NXP Semiconductors

MC9S12D64CFUE - HCS12 16-bit MCU, 64KB Flash, 80-QFP | NXP

Teilenummer: MC9S12D64CFUE ✗ Abgekündigt
Auf Lager Versand in 1–3 Werktagen
2.5 V / 5 V Vdss 80-QFP (14 x 14 mm) Package 25 MHz Speed 64 KB (64K x 8) Memory
Ab $16.2 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-18
Mengenpreise
Menge Stückpreis Gesamt
1 $35.76 $35,76
10 $28.5 $285,00
100 $22.4 $2.240,00
500 $18.9 $9.450,00
1.000 $16.2 $16.200,00
ℹ️ Alle Preise sind in USD

MC9S12D64CFUE Übersicht

The NXP MC9S12D64CFUE is a 16-bit microcontroller based on the enhanced HCS12 CPU core with CISC architecture, operating at a maximum bus frequency of 25MHz and packaged in an 80-pin QFP (14x14 mm). It integrates 64KB of on-chip Flash program memory, 4KB of RAM, 1KB of EEPROM, an 8-channel 10-bit ADC, and 59 general-purpose I/O pins for embedded automotive and industrial control applications.

A microcontroller (MCU) is a single-chip computer that combines a CPU core, program and data memory, peripherals, and I/O on one die. The HCS12 family targets automotive body, chassis, and powertrain control, where deterministic interrupt response and robust on-chip peripherals reduce external component count. The MC9S12D64CFUE sits in the middle of the HCS12D sub-family and is widely used as a step up from smaller HCS12 parts when more code space or peripheral channels are required.

Key features include a 25 MHz HCS12 core delivering 25 MIPS of throughput, 64KB of in-application re-programmable Flash with security features, 1KB byte-erasable EEPROM for non-volatile data, 4KB RAM, and a 10-bit 8-channel successive-approximation ADC suitable for sensor interfaces. Communication peripherals include 2 SCI (UART), SPI, and an I2C-compatible MSCAN module. The 80-pin QFP package exposes 59 digital I/O lines plus analog and timer pins.

Architecturally, the MC9S12D64CFUE uses a 16-bit HCS12 CPU with integrated background debug mode (BDM), advanced timer modules (TIM/ECT/PWM), and a periodic interrupt timer. The device operates from a single 5V supply (with internal 2.5V regulator for core) and supports low-power Stop and Wait modes for quiescent-current-sensitive designs.

Typical applications include automotive body controllers, instrument clusters, HVAC modules, sensor interface nodes, industrial PLCs, and CAN-connected distributed control nodes. The integrated MSCAN controller provides ISO 11898 compliant CAN 2.0A/B connectivity for in-vehicle networking.

When designing with this part, ensure the BDM port is brought out to a 6-pin header for in-circuit debugging. Plan oscillator and reset circuit layout per the device guide so that the internal PLL locks reliably across the operating temperature range.

This page synthesizes current distributor pricing, pin- and parameter-compatible alternatives from the HCS12 family, lifecycle status (NRND), and practical design guidance not aggregated in the manufacturer datasheet alone.

Drop-in-Alternativen für MC9S12D64CFUE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12D64CFUE (gleiche Bauform und Footprint) – abweichend in RAM Size, Package, Program Memory Size, Connectivity, EEPROM Size.

NXP Semiconductors
RAM Size: 4 KB (4K x 8)
Program Memory Size: 64 KB (64K x 8) Flash
Connectivity: CAN, I2C, SCI (UART), SPI
Vergleichen mit MC9S12D64CFUE →
NXP Semiconductors
RAM Size: 2 KB
Vergleichen mit MC9S12D64CFUE →
NXP Semiconductors
Package: 80-QFP (14x14 mm)
Vergleichen mit MC9S12D64CFUE →
NXP Semiconductors
RAM Size: 4 KB
Program Memory Size: 64 KB (64K x 8) Flash
Vergleichen mit MC9S12D64CFUE →
NXP Semiconductors
RAM Size: 4 KB
Program Memory Size: 64 KB (64K x 8) Flash
Connectivity: CAN, SCI, SPI
Vergleichen mit MC9S12D64CFUE →
NXP Semiconductors
Package: 80-QFP (14 x 14 mm), also called PQFP-80
Program Memory Size: 64 KB (64K x 8)
Vergleichen mit MC9S12D64CFUE →
NXP Semiconductors
Package: 80-QFP (14 x 14 mm), also called PQFP-80
Program Memory Size: 64 KB (64K x 8)
Vergleichen mit MC9S12D64CFUE →
NXP Semiconductors
RAM Size: 8 KB
Package: 80-QFP (14x14 mm)
Program Memory Size: 128 KB (128K x 8) FLASH
Vergleichen mit MC9S12D64CFUE →
NXP Semiconductors
RAM Size: 8K x 8
Package: 80-QFP (14x14 mm), LQFP-80
Program Memory Size: 128KB (128K x 8)
Vergleichen mit MC9S12D64CFUE →
NXP Semiconductors
RAM Size: 16 KB
Package: 80-QFP (14x14 mm)
Program Memory Size: 256 KB (256K x 8) Flash
Vergleichen mit MC9S12D64CFUE →
NXP Semiconductors
RAM Size: 4 KB (4K x 8)
Program Memory Size: 64 KB (64K x 8)
Connectivity: EBI/EMI, I²C, SCI, SPI
Vergleichen mit MC9S12D64CFUE →
NXP Semiconductors
Package: 80-pin QFP (QFU)
Vergleichen mit MC9S12D64CFUE →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S12E64CFUER

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14)
HCS12 · 16-Bit · 25 MHz · 64 KB (64K x 8) · FLASH · 4 KB (4K x 8) · Not available on this part · 60

✓ Auf Lager

$7.4 / Stück

Datenblatt ansehen →

MC9S12A64CFUE

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14)
NXP Semiconductors · HCS12 (S12A family) · HCS12 · 16-bit · CISC · 25 MHz · 64 KB (64K x 8) Flash · 4 KB (4K x 8)

✓ Auf Lager

$21.95 / Stück

Datenblatt ansehen →

MC9S12DB128CFUE

✅ Drop-In
NXP Semiconductors
📦 80-QFP (14x14)
HCS12 (16-bit CISC) · S12D / HCS12DB · 16 bit · 25 MHz · 128 KB (128K x 8) FLASH · 8 KB · 2 KB · 2.5 V / 5 V

✓ Auf Lager

$14.85 / Stück

Datenblatt ansehen →

MC9S12E256CFUE

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 80-QFP (14x14)
NXP Semiconductors (formerly Freescale) · HCS12 / MC9S12E · HCS12 (16-bit) · 16-bit · 25 MHz · 256 KB (256K x 8) Flash · 16 KB · 4 KB

✓ Auf Lager

$9.75 / Stück

Datenblatt ansehen →

MC9S12DG128VFUE

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 80-QFP (14x14)
HCS12 (16-bit CISC) · 16-bit · 25 MHz · 128KB (128K x 8) · FLASH · 8K x 8 · 2K x 8 · CANbus, I2C, SCI, SPI

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

MC9S12D64CFUE Grenzwerte & elektrische Eigenschaften

Core HCS12 (16-bit CISC)
Maximum CPU Frequency 25 MHz
Program Memory (Flash) 64 KB (64K x 8)
RAM 4 KB
EEPROM 1 KB
Number of I/O 59
ADC 8-channel, 10-bit
Versorgungsspannung 2.5 V / 5 V
Gehäuse 80-QFP (14 x 14 mm)
Montageart Surface Mount
Communication Peripherals 2x SCI (UART), SPI, I2C, MSCAN (CAN 2.0A/B)
Timers ECT, TIM, PWM, PIT
Packaging Tray

MC9S12D64CFUE Pin-Konfiguration

QFP-100 Package Pinout Diagram QFP-100 14x14mm, P0.5mm, JEDEC MS-026. 1 25 QFP-100
Pin 1 VRH — ADC high reference voltage input
Pin 5 VDDR — External voltage regulator supply
Pin 6 VDD — Digital supply voltage
Pin 7 VSS — Digital ground
Pin 8 VDDPLL — PLL supply voltage
Pin 9 VSSPLL — PLL ground
Pin 10 XCLKS — Crystal oscillator mode select
Pin 11 EXTAL — External clock / crystal connection
Pin 12 XTAL — Crystal oscillator connection
Pin 13 RESET — Reset input (active low)
Pin 15 TEST — Test mode input (must be tied high for normal operation)
Pin 16 BKGD — Background Debug Mode pin
Pin 20 PAD0 — Port AD bit 0 / AN0 / ATD analog input
Pin 40 PA0 — Port A bit 0 / general-purpose I/O
Pin 60 PJ6 — Port J bit 6 / CAN0_TX
Pin 65 PE0 — Port E bit 0 / CAN0_RX (SCI/PS5)
Pin 70 PM0 — Port M bit 0 / general-purpose I/O

Typische Anwendungen

MC9S12D64CFUE ist geeignet für 6 Anwendungs: Automotive Body Control Modules, Automotive Instrument Clusters, HVAC Climate Control Modules, Industrial CAN Sensor Nodes, Sensor Interface and Data Acquisition, Two-Wheeler and Powersport ECUs.

🚗

Automotive Body Control Modules

The MC9S12D64CFUE suits BCM applications because its HCS12 16-bit core at 25 MHz, 59 GPIO, and integrated MSCAN controller can drive body-domain loads including lighting, wipers, and central locking. The device's 5V operating range is natively compatible with 12V automotive battery rail after regulation, and the 8-channel 10-bit ADC reads interior sensor inputs (temperature, ambient light, seat-occupancy switches). Designers benefit from 64KB Flash for body-control application logic plus 1KB EEPROM for trim/radio-learned parameters without an external serial EEPROM. Its NRND status still allows continued manufacture for established BCM product lines where redesign is not scheduled.

🚗

Automotive Instrument Clusters

The MC9S12D64CFUE drives instrument-cluster stepper-motor gauges, telltale indicators, and CAN-linked display data. The HCS12 core at 25 MHz provides deterministic loop time for gauge algorithms while the ECT/PWM modules generate the stepper drive waveforms that position indicator needles. The MSCAN controller receives vehicle-network state (RPM, speed, fuel level) from powertrain ECUs, allowing the cluster to be a passive display node. The 64KB Flash budget fits cluster software including indicator calibration tables, and the 4KB RAM supports gauge state retention through ignition cycles. This makes the MC9S12D64CFUE a strong fit for entry-to-mid cluster designs.

🏭

HVAC Climate Control Modules

Climate-control modules use the MC9S12D64CFUE for cabin-temperature regulation, blower-speed control, and blend/door actuation. The 8-channel 10-bit ADC reads cabin-temperature NTC sensors, ambient sensors, and in-vehicle sunload sensors; the ECT timer drives TRIAC or MOSFET-based blower-speed PWM control. The 59 GPIO pins easily accommodate multi-zone flap motor relays, while 1KB EEPROM stores user settings (last temperature, fan profile, AUTO mode). The 64KB Flash supports calibration routines and diagnostic service routines via MSCAN-based UDS stacks. HCS12 deterministic interrupt response ensures reliable flap-loop execution under complex control sequencing.

🏭

Industrial CAN Sensor Nodes

Industrial CANopen or DeviceNet field nodes benefit from the MC9S12D64CFUE's integrated MSCAN and 10-bit ADC. The HCS12 core at 25 MHz executes CANopen CiA-301/401 stack plus application logic within 64KB Flash, while 4KB RAM buffers PDO messages. The 8 ADC channels multiplex pressure, temperature, and flow sensors into a single CAN node; 59 GPIO handles actuator outputs and discrete inputs. Robust against industrial EMI when paired with isolated CAN transceivers and TVS protection. The 5V supply matches industrial 24V systems after buck regulation, and the ECT module generates precise timing for sensor-acquisition loops.

🖥️

Sensor Interface and Data Acquisition

Multi-sensor acquisition front-ends use the MC9S12D64CFUE for ADC-and-CAN data aggregation. The 8-channel 10-bit ADC reads thermocouples, RTDs (with external excitation), pressure transducers, and potentiometer-bridged sensors; the MSCAN controller publishes processed values to a vehicle/plant CAN bus at 125 kbps or 500 kbps. The 64KB Flash can hold linearization tables, calibration coefficients, and diagnostic routines in production-grade firmware. The 1KB EEPROM supports service-mode calibration storage over the device lifecycle, while the HCS12 CISC instruction set enables bit-field manipulation for digital-input debouncing.

🚗

Two-Wheeler and Powersport ECUs

Motorcycle and powersport ECUs leverage the MC9S12D64CFUE's compact 80-QFP package, CAN connectivity, and 5V operation to deliver fuel/spark control plus body functions. The 16-bit HCS12 core at 25 MHz supports 16 MHz input-clock operation in vehicle-grade temperature ranges; the ECT/PWM units drive ignition coils and injector stages. The integrated MSCAN port interfaces to motorcycle instrument clusters and diagnostic tools using UDS/KWP2000 protocols. Field-proven Flash and EEPROM allow on-the-fly calibration updates via the BDM or CAN bootloader, making the MC9S12D64CFUE a long-standing member of powersport ECU designs.

Zusammenfassung der empfohlenen Produkte

TJA1050T High-speed CAN transceiver for body-network physical layer Verwendet in: Automotive Body Control Modules MC9S12DT128MPVE NXP Semiconductors Verwendet in: Automotive Body Control Modules, Sensor Interface and Data Acquisition TJA1040T High-speed CAN transceiver for cluster-to-CAN-bus connection Verwendet in: Automotive Instrument Clusters MC9S12XEQ384CAG NXP Semiconductors Verwendet in: Automotive Instrument Clusters MC9S12DG128MPV NXP Semiconductors Verwendet in: HVAC Climate Control Modules TLE7259-3GE LIN transceiver for HVAC actuator nodes Verwendet in: HVAC Climate Control Modules TJA1051T Industrial-grade CAN transceiver with improved ESD/EMI immunity Verwendet in: Industrial CAN Sensor Nodes MC9S12DG128VFUE NXP Semiconductors Verwendet in: Industrial CAN Sensor Nodes PCA82C250T Classic CAN physical layer for sensor-hub designs Verwendet in: Sensor Interface and Data Acquisition MC9S12E64CFUE Active-product successor in same QFP-80 package Verwendet in: Two-Wheeler and Powersport ECUs TJA1057T CAN transceiver with high ESD rating suitable for motorcycle environments Verwendet in: Two-Wheeler and Powersport ECUs
What is the core architecture of the MC9S12D64CFUE microcontroller?
The MC9S12D64CFUE uses the enhanced HCS12 16-bit CISC CPU core. According to NXP product information, the device operates at a maximum bus frequency of 25MHz, delivering roughly 25 MIPS throughput per MHz of clock. The HCS12 core supersedes the HC12 and HC11 families with enhanced addressing modes and a background debug module (BDM) for non-intrusive in-circuit debugging, making the MC9S12D64CFUE suitable for automotive and industrial control.
How much Flash and RAM does the MC9S12D64CFUE have?
The MC9S12D64CFUE integrates 64KB of in-application programmable Flash (64K x 8) and 4KB of static RAM. Per distributor data, the device additionally provides 1KB of byte-erasable EEPROM for non-volatile parameter storage. The 64KB Flash tier sits above the smaller HCS12D parts (32KB) and below the 128KB D-family devices, making the MC9S12D64CFUE a mid-density option for embedded control.
Where can I buy the MC9S12D64CFUE online and what is the lead time?
The MC9S12D64CFUE can be purchased through authorized distributors including DigiKey, Mouser, LCSC, and Rochester Electronics (for NRND stock reallocation). Pricing as of 2026-10-19 starts at approximately $35.76 for qty-1 at LCSC, with tier-breaks at qty 10, 100, 500, and 1000. Lead times for NRND parts commonly run 12-26 weeks because new production has been phased down; sourcing via authorized distributors or franchised aftermarket suppliers is recommended.
What is the price of the MC9S12D64CFUE in qty 100?
As of 2026-10-19, the MC9S12D64CFUE at qty 100 prices approximately $22.40 per unit based on combined distributor data. At qty 1 the unit price is approximately $35.76 (LCSC), and at qty 1000 it drops to roughly $16.20. Pricing varies with distributor, packaging, and authenticated lot, so request a fresh quote for current production date-code needs.
Is the MC9S12D64CFUE still in production or NRND?
The MC9S12D64CFUE is currently classified NRND (Not Recommended for New Designs) per NXP's product page. The part remains available through authorized distributors and through Rochester Electronics authorized stock, but NXP recommends designing new platforms with active successors. Designers starting new projects should evaluate the active S12 and S12X families for long-term availability.
MC9S12D64CFUE vs MC9S12E64CFUE - which one should I choose?
Both the MC9S12D64CFUE and MC9S12E64CFUE share the same 80-QFP (14x14) package and 16-bit HCS12 core, both with 64KB Flash and 25MHz bus. The MC9S12E64CFUE is the actively-marketed successor in the E-series, with extended peripheral integration and an updated mask set, while the D64CFUE is the established field-proven baseline. For new designs prefer the E64 variant; for legacy service and direct footprint-compatibility with installed D64 boards, the D64CFUE remains a viable same-package drop-in.
Can the MC9S12A64CFUE replace the MC9S12D64CFUE directly?
The MC9S12A64CFUE shares the same 80-QFP (14x14 mm) package and identical 64KB Flash, 4KB RAM, 25 MHz HCS12 core, 8-channel 10-bit ADC, and 59 I/O pins as the MC9S12D64CFUE. Per parametric comparison data, both parts are pin-compatible at the package level. Some peripheral and interrupt vector map changes may apply between the A and D sub-families, so verify firmware compatibility against the A64 device user guide before substituting on existing firmware.
What is the best drop-in replacement for the MC9S12D64CFUE?
The closest same-package, pin-to-pin drop-in for the MC9S12D64CFUE is the MC9S12E64CFUE, which keeps the same 80-QFP (14x14 mm) footprint, 64KB Flash, 4KB RAM, 25 MHz core, and identical peripheral set in the E-series mask set. For designs that need an active-life successor with the same package, the E64CFUE is preferred; the A64CFUE is also pin-compatible with the same memory map but originates from an earlier HCS12A sub-family mask revision.
Where can I download the MC9S12D64CFUE datasheet PDF?
The official datasheet (MC9S12DJ64 Device User Guide) is published by NXP and available from nxp.com; third-party mirrors such as alldatasheet.com and digchip.com also host the PDF. The user guide provides electrical characteristics, package pinout, peripheral registers, and BDM/debug interface details for the MC9S12D64CFUE. For development tools, CodeWarrior IDE and P&E Micro BDM interfaces are documented in the same family.
Where to find the MC9S12D64CFUE pinout diagram?
The pinout for the MC9S12D64CFUE is documented in the MC9S12DJ64 Device User Guide and lists all 80 pins of the QFP-80 (14x14 mm) package. The package uses standard QFP numbering starting at the top-left marker; the user guide includes a per-pin function table covering VDD, VSS, I/O ports PA-PT, XTAL, ECLK, RESET, and BDM signals. Request the diagram from NXP product page or distributor resources for the latest revision.
Does the MC9S12D64CFUE support CAN bus communication?
Yes, the MC9S12D64CFUE integrates an MSCAN module that implements the Bosch CAN 2.0A and 2.0B protocol as defined by ISO 11898. According to the NXP HCS12 family specifications, the integrated CAN controller handles transmit/receive buffering and acceptance filtering, and connects to an external physical layer transceiver (e.g., TJA1050 or TJA1040). This makes the MC9S12D64CFUE suitable for automotive body and chassis networking, as well as industrial CANopen and DeviceNet nodes.
What ADC channels does the MC9S12D64CFUE provide?
The MC9S12D64CFUE includes an 8-channel 10-bit successive-approximation analog-to-digital converter. The 8 channels are multiplexed to the ATD peripheral pads and support 10-bit resolution with configurable conversion sequences. This channel count is adequate for typical automotive sensor interfaces (temperature, pressure, throttle position) and for industrial sensor hubs that read multiple analog transducers.
What package is the MC9S12D64CFUE and what is the body size?
The MC9S12D64CFUE is housed in an 80-pin QFP (Quad Flat Pack) package measuring 14 x 14 mm with 0.65 mm lead pitch. The surface-mount package is supplied in Tray packaging per distributor data. The 80-QFP form factor has been the industry-standard package for many HCS12 derivatives, allowing PCB reuse across the D, A, E, and DJ sub-families in the MC9S12 family.
How does the MC9S12D64CFUE compare to the MC9S12DT128MPVE?
Both parts are HCS12 family members, but the MC9S12DT128MPVE offers 128KB Flash (versus 64KB in the D64), more RAM, and is housed in a 112-pin LQFP package. The MC9S12D64CFUE fits lower-density, 80-pin designs. For new designs needing 128KB or more Flash, the DT128 family is the natural upgrade; the D64CFUE remains preferred where cost and pin count matter and 64KB code is sufficient.
Is the MC9S12D64CFUE suitable for new product designs?
NXP classifies the MC9S12D64CFUE as NRND, meaning it is not recommended for new designs but remains supported for existing platforms. New product programs should evaluate active members of the HCS12 and S12X families for long-term availability and tooling support. The MC9S12D64CFUE is well-suited to legacy maintenance, field replacement, and designs where the part's lifecycle risk is acceptable.

Technische Referenzdaten für MC9S12D64CFUE – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MC9S12D64CFUE for established automotive and industrial applications where the HCS12 16-bit CISC core at 25 MHz with 64KB Flash, 4KB RAM, 8-channel 10-bit ADC, and integrated MSCAN CAN controller suffice. The NRND status means designers should validate supply-chain continuity for new platforms, but does not preclude using the part in production where stock is available and tooling is mature. The same-package E64CFUE is the active successor for forward-looking designs; the DB128CFUE and E256CFUE are bigger Flash upgrades; the A64CFUE is a near-equivalent mask option from an earlier HCS12 sub-family. Pick the D64CFUE when cost, footprint stability, and proven firmware matter more than latest silicon revision.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S12E64CFUE MC9S12A64CFUE MC9S12DB128CFUE MC9S12E256CFUE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 80-QFP (14x14 mm) 80-QFP (14x14 mm) - same 80-QFP (14x14 mm) - same 80-QFP (14x14 mm) - same 80-QFP (14x14 mm) - same
Core HCS12 16-bit CISC @ 25 MHz HCS12 16-bit CISC @ 25 MHz HCS12 16-bit CISC @ 25 MHz HCS12 16-bit CISC @ 25 MHz HCS12E 16-bit CISC @ 25 MHz
Flash 64 KB 64 KB 64 KB 128 KB (2x) 256 KB (4x)
Number of I/O 59 59 59 59 59
ADC 8-channel, 10-bit 8-channel, 10-bit 8-channel, 10-bit 8-channel, 10-bit 8-channel, 10-bit
Lifecycle Status NRND Active NRND NRND Active

Wichtigste Unterscheidungsmerkmale

  • NRND lifecycle with mature toolchain and firmware ecosystems (vs. MC9S12E64CFUE)
  • Identical 64KB Flash tier as MC9S12A64CFUE (vs. MC9S12A64CFUE)
  • Lower cost path than 128KB and 256KB Flash variants (vs. MC9S12DB128CFUE)
  • Single 5V supply operation reduces BOM vs 3.3V MCUs (vs. Generic ARM Cortex-M0 16-bit MCU alternatives)

Designhinweise

Power the MC9S12D64CFUE from a regulated 5V rail tied to VDD, VDDR, VDDPLL, and VDDF. The internal 2.5V regulator powers the core from VDDR. Decouple each VDD pair with a 100nF ceramic plus a 4.7uF bulk capacitor placed within 5mm of the pins; add a 1uF-2.2uF on VRH/VRH1 to keep the ADC reference stable. Order of power-up (VDDR before VDD) matters for PLL lock per the device guide; respect the 50ms VDD ramp requirement for clean reset.

Route XTAL/EXTAL traces as a tightly-coupled differential pair with ground guard on both sides, keeping trace length under 5mm and away from switching signals. Place the BDM connector (BKGD/MODC/RESET/VSS) within 2cm of the IC to avoid signal-integrity loss during debug. The 80-QFP package has 0.65mm pitch, so use fine-pitch land patterns and a solder-paste stencil of 0.15mm thickness for assembly yield.

Do not leave TEST pin floating: tie it to VDD through a 10k resistor so the device enters normal operation. The BKGD pin must idle high during reset; a weak pull-up plus the BDM connector helps. Watch the VDD/VSS boundary near pin 6/7: missing decoupling there is the most common cause of reset/POR instability. When using MSCAN, ensure the CAN transceiver supplies the recessive-dominant bit timing requirements - missing termination (120 ohm across CANH/CANL) is a frequent field-issue cause.

At full 25 MHz operation the MC9S12D64CFUE typically dissipates below 200 mW; the 80-QFP on a 4-layer FR4 PCB with continuous ground plane achieves thermal resistance theta_JA in the 50-60 C/W range, keeping junction-rise acceptable without explicit heatsinking. For high-ambient enclosures, add thermal vias under the die flag to spread heat into inner copper layers.

The MSCAN output edge rates are well-defined per the Bosch CAN spec, but PCB layout still matters: keep the CANH/CANL bus lengths matched within 3mm and avoid stubs longer than 30mm; add a split-ferrite common-mode choke on the bus entry if EMC is a concern. For PWM-driven motor or lighting loads, gate-driver edges can couple back through VDD - separate analog and digital grounds with a single-point bridge near the IC body.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Qualified
Bleifrei
Unknown
Halogenfrei
Unknown
Konfliktmineralien
Unknown

RoHS, REACH, lead-free, halogen-free, and AEC-Q100 grades were not confirmed in the verified web data for this part number; check NXP product page or manufacturer datasheet for definitive compliance status. Automotive applications typically require AEC-Q100 qualification - verify grade against the specific part number suffix before deployment.

Daten verifiziert am: 2026-10-19 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

NXP Semiconductors MC9S12D64CFUE MC9S12E64CFUE MC9S12A64CFUE MC9S12DB128CFUE MC9S12E256CFUE HCS12 16-bit microcontroller MCU CISC MSCAN CAN 2.0A/B ISO 11898 QFP-80 80-QFP PQFP Surface Mount Device EEPROM ADC Background Debug Mode BDM CodeWarrior IDE AEC-Q100 RoHS REACH instrument cluster body control module HVAC controller automotive sensor interface industrial CANopen
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