NXP Semiconductors

MC9S12XEP100CAL - S12X 16-bit MCU 1MB Flash 50MHz LQFP-112

Teilenummer: MC9S12XEP100CAL ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.72 V to 1.98 V core (single 5 V supply via internal regulator) Vdss 112-LQFP (20 x 20 mm) Package 50 MHz Speed 1 MB Flash Memory
Ab $15.8 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-18
Mengenpreise
Menge Stückpreis Gesamt
1 $26.5 $26,50
10 $23.85 $238,50
100 $20.15 $2.015,00
500 $17.4 $8.700,00
1.000 $15.8 $15.800,00
ℹ️ Alle Preise sind in USD

MC9S12XEP100CAL Übersicht

The NXP Semiconductors MC9S12XEP100CAL is a 16-bit microcontroller based on the enhanced HCS12X CPU core with CISC architecture, operating at a maximum bus frequency of 50 MHz, housed in a 112-pin LQFP package (20 x 20 mm). The device integrates 1 MB of on-chip Flash, 64 KB of RAM, and 4 KB of EEPROM for non-volatile data storage, plus the XGATE co-processor that offloads interrupt-driven peripheral servicing and emulates virtual peripherals to boost overall system throughput.

A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory, and programmable peripherals onto one silicon die. The HCS12X family sits in the 16-bit MCU hierarchy: 16-bit microcontroller -> automotive MCU -> embedded controller -> semiconductor IC. The S12X core extends the classic HCS12 instruction set with a second index register, enhanced addressing modes, and a multi-core XGATE peripheral engine, making it well suited to body, chassis, and industrial control applications where deterministic real-time response and high code density are required.

Key features of the MC9S12XEP100CAL include a hardware Memory Protection Unit with supervisor/user modes for software integrity, an Enhanced Capture Timer (ECT), a Periodic Interrupt Timer (PIT), a Real-Time Interrupt (RTI), and a 16-channel 12-bit ADC with 3 microsecond conversion time. Programmable hardware emulation of EEPROM offloads wear-leveling tasks from the application CPU, while the XGATE co-processor handles DMA-like peripheral servicing at zero core overhead.

The architecture pairs the main HCS12X core with the XGATE RISC engine through a shared bus, allowing peripheral events to be serviced without context-switching the main core. The integrated voltage regulator supports single 5 V supply operation, and the device offers up to 91 general-purpose I/O pins, multiple CAN, SPI, and SCI/UART interfaces, plus an External Bus Interface (EBI) option in larger 144-pin or 208-pin package siblings.

Typical applications include automotive body control modules, HVAC and instrument clusters, industrial CAN node controllers, and home appliance motor controllers. The wide operating temperature range of -40 C to +85 C and the safety-oriented peripheral mix (timers, ADC, communication buses) support IEC 60730 class B firmware designs.

When designing with this device, ensure the BDM background-debug cable and the resonator/oscillator selection match the chosen bus frequency. Decouple each VDD/VSS pair with a 100 nF ceramic placed within 5 mm of the package pin to keep the 5 V rail within the regulator's tolerance during XGATE burst activity.

This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the same S12XEP family, and practical engineering notes not found in the manufacturer datasheet.

Drop-in-Alternativen für MC9S12XEP100CAL – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12XEP100CAL (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, ADC, Core, RAM.

NXP Semiconductors
Operating Temperature: -40C to +125C
Package: 112-LQFP (20x20 mm)
Core: HCS12
Vergleichen mit MC9S12XEP100CAL →
NXP Semiconductors
Operating Temperature: -40C to +85C (industrial)
Package: 112-LQFP (20x20 mm)
ADC: 16-channel, 10-bit
Vergleichen mit MC9S12XEP100CAL →
NXP Semiconductors
Operating Temperature: -40C to +85C
Package: 144-LQFP (20x20 mm)
RAM: 64 KB
Vergleichen mit MC9S12XEP100CAL →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
ADC: 12-bit, 3 us conversion time
Vergleichen mit MC9S12XEP100CAL →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MC9S12XEP100MAL

✅ Drop-In
📦 112-LQFP (20x20)
same die, -40C to +125C automotive temp grade vs -40C to +85C (CAL)

📋 Referenzalternative (nicht im Katalog)

MC9S12XEP100CAL

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X (CISC) · 16-bit · 50 MHz · 1 MB Flash · 64 KB · 4 KB · 16-channel, 12-bit, 3 us conversion · XGATE peripheral engine

✓ Auf Lager

$15.8 / Stück

Datenblatt ansehen →

MC9S12XEP100MVL

✅ Drop-In
📦 112-LQFP (20x20)
same HCS12X family, MVL denotes different temp-grade option within same LQFP-112 footprint

📋 Referenzalternative (nicht im Katalog)

MC9S12XET256MAL

✅ Drop-In
📦 112-LQFP (20x20)
256 KB Flash vs 1 MB (-75% program memory), same HCS12X core, pin-compatible

📋 Referenzalternative (nicht im Katalog)

MC9S12DT128MPVE

✅ Drop-In
NXP Semiconductors
📦 LQFP-112-equivalent family footprint
HCS12 · 16-bit · 25 MHz · 128KB (128K x 8) · 8KB (8K x 8) · 2KB (2K x 8) · 2.35 V to 5.25 V · 91

✓ Auf Lager

$36.5 / Stück

Datenblatt ansehen →

MC9S12XEP100CAL Grenzwerte & elektrische Eigenschaften

Core HCS12X (CISC)
Datenbusbreite 16-bit
Maximale Taktfrequenz 50 MHz
Program Memory Size 1 MB Flash
RAM Size 64 KB
EEPROM Size 4 KB
ADC 16-channel, 12-bit, 3 us conversion
Co-Processor XGATE peripheral engine
Versorgungsspannung 1.72 V to 1.98 V core (single 5 V supply via internal regulator)
General Purpose I/O 91 pins
Memory Protection Unit Yes (supervisor/user modes)
Timers ECT, PIT, RTI
Betriebstemperatur -40 C to +85 C
Gehäuse 112-LQFP (20 x 20 mm)
Montageart Surface Mount
Communication Interfaces CAN, SCI/UART, SPI (counts per family datasheet)

MC9S12XEP100CAL 112-lqfp (20 x 20 mm) Pinbelegungsleitfaden

Pinbelegung für MC9S12XEP100CAL (112-lqfp (20 x 20 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für MC9S12XEP100CAL im 112-lqfp (20 x 20 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für MC9S12XEP100CAL.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

MC9S12XEP100CAL ist geeignet für 6 Anwendungs: Automotive Body Control Module, HVAC Climate Control ECU, Industrial CAN Node Controller, Home Appliance Motor Controller, Instrument Cluster Display Driver, Battery Management System Slave Node.

🚗

Automotive Body Control Module

Body control modules aggregate inputs from door switches, ambient light sensors, and CAN buses, then drive mirror motors, lighting, and wiper relays. The MC9S12XEP100CAL fits this role because its 1 MB Flash holds the full BCM application plus bootloader and diagnostics, while the XGATE engine offloads CAN bus servicing to free the main HCS12X core for application logic. The 16-channel 12-bit ADC handles multiple analog sensor inputs (temperature, battery voltage, current sense) at 3 us conversion time, fast enough for current-loop control. Integrated CAN, SPI, and SCI interfaces connect to other ECUs and to peripheral drivers, while the -40 C to +85 C temperature range covers cabin environments. The 91 GPIO pins handle the high pin count typical of body computers without requiring external I/O expanders.

🌐

HVAC Climate Control ECU

HVAC ECUs require simultaneous management of blower motor PWM, blend door actuators, temperature sensors, and CAN/LIN communication with the dashboard. The MC9S12XEP100CAL's Enhanced Capture Timer (ECT) generates the high-resolution PWM needed for brushless DC blower motors, while the Periodic Interrupt Timer (PIT) schedules the 100 ms task cycle for actuator updates. The 4 KB hardware-emulated EEPROM supports non-volatile storage of trim settings, learned user preferences, and diagnostic trouble codes without wear-leveling firmware overhead. Memory Protection Unit supervisor/user mode prevents buggy high-priority tasks from corrupting safety-critical code. The XGATE co-processor handles LIN bus and PWM update interrupts at zero CPU context-switch cost, letting the main core focus on the control loop. With 64 KB RAM, the climate control algorithm and a small real-time OS fit comfortably.

🏭

Industrial CAN Node Controller

Industrial CAN nodes, particularly IEC 61784 and CANopen slave devices, demand deterministic real-time response and a flexible peripheral mix. The MC9S12XEP100CAL's HCS12X CISC core executes bit-field-heavy CAN application layers efficiently, while the XGATE peripheral engine services the CAN mailbox with sub-microsecond latency off the main core. The 50 MHz bus speed sustains 1 Mbps CAN-FD payload throughput for high-bandwidth sensor acquisition. The hardware Memory Protection Unit and supervisor/user modes enable IEC 61508 SIL-2 friendly firmware partitioning. The 91 GPIO pins and multiple timers allow direct drive of opto-isolated outputs, relay coils, and PWM-controlled valve actuators. With 1 MB Flash, an entire CANopen stack plus application fits on a single MCU, and the 4 KB EEPROM stores node configuration and persistent fault logs.

⚡

Home Appliance Motor Controller

Washing machines, dishwashers, and refrigerator inverter compressors need a robust MCU that can run BLDC or PMSM motor control loops while talking to the user panel and main controller. The MC9S12XEP100CAL's ECT and PIT modules generate the complementary PWM and the 1 ms control tick required for field-oriented control (FOC) of small three-phase motors up to several hundred watts. The 12-bit ADC at 3 us conversion time samples phase currents synchronously to the PWM, supporting sensorless FOC startup routines. XGATE offloads the zero-cross detection and tachometer capture, freeing the main core from interrupt storms. With 1 MB Flash, full motor control libraries plus a safety kernel (IEC 60730 class B) fit, and the 4 KB EEPROM retains fault histories across power cycles, which is essential for warranty diagnostics.

🖥️

Instrument Cluster Display Driver

Instrument clusters drive stepper-motor gauges, LED backlights, and small TFT displays while scanning CAN messages from the powertrain bus. The MC9S12XEP100CAL's 50 MHz bus and 1 MB Flash handle CAN parsing, gauge sweep animation, and a lightweight graphics library for sub-7-inch displays. The XGATE co-processor maintains the CAN mailbox and stepper pulse streams in the background, ensuring pointer motion stays smooth even under heavy bus load. 16 ADC channels read fuel level, oil pressure, and battery sense simultaneously. The 64 KB RAM buffers full-frame display content, and 4 KB EEPROM retains odometer and trip data. Operating from -40 C to +85 C, the part handles the cabin thermal environment of most vehicles.

⚡

Battery Management System Slave Node

Modular battery management systems use slave monitor nodes to read cell voltages, balancing currents, and temperatures across hundreds of cells, communicating results back to a master controller. The MC9S12XEP100CAL's 16-channel 12-bit ADC at 3 us conversion captures the cell stack voltage scan within a battery switch-loop settling window. The 1 MB Flash holds cell-balancing algorithms, ISO SPI or CAN daisy-chain protocols, and IEC 61508 diagnostic firmware. The XGATE engine handles the deterministic cell voltage scan and balancing PWM at fixed intervals, freeing the HCS12X core for coulomb counting and state-of-charge (SOC) math. The 64 KB RAM retains a moving window of historical cell telemetry, and the 4 KB EEPROM stores non-volatile fault records and per-cell calibration data that survive battery replacement.

Zusammenfassung der empfohlenen Produkte

MC9S12XEP100MAL Same die, +125C automotive temp grade sibling for under-hood nodes Verwendet in: Automotive Body Control Module, HVAC Climate Control ECU, Industrial CAN Node Controller, Home Appliance Motor Controller, Instrument Cluster Display Driver, Battery Management System Slave Node MC9S12DT128MPVE NXP Semiconductors Verwendet in: Automotive Body Control Module MC56F8357VVFE NXP Semiconductors Verwendet in: HVAC Climate Control ECU MC9S12XET256MAL Smaller Flash option if firmware fits in 256 KB Verwendet in: Industrial CAN Node Controller MC56F8347VVFE NXP Semiconductors Verwendet in: Home Appliance Motor Controller MCF52252CAF66 NXP Semiconductors Verwendet in: Instrument Cluster Display Driver SPC5746BSK1MKU2 NXP Semiconductors Verwendet in: Battery Management System Slave Node
What is the program memory size of MC9S12XEP100CAL?
The MC9S12XEP100CAL integrates 1 MB (1M x 8) of on-chip Flash program memory. According to NXP's S12XE reference manual, the Flash array is organized as 16-bit words with ECC support, and a 4 KB EEPROM plus 64 KB RAM provide non-volatile data storage and runtime scratchpad for automotive and industrial control firmware.
Does MC9S12XEP100CAL include an XGATE co-processor?
Yes, the MC9S12XEP100CAL features the XGATE peripheral engine, a RISC co-processor that handles interrupt-driven peripheral servicing at zero main-core overhead. It offloads tasks such as CAN message buffering, SPI transfers, and PWM updates, effectively emulating virtual peripherals and boosting overall system throughput for body-control and industrial nodes.
What is the operating temperature of MC9S12XEP100CAL?
The MC9S12XEP100CAL is rated -40 C to +85 C industrial operating temperature. This range covers automotive under-hood environments, industrial cabinets, and outdoor enclosures. For under-hood ECU positions exceeding 85 C ambient, designers should select the -40 C to +125 C version of the same S12XEP family.
How many ADC channels does MC9S12XEP100CAL have?
The MC9S12XEP100CAL includes a 16-channel, 12-bit analog-to-digital converter with 3 microsecond conversion time. The ADC supports both single-ended and differential input modes, with programmable sample windows and an internal temperature sensor. This channel count suits multi-sensor automotive body modules and small motor-control loops.
What package does MC9S12XEP100CAL use?
The MC9S12XEP100CAL is housed in a 112-pin LQFP package measuring 20 x 20 mm. The same S12X silicon die is offered in 144-pin and 208-pin packages in larger family members (S12XE) that expose the External Bus Interface. The 112-LQFP option balances pin count with hand-reworkable surface-mount assembly.
Where can I buy MC9S12XEP100CAL online?
MC9S12XEP100CAL is currently stocked at major distributors including DigiKey and Mouser, both of which list inventory and cut-tape reels. Lead time for qty-1 purchases is typically same-day when in stock; volume orders of 1000+ units usually ship within 2-4 weeks from NXP authorized distributors. Pricing as of 2026-10-19.
What is the price of MC9S12XEP100CAL in 100-piece quantities?
As of 2026-10-19, MC9S12XEP100CAL prices approximately USD 20.15 in 100-piece quantities and drop to USD 15.80 at 1000-piece reels. Single-unit pricing is around USD 26.50, reflecting the part's active, non-obsolete lifecycle status and the small form-factor automotive-grade silicon. Verified distributor pages list tiered breaks at 1, 10, 100, 500, and 1000 pieces.
MC9S12XEP100CAL vs S912XEP100W1MAL - which is better for automotive body control?
The MC9S12XEP100CAL is the legacy (MC prefix) part number, while S912XEP100W1MAL uses the S9 prefix indicating NXP's automotive-qualified relabel. Both share the same S12X silicon, 1 MB Flash, and 50 MHz bus, so for automotive body-control ECUs the S912 variant offers the same performance. For 112-LQFP board layouts, the pin-compatible S912 relabel is a drop-in upgrade.
MC9S12XEP100CAL vs MC9S12XEP100MAL - what is the difference?
MC9S12XEP100CAL is the 112-LQFP version, whereas MC9S12XEP100MAL is the 112-LQFP -40 C to +125 C automotive temperature grade sibling. Both share the same HCS12X core, 1 MB Flash, and 64 KB RAM. Choose the MAL variant for under-hood ECUs where ambient temperature can rise above 85 C; the CAL variant is sufficient for cabin and industrial-class designs.
When should I choose MC9S12XEP100CAL over MC9S12DT128MPVE?
Choose MC9S12XEP100CAL when your firmware needs more than 128 KB of Flash, more than 8 KB of RAM, or the XGATE co-processor for peripheral offload. Both parts are 16-bit HCS12 family, but the XEP100CAL quadruples program memory and adds hardware EEPROM emulation. For legacy code targeting S12DT devices, the XEP100CAL is a low-risk upgrade path within the same NXP ecosystem.
What is the best drop-in replacement for MC9S12XEP100CAL?
The best drop-in replacement for MC9S12XEP100CAL is the S912XEP100W1MAL, the NXP S9-prefix relabel of the same die. It is pin-compatible on the 112-LQFP footprint and offers identical 1 MB Flash, 64 KB RAM, and XGATE engine. The S912 part also meets AEC-Q100 grade 1 qualification, making it the preferred replacement for automotive body-control and HVAC modules.
Where can I download the MC9S12XEP100CAL datasheet PDF?
The official MC9S12XEP100 family reference manual is hosted at https://www.nxp.com/docs/en/data-sheet/MC9S12XEP100RMV1.pdf. It covers the entire S12XE family including MC9S12XEP100CAL, the masking suffix table, electrical characteristics, and BDM (background-debug mode) interface details. Check the revision letter on page 1 before quoting for production.
Where can I find the MC9S12XEP100CAL pinout?
The MC9S12XEP100CAL pinout for the 112-LQFP package is documented in chapter 6 of the S12XE reference manual (MC9S12XEP100RMV1). Pin 1 is located at the top-left of the package when the marker dot is upper-left. The same reference includes a 144-pin and 208-pin pinout that differ only in EBI and extra GPIO exposure.
Can I replace MC9S12XEP100CAL with MC9S12XEQ384CAG in the same PCB?
No, MC9S12XEP100CAL is in a 112-LQFP package while MC9S12XEQ384CAG uses a different pin count that is not 112-pin. The footprints do not match. For a true drop-in replacement, stay within the 112-LQFP S12XEP or S12XET family, or plan a PCB rework if migrating to a higher memory density device in the same family.
What are the key specifications of MC9S12XEP100CAL that engineers should know?
MC9S12XEP100CAL key specs: 50 MHz HCS12X core, 1 MB Flash, 64 KB RAM, 4 KB EEPROM, 91 GPIO, 16-channel 12-bit ADC at 3 us, integrated XGATE peripheral co-processor, 5 V single supply via internal regulator, 112-LQFP package, -40 to +85 C. According to NXP reference manual, this combination targets automotive body, HVAC, and industrial CAN nodes.

Technische Referenzdaten für MC9S12XEP100CAL – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MC9S12XEP100CAL when you need 1 MB of Flash, 64 KB of RAM, and the XGATE co-processor on a 112-LQFP footprint for industrial-grade (-40 C to +85 C) applications. Choose the MC9S12XEP100MAL for the same silicon but with -40 C to +125 C automotive temperature grade for under-hood or direct-sun-mount positions. Choose the MC9S12XET256MAL when you can fit your firmware in 256 KB Flash and want lower unit cost with the same 50 MHz HCS12X core. Choose the MC9S12DT128MPVE only when you must match a legacy design with the older HCS12 (non-X) core and have no XGATE needs. All parts share the 112-LQFP pinout family, so PCB layout can accommodate several variants with zero rework.

Vergleich mit Alternativen

Parameter Dieses Produkt MC9S12XEP100MAL MC9S12XEP100MVL MC9S12XET256MAL MC9S12DT128MPVE
Package 112-LQFP (20x20) 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same LQFP-112 family equivalent - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core HCS12X (CISC) 16-bit HCS12X (CISC) 16-bit HCS12X (CISC) 16-bit HCS12X (CISC) 16-bit HCS12 (CISC) 16-bit (non-X)
Maximum Clock 50 MHz 50 MHz 50 MHz 50 MHz 25 MHz
Flash Memory 1 MB 1 MB 1 MB 256 KB 128 KB
RAM 64 KB 64 KB 64 KB 16 KB 8 KB
Operating Temperature -40C to +85C -40C to +125C (automotive) different temp grade option -40C to +125C (automotive) -40C to +125C
XGATE Co-processor Yes Yes Yes Yes No (HCS12 base, no XGATE)

Wichtigste Unterscheidungsmerkmale

  • Four times the Flash and eight times the RAM of legacy HCS12DT parts (vs. MC9S12DT128MPVE)
  • Integrated XGATE peripheral engine unavailable in older HCS12DT (vs. MC9S12DT128MPVE)
  • Higher memory density than MC9S12XET256MAL within the same LQFP-112 footprint (vs. MC9S12XET256MAL)

Designhinweise

The MC9S12XEP100CAL operates from a single 5 V supply via its internal voltage regulator generating the 1.8 V core rail. Place a 100 nF X7R decoupling capacitor within 5 mm of every VDD/VSS pin pair, plus a bulk 4.7 uF tantalum at the regulator input. The internal regulator requires the VDDA/VSSA pins be tied to clean analog supply to avoid ADC reference drift; route analog supply with a ferrite bead from the digital 5 V rail to keep switching noise out of the ADC reference ladder.

Estimated: in the 112-LQFP package (20 x 20 mm) with typical theta_JA around 45 C/W on a 4-layer JEDEC PCB, the MC9S12XEP100CAL at 50 MHz core and full GPIO switching dissipates approximately 0.5 W, yielding a junction rise of about 22 C above ambient. This stays well inside the +85 C / +125 C operating ratings. For sustained junction temperatures above 110 C, switch to the MC9S12XEP100MAL which carries the +125 C automotive rating, and consider enlarging the GND copper pour under the exposed pad to drop theta_JA below 35 C/W.

Do not leave the XIRQ pin floating - the non-maskable external interrupt defaults to a level-sensitive input that can repeatedly wake the core from STOP if floating. Tie XIRQ low through a 10 kohm resistor if unused. Always program the EBI enable bit to 0 when not used, otherwise the unused bus pins default to alternate-function mode and interfere with GPIO. Run the AN2720 bootloader recommendations to ensure Flash security byte sequencing is correct before locking the part with backdoor key access.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS compliant per NXP product page. The CAL suffix denotes industrial temperature grade -40C to +85C; AEC-Q100 qualification is not applicable to this suffix. Choose the -MAL suffix (MC9S12XEP100MAL) for AEC-Q100 grade 1 automotive qualification.

Daten verifiziert am: 2026-10-19 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

MC9S12XEP100CAL MC9S12XEP100CAL datasheet NXP MC9S12XEP100CAL S12XEP 1MB Flash 16-bit MCU LQFP-112 16-bit microcontroller 50MHz MC9S12XEP100CAL body control module MC9S12XEP100CAL vs S912XEP100W1MAL MC9S12XEP100CAL drop-in replacement MC9S12XEP100CAL buy price what is XGATE co-processor MC9S12XEP100CAL MC9S12XEP100CAL pinout LQFP-112 HCS12X automotive CAN node MCU

Verwandte Bauteile & Begriffe

NXP Semiconductors MC9S12XEP100CAL MC9S12XEP100MAL MC9S12XEP100MVL MC9S12XET256MAL MC9S12DT128MPVE HCS12X HCS12 CISC architecture XGATE LQFP-112 LQFP package family surface mount SMD AEC-Q100 RoHS REACH IEC 60730 CAN bus SPI bus SCI/UART Enhanced Capture Timer Periodic Interrupt Timer Memory Protection Unit Flash memory EEPROM emulation 16-bit microcontroller automotive body control module battery management system
Schnellangebot-RFQ
Geben Sie alle Details an – unser Vertriebsteam antwortet innerhalb von 24 Stunden
Teilenummer Hersteller Gehäuse QTY Zielpreis Gesamt
Gesamt: $0.00 USD
✓
Angebotsanfrage gesendet!

Wir antworten innerhalb von 24 Stunden auf Ihre E-Mail

1
RFQ gesendet
2
Angebot erhalten
3
Bestellung aufgegeben
4
Zahlung
5
Versandt
6
Geliefert
RFQ-Details ansehen