MC9S12DP512CPVE - 16-Bit 25MHz HCS12 MCU | NXP
Teilenummer: MC9S12DP512CPVE ✓ Aktiv| Menge | Stückpreis | Gesamt |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MC9S12DP512CPVE Übersicht
A microcontroller is a programmable embedded-control IC that integrates a CPU core, memory, peripherals, and I/O on one device. The MC9S12DP512CPVE belongs to the MC9S12D family of Flash-based automotive-oriented 16-bit controllers. This family is designed for multiplexing and control applications requiring a deterministic instruction set, extensive I/O, communication resources, and analog measurement channels. NXP describes the MC9S12D as a pin-compatible family that scales from 32 KB to 512 KB of Flash memory.
Key features include 512 KB internal Flash for firmware and data, a 25 MHz maximum operating frequency, and CISC-based HCS12 instruction processing. The device provides two 10-bit ADC channels groups, PWM outputs, enhanced timer capture, serial communications, interrupt control, clock generation, and bus interfacing. The 112-LQFP package exposes a large number of I/O and peripheral resources for automotive multiplexing and industrial embedded-control boards.
The MC9S12DP512CPVE is suitable for 2.5 V and 5 V device operation according to the supplied distributor and comparison data. Its large memory and peripheral set can support protocol handling, actuator control, sensor acquisition, and system management. Firmware portability should still be checked when moving between related S12 devices because memory maps, peripherals, startup code, and errata can differ.
The primary design consideration is package and software compatibility. The 112-LQFP footprint is not interchangeable with smaller MC9S12 packages, and related devices with different Flash sizes may not provide identical peripheral availability. Use the manufacturer datasheet and device errata when validating timing, pin multiplexing, and application behavior.
This product page combines the verified manufacturer product information, distributor specifications, datasheet references, and practical sourcing context for engineers evaluating this 16-bit automotive-oriented MCU.
Drop-in-Alternativen für MC9S12DP512CPVE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12DP512CPVE (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Program Memory Size, Package, ADC, Supply Voltage.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S12DP512CPV
✅ Drop-In✓ Auf Lager
$16.75 / Stück
Datenblatt ansehen →MC9S12DP512CPVER
✅ Drop-In✓ Auf Lager
$64.0452 / Stück
Datenblatt ansehen →MC9S12XDP512VAL
✅ Drop-In✓ Auf Lager
$11.1 / Stück
Datenblatt ansehen →MC9S12XA512VAL
✅ Drop-In✓ Auf Lager
$17.2 / Stück
Datenblatt ansehen →MC9S12XA512VAG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC9S12DP512CPVE Grenzwerte & elektrische Eigenschaften
| Product Type | 16-bit HCS12 CISC microcontroller |
| Maximum Operating Frequency | 25 MHz |
| Internal Flash Memory | 512 KB |
| Internal RAM | 12 KB |
| EEPROM | 4 KB |
| ADC | Two 8-channel, 10-bit ADCs |
| Serial Communication Interfaces | 2 asynchronous serial communication interfaces |
| Enhanced Capture Timer | 8-channel IC/OC enhanced capture timer |
| Pulse-Width Modulator | 8-channel PWM |
| General-Purpose I/O | 91 pins |
| Gehäuse | 112-pin LQFP (20x20) |
| Core Architecture | HCS12, CISC |
| Operating Supply | 2.5 V / 5 V |
| Montageart | Surface Mount |
| Series | MC9S12 |
| Speichertyp | Flash |
| Automotive Positioning | MC9S12D family designed for automotive multiplexing applications |
MC9S12DP512CPVE 112-pin lqfp (20x20) Pinbelegungsleitfaden
Pinbelegung für MC9S12DP512CPVE (112-pin lqfp (20x20)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC9S12DP512CPVE.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC9S12DP512CPVE ist geeignet für 6 Anwendungs: Automotive Multiplexing Controller, Automotive Body Control Module, Industrial Multiplexing Hub, Sensor Acquisition and Conditioning, Actuator and PWM Control System, Communication Gateway.
Automotive Multiplexing Controller
The MC9S12DP512CPVE fits automotive multiplexing control because the MC9S12D family is explicitly designed for that application class. Its 91 I/O pins provide extensive connectivity for distributed switches, sensors, and communication nodes, while dual 8-channel 10-bit ADCs support analog monitoring. The 512 KB Flash accommodates substantial networking, diagnostics, and control firmware. Two asynchronous serial interfaces and an 8-channel PWM add useful resources for actuator and communication tasks. Final deployment requires automotive qualification review, operating-temperature confirmation, EMC validation, and NXP errata review.
Empfohlen
Automotive Body Control Module
The device's 91 general-purpose I/O pins are valuable in body-control designs that aggregate switches, lamps, door inputs, and diagnostic connections. Two 8-channel 10-bit ADC groups can monitor resistive or sensor-based inputs, while two asynchronous serial interfaces support external controllers. At up to 25 MHz, the HCS12 CPU provides deterministic control for multiplexed nodes. Design teams should validate pin multiplexing, wake-up behavior, voltage levels, and diagnostic requirements against the MC9S12DP512 Device Guide and application-specific automotive qualification criteria.
Empfohlen
Industrial Multiplexing Hub
MC9S12DP512CPVE is suitable for an industrial multiplexing hub where many discrete inputs and outputs must be coordinated by one controller. Its 91 I/O pins reduce the need for external I/O expanders, while the dual 10-bit ADC capability supports sensor acquisition and monitoring. The 512 KB Flash provides room for protocol stacks, diagnostics, and control tables. The 25 MHz maximum clock supports responsive control loops, although industrial use requires checking temperature, EMC, isolation, grounding, and regulatory requirements not supplied in the verified web data.
Empfohlen
Sensor Acquisition and Conditioning
The two integrated 8-channel 10-bit ADCs make the MC9S12DP512CPVE useful for multi-channel sensor acquisition systems. Engineers can connect analog inputs for temperature, pressure, level, or resistive sensing and use the HCS12 CPU to filter, scale, and report measurements. The 512 KB Flash supports calibration tables and application firmware, while the 91 I/O pins provide digital status and control signals. ADC accuracy, sampling timing, input impedance, and channel multiplexing must be checked in the manufacturer datasheet before defining the analog front end.
Empfohlen
Actuator and PWM Control System
The integrated 8-channel PWM and 8-channel enhanced IC/OC capture timer support actuator drive, pulse measurement, and timing-sensitive control functions. A single MC9S12DP512CPVE can coordinate multiple outputs while monitoring feedback signals through its ADC and digital I/O resources. Its 25 MHz HCS12 core provides the processing headroom for sequencing, diagnostics, and communication tasks. PWM frequency, resolution, timer modes, and electrical drive limits must be verified from the NXP documentation, especially when driving inductive or high-current loads.
Empfohlen
Communication Gateway
Two asynchronous serial communication interfaces make the MC9S12DP512CPVE suitable as the basis for a communication gateway or protocol bridge. The controller can host gateway firmware in 512 KB Flash, manage multiple digital signals through 91 I/O pins, and use its ADC resources for supervisory measurements. The 25 MHz HCS12 core is appropriate for interrupt-driven serial routing and protocol translation when the required baud rates and timing are within the device specifications. Confirm pin multiplexing, interrupt vectors, timing, and electrical interface levels with the manufacturer datasheet.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S12DP512CPVE – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S12DP512CPV | MC9S12DP512CPVER | MC9S12XDP512VAL | MC9S12XA512VAL |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-pin LQFP (20x20) | LQFP-112 (20x20) - verify suffix | 112-pin LQFP - packaging variant | PQFP-80 - package differs | LQFP-112 - verify suffix |
Wichtigste Unterscheidungsmerkmale
- High integration for multiplexing designs (vs. MC9S12DP512CPVER)
- Automotive-oriented family positioning (vs. MC9S12XDP512VAL)
- Large on-chip firmware capacity (vs. MC9S12D64CPVE)
- Deterministic 16-bit embedded control (vs. MC9S12XA512VAL)
Designhinweise
Treat the 112-pin LQFP footprint as a fixed PCB constraint. Before schematic capture, compare the complete NXP pin table with the package symbol and verify every power, ground, reset, clock, analog, and digital signal. The supplied data confirms the package and pin count but does not provide the complete pinout, so do not infer alternate-function assignments from generic MC9S12 documentation.
Plan the MCU supply rails from the verified 2.5 V / 5 V device class, but confirm the exact operating range, decoupling requirements, reset behavior, and internal voltage references in the NXP MC9S12DP512 Device Guide. Place required bypass capacitors close to the supply pins and keep analog and digital return paths controlled to reduce noise coupling into the two 10-bit ADC groups.
Do not assume that related MC9S12DP512 suffixes are interchangeable. MC9S12DP512CPVER is described as a reel-packaging comparison candidate, while other related MPNs may differ in package or ordering suffix. Validate memory size, pin mapping, temperature range, package, qualification, and PCB footprint before releasing a substitution.
For an industrial or automotive enclosure, calculate worst-case power dissipation from the actual supply voltage, I/O loading, clock activity, and peripheral use. The verified data does not provide a thermal resistance or maximum power rating, so use the manufacturer package data for a final thermal design. Provide copper area and airflow appropriate to the enclosure rather than relying on the LQFP package alone.
Route high-speed clock, debug, and serial signals with short return paths and controlled impedance where applicable. Keep analog inputs away from PWM and serial routing, and use star-ground or appropriately partitioned grounding according to the system architecture. Validate ADC settling, sampling timing, and PWM edge behavior with oscilloscope measurements because those timing values are not included in the supplied data.
Compliance-Informationen
The supplied web results do not include verified compliance declarations. Do not infer RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status from the device family name or automotive application description.
