MC9S08GT32ACFBE - 8-bit S08 MCU 40MHz 32KB Flash | NXP
Teilenummer: MC9S08GT32ACFBE ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.2 | $4,20 |
| 10 | $3.85 | $38,50 |
| 100 | $3.4 | $340,00 |
| 500 | $3.05 | $1.525,00 |
| 1.000 | $2.75 | $2.750,00 |
MC9S08GT32ACFBE Übersicht
An 8-bit microcontroller (MCU) is a single integrated circuit that combines a processor core, program memory, data memory, and peripherals such as timers, serial communication interfaces, and analog-to-digital converters. Within the power-management hierarchy of embedded systems, a general-purpose MCU sits at the control layer, executing application firmware to manage sensors, actuators, and communication in a product. The MC9S08GT family belongs to NXP's (formerly Freescale) S08 architecture, an enhanced successor to the HC08 instruction set.
Key features of the MC9S08GT32ACFBE include the enhanced HCS08 CPU core with the added BGND instruction, support for up to 32 interrupt/reset sources, software-selectable pull-ups on ports when used as inputs, and a supply voltage range of 1.8 V to 3.6 V per parametric listings. The CISC core executes HC08-compatible code, easing migration from legacy HC08 designs. On-chip Flash allows in-circuit reprogramming, and the 4 KB RAM provides working memory for protocol stacks and control loops.
Technically, the device integrates typical S08GT modules such as the serial peripheral interface (SPI), serial communications interface (SCI), IIC bus, and timer/PWM modules, along with a 10-bit ADC, enabling single-chip designs that previously required external components. The 40 MHz internal bus-clock capability supports computationally demanding 8-bit tasks while retaining the low power modes expected of the family.
Typical applications include industrial control panels, consumer appliance interfaces, motor control helpers, battery chargers, and legacy HC08 upgrade paths where code compatibility and cost are priorities.
A key design consideration: this part is listed by NXP as End of Life, so new designs should evaluate family alternatives or plan last-time-buy inventory; existing designs should verify PCN notices from NXP.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single decision-ready reference. Pricing references are as of 2026-10-18.
Drop-in-Alternativen für MC9S08GT32ACFBE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S08GT32ACFBE (gleiche Bauform und Footprint) – abweichend in Package, Flash Memory, Lifecycle Status, Core Processor, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S08GT32ACBE
✅ Drop-In✓ Auf Lager
$4.1 / Stück
Datenblatt ansehen →MC9S08GT16CFBE
✅ Drop-In✓ Auf Lager
$4.65 / Stück
Datenblatt ansehen →MC9S08GT60CFBE
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S08GT16CFDE
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC9S08GT60CFDE
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$8.75 / Stück
Datenblatt ansehen →MC9S08GT32ACFBE Grenzwerte & elektrische Eigenschaften
| Core Processor | S08 (HCS08) 8-bit CISC |
| Core Size | 8-bit |
| Maximale Taktfrequenz | 40 MHz |
| Flash Memory | 32 KB (32K x 8) |
| RAM Size | 4 KB |
| Supply Voltage Range | 1.8 V to 3.6 V |
| Nominal Supply Voltages | 2.5 V / 3.3 V |
| Number of I/O | 34 |
| Interrupt/Reset Sources | Up to 32 |
| Instruction Set | HC08-compatible with added BGND instruction |
| Port Pull-ups | Software selectable when used as inputs |
| Gehäuse | 44-QFP (PQFP), 10 x 10 mm |
| Montageart | Surface Mount |
| Packaging | Tray |
| Family | MC9S08GT (S08 general purpose) |
| Lebenszyklusstatus | End of Life (per NXP product page) |
MC9S08GT32ACFBE 44-qfp (pqfp), 10 x 10 mm Pinbelegungsleitfaden
Pinbelegung für MC9S08GT32ACFBE (44-qfp (pqfp), 10 x 10 mm-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC9S08GT32ACFBE.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC9S08GT32ACFBE ist geeignet für 6 Anwendungs: Industrial Control Panels, Home Appliance User Interfaces, Battery-Powered Portable Devices, Small Motor Control (DC/Stepper), Legacy HC08 System Upgrades, Building Automation Sensor Nodes.
Industrial Control Panels
The MC9S08GT32ACFBE fits industrial control panel applications where an 8-bit MCU must sequence relays, read switches, and drive status indicators. Its 40 MHz HCS08 core executes deterministic control loops, while 34 software-pullup I/O lines directly interface keypads and limit switches without external resistors. The 32 KB Flash holds protocol and ladder-style firmware with room to spare, and the 1.8 V to 3.6 V supply suits isolated 3.3 V logic domains. Placed as the panel's main controller with SPI-connected peripherals, it delivers low EMI (no switching regulator on-die) and single-chip integration; the trade-off is 8-bit arithmetic throughput, so heavy math belongs in external logic or a 16/32-bit upgrade.
Empfohlen
Home Appliance User Interfaces
Appliance UI boards - washers, microwaves, cooktops - are a classic S08GT deployment. The MC9S08GT32ACFBE scans touch or membrane keypads using its software-selectable input pull-ups, multiplexes LED or segment displays via timer PWM, and manages buzzer feedback, all from one 44-QFP chip. Its 40 MHz core comfortably services 1-4 ms keypad scan and display refresh loops, and the 4 KB RAM holds state machines and fault logs. Operating from a 3.3 V rail derived from the appliance's power supply, it draws low quiescent current in stop mode for standby-energy compliance. Because the instruction set is HC08-compatible, legacy HC08 appliance firmware migrates with minor changes, shortening development cycles.
Empfohlen
Battery-Powered Portable Devices
With a 1.8 V to 3.6 V supply range and S08 low-power stop/wait modes, the MC9S08GT32ACFBE suits battery-powered handheld instruments, meters, and remote controls. Running from two alkaline cells or a single lithium cell through an LDO, the MCU wakes on IRQ or keyboard interrupt, samples a sensor via its ADC, updates an LCD, and returns to stop mode. The 40 MHz core allows burst processing that keeps awake-time short, directly extending battery life, while the 32 KB Flash stores logging tables and calibration data. Design consideration: verify the EOL status means long-term battery-replacement designs should pre-buy inventory or port to an active S08 part such as the S08PT series.
Empfohlen
Small Motor Control (DC/Stepper)
The MC9S08GT32ACFBE controls brushed-DC and small stepper motors using its timer/PWM channels to generate drive waveforms and its 34 I/O lines for H-bridge direction and enable signals. The 40 MHz HCS08 core executes PI speed loops at multi-kHz rates, and the ADC reads current-sense or potentiometer feedback for closed-loop operation. Its deterministic CISC core avoids the interrupt-latency jitter of faster but more complex cores, beneficial for commutation timing. For simple PWM-plus-direction schemes it is fully sufficient; for sensorless BLDC field-oriented control, the 8-bit multiply throughput becomes the limit, and an NXP DSC such as the MC56F8357 is the recommended migration target while retaining NXP tooling.
Empfohlen
Legacy HC08 System Upgrades
The MC9S08GT32ACFBE is an ideal modernization target for designs still using HC08 devices such as the MC68HC908 family, because the enhanced S08 core executes HC08 instructions with the added BGND background-debug instruction. Existing HC08 C or assembly code ports with minimal changes, and the on-chip background debug controller (BDM) replaces the obsolete monitor-mode erase/program flow, cutting development time. The 32 KB Flash offers roughly an order of magnitude more program space than typical HC08 parts, letting engineers add communication (IIC, SPI, SCI) features that the legacy part could not hold. The 44-QFP footprint also aligns with legacy QFP land patterns for easy respin.
Empfohlen
Building Automation Sensor Nodes
In building automation, the MC9S08GT32ACFBE serves as a sensor and actuator node MCU reading temperature, humidity, or occupancy inputs through its ADC and digital I/O, then reporting over an SCI or IIC link to a network controller. Its low-voltage 1.8 V to 3.6 V operation pairs with energy-harvesting or battery-backed supplies, and stop-mode currents keep standby draw minimal between polling events. The 32 KB Flash accommodates a modest protocol stack plus compensation tables, while 4 KB RAM buffers telemetry frames. Up to 32 interrupt/reset sources let one node manage several alarm inputs. Given the EOL status, new node designs should consider the active S08PT or Kinetis L (MKL02Z16VFG4) families instead.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S08GT32ACFBE – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S08GT32ACBE | MC9S08GT16CFBE | MC9S08GT60CFBE |
|---|---|---|---|---|
| Package | 44-QFP (10x10 mm) | 44-QFP (10x10 mm) - same | 44-QFP (10x10 mm) - same | 44-QFP (10x10 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | S08 (HCS08) 8-bit CISC | S08 8-bit CISC | S08 8-bit CISC | S08 8-bit CISC |
| Max Clock Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash Memory | 32 KB | 32 KB | 16 KB | 60 KB |
| Supply Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V |
| Lifecycle Status | End of Life | EOL / restricted stock | EOL / restricted stock | EOL / restricted stock |
Wichtigste Unterscheidungsmerkmale
- Identical die to the GT32 base variant (vs. MC9S08GT32ACBE)
- More program headroom without PCB change (vs. MC9S08GT16CFBE)
- Cost-optimized for tight firmware (vs. MC9S08GT60CFBE)
Designhinweise
The MC9S08GT32ACFBE operates from 1.8 V to 3.6 V, so a 3.3 V LDO-fed rail is the standard design point. Decouple VDD with a 0.1 uF ceramic capacitor placed within a few millimeters of the pin, plus a 4.7-10 uF bulk capacitor near the regulator. Remember that I/O is NOT 5 V tolerant - if the board must talk to legacy 5 V peripherals, add series resistors with clamp diodes or a level translator. Verify regulator dropout at worst-case load, since S08 run-mode current plus I/O sink current can approach the budget on small LDOs.
This part is End of Life per the NXP product page, and the NXP Community forum reports rapidly rising prices. Before releasing a new PCB revision with this MCU, verify lifecycle status on the official NXP page and review the discontinuance/Product Change Notice documents linked there. Plan a last-time-buy sized to your field-service horizon (typically 5-10 years) or design the footprint so GT16/GT60 same-footprint variants can be stuffed - all share the 44-QFP land pattern, making a Flash-size swap a BOM-only change.
The 44-QFP (10x10 mm, 0.8 mm pitch) is hand-solderable and inspectable, but keep trace lengths short on the oscillator and BGND debug lines. Reserve footprint pads for the background debug connector (6-pin BDM header) - the S08 BGND instruction and on-chip debug controller make in-circuit flashing straightforward, and retrofitting a header after layout is costly. Use software-selectable input pull-ups on keypad port pins to eliminate external resistor networks; enable them in GPIO initialization before reading inputs to avoid floating-node glitches.
At 40 MHz core operation, keep clocked I/O stubs under a few centimeters and ground-return paths continuous beneath high-activity buses. For EMC-sensitive appliance environments, use the S08's software-controlled slew/pull options and add series termination (33-100 ohm) on long LED-multiplex lines. The CISC core draws current bursts synchronized to the bus clock, so a solid ground plane under the QFP center is a low-cost way to contain emissions and pass conductive-appliance EMC screening.
Compliance-Informationen
Compliance status not stated in provided web data; verify on the NXP product page Environmental/Quality section. The FBE suffix generally indicates lead-free RoHS packaging in NXP ordering codes, but this must be confirmed from official documentation.
