yes | Yes | Yes |
| Pin-to-Pin Drop-In | - | Yes - same 32-LQFP footprint | Yes - same 32-LQFP footprint | No - 64-pin package |
Wichtigste Unterscheidungsmerkmale
- Largest flash in the 32-LQFP DV family footprint (vs. MC9S08DV48AMLC)
- Integrated CAN in an 8-bit MCU (vs. S9S08DV32F1MLC)
- Trade-off: NRND lifecycle status (vs. MC9S08DV48AMLC)
Designhinweise
The MC9S08DV60AMLC is NRND per NXP's official product page as of 2026-10-18. Do not use it in new designs; NXP may issue a last-time-buy notice with limited warning. For new projects, evaluate current NXP MCUs, and for existing boards, qualify the MC9S08DV48AMLC as a 32-LQFP backup if your firmware image fits 48 KB flash - verify this early, because code growth over time may exceed the smaller device.
Estimated: confirm the supply voltage range and maximum current draw against the MC9S08DV60 series datasheet before designing the power tree, since these figures were not present in the verified web data for this exact orderable part. Decouple VDD with a 0.1 uF ceramic capacitor placed within 5 mm of the pin plus a bulk 4.7-10 uF capacitor, per standard HCS08 family layout practice in the datasheet application sections.
The 32-LQFP (7 x 7 mm) package exposes no thermal pad, so all heat exits through the pins - not a concern at typical S08 current levels. Route the CAN_TX/CAN_RX traces to the transceiver as short as practical and place the BDM debug header (typically 4-6 pins) on every production board; on-chip debug via the BGND instruction is the only flash-programming path, and omitting the header makes field reflashing impossible.
Compliance-Informationen
NXP product page lists an Environmental Quality section for this part, but specific RoHS/REACH/lead-free values were not present in the verified web data; consult the NXP part page for current environmental compliance data.