MCF5253VM140 - ColdFire V2 32-bit MPU 140MHz 225-MAPBGA | NXP
Teilenummer: MCF5253VM140 ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $20.1 | $201,00 |
| 100 | $17.85 | $1.785,00 |
| 500 | $16.2 | $8.100,00 |
| 1.000 | $14.5 | $14.500,00 |
MCF5253VM140 Übersicht
A ColdFire V2 MPU belongs to the M68k-architecture ColdFire family of 32-bit microprocessors, which are positioned between 8/16-bit microcontrollers and full application processors. The ColdFire V2 core adds an enhanced multiply-accumulate (eMAC) unit to the base V1 instruction set, enabling efficient execution of both control code and DSP-style signal processing loops. Microprocessors in this class are commonly used in audio decoders, file-management peripherals, and human-interface subsystems where deterministic behaviour and low BOM cost matter more than raw MHz.
Key features of the MCF5253VM140 include USB On-The-Go (OTG) with integrated PHY, a tamper-proof real-time clock (RTC), Fast Ethernet (FEC) controller, and an external memory bus supporting SDRAM, SRAM, NOR flash, and NAND flash. The ROMless configuration forces execution from external memory, giving designers freedom to select memory density and supplier. Peripheral highlights include up to two UARTs, two I2C controllers, a queued SPI, a 4-channel PWM, 32-bit timers, and a slow-speed I/O subsystem. Together these blocks enable the part to act as the system-on-chip for audio jukeboxes, IP phones, point-of-sale terminals, industrial control panels, and factory automation gateways.
Architecturally, the part uses a Variable-Length RISC encoding (ColdFire ISA) with a unified instruction/data cache hierarchy. The 140 MHz core delivers approximately 140 Dhrystone MIPS, sufficient for MP3/AAC decode, file systems, and lightweight networking stacks. BGA packaging combined with a 0.8 mm ball pitch supports high-density multilayer PCB layouts required by consumer audio products.
Typical applications include compressed-audio playback devices, USB-OTG peripherals, industrial control with Ethernet connectivity, and portable instrumentation. In each, the device is paired with an SDRAM and a bootable NOR/NAND flash array. When designing, ensure the external SDRAM and flash are matched to the bus timing parameters specified in the MCF5253 datasheet, and that decoupling follows the recommended 0.1 uF + bulk capacitor placement at every VDD/VSS pair.
This page synthesizes distributor stock levels, same-package drop-in alternatives, and practical design guidance not duplicated in the manufacturer datasheet, giving sourcing and engineering teams a single reference for re-design and BOM consolidation.
Drop-in-Alternativen für MCF5253VM140 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCF5253VM140 (gleiche Bauform und Footprint) – abweichend in Program Memory Type, Real-Time Clock, USB Interface, Mounting Type, Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCF5253VM140J
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCF5253CVM140
✅ Drop-In✓ Auf Lager
$27.4 / Stück
Datenblatt ansehen →MCF5251VM140
✅ Drop-In✓ Auf Lager
$17.95 / Stück
Datenblatt ansehen →MCF5251CVM140
✅ Drop-In✓ Auf Lager
$18.2 / Stück
Datenblatt ansehen →MCF5253CVM140J
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCF5253VM140 Grenzwerte & elektrische Eigenschaften
| Core Architecture | ColdFire V2 (M68k-based) with eMAC |
| Datenbusbreite | 32-bit |
| Maximale Taktfrequenz | 140 MHz |
| Program Memory Type | ROMless (external memory required) |
| Internal RAM Size | 128 KB (128K x 8) |
| Gehäuse / Bauform | 225-LFBGA / 225-MAPBGA (13 x 13 mm) |
| Montageart | Surface Mount |
| Oscillator Type | External |
| Versorgungsspannung | 1.8 V core / 3.3 V I/O (typical; see datasheet) |
| USB Interface | USB On-The-Go (OTG) with integrated PHY |
| Ethernet | 10/100 Fast Ethernet Controller (FEC) |
| Real-Time Clock | Tamper-proof RTC on-chip |
| External Memory Bus | SDRAM, SRAM, NOR flash, NAND flash controller |
| Serial Peripherals | 2x UART, 2x I2C, 1x QSPI, 4-ch PWM |
| MSL-Level | 3 (per JEDEC J-STD-020, typical for MAPBGA) |
MCF5253VM140 225-lfbga / 225-mapbga (13 x 13 mm) Pinbelegungsleitfaden
Pinbelegung für MCF5253VM140 (225-lfbga / 225-mapbga (13 x 13 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MCF5253VM140.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MCF5253VM140 ist geeignet für 6 Anwendungs: Compressed-Audio Media Players, Industrial Control Panels with Ethernet, USB-OTG Peripherals and Docking Stations, Point-of-Sale (POS) Terminals, Portable Instrumentation and Data Loggers, Factory Automation Gateways and Protocol Bridges.
Compressed-Audio Media Players
The MCF5253VM140's ColdFire V2 core runs at 140 MHz with an enhanced multiply-accumulate (eMAC) unit, delivering sufficient MIPS for MP3, AAC, and WMA decode while leaving headroom for file-system and UI tasks. The on-chip USB-OTG controller with PHY supports direct drag-and-drop file transfer from a PC, removing the need for an external bridge chip. Designers typically pair it with an external SDRAM (16-64 MB) for audio buffers and a bootable NAND flash for the file table. The 225-MAPBGA keeps the PCB compact enough to fit inside a portable player enclosure.
Empfohlen
Industrial Control Panels with Ethernet
With the on-chip 10/100 Fast Ethernet Controller, the MCF5253VM140 is well suited for industrial HMI panels that must report telemetry to a SCADA host. The 32-bit ColdFire V2 core executes Modbus/TCP and EtherNet/IP stacks at line rate while the eMAC accelerates filter calculations on sampled data. The tamper-proof RTC enables time-stamped event logging required in many factory-automation contexts. Industrial designers should still add an external PHY magnetics module and follow IEC 61000-4 EMC immunity guidance.
Empfohlen
USB-OTG Peripherals and Docking Stations
The integrated USB-OTG PHY allows the MCF5253VM140 to act as both USB host and device without external components, ideal for docking stations that must read USB mass-storage, keyboards, or printers. The 140 MHz core services USB enumeration, file-system access, and application logic simultaneously. Designers using this part in OTG docking roles should review the datasheet's USB section for cable-detection and VBUS-switching recommendations. Compared to discrete USB-OTG solutions, the integrated PHY saves roughly $1.50 of BOM and 80 mm² of board area.
Empfohlen
Point-of-Sale (POS) Terminals
The MCF5253VM140's combination of Fast Ethernet, USB-OTG, multiple UARTs, and 32-bit processing power makes it a strong fit for compact POS terminals that must print receipts, drive a magnetic-stripe reader, and connect to a back-office IP network. Its ROMless architecture lets integrators ship customized firmware and bootloaders tailored to payment schemes. The exposed MAPBGA package dissipates up to roughly 1.0 W under full load, which a small copper-pour thermal pattern can handle without a heatsink in a sealed POS enclosure.
Empfohlen
Portable Instrumentation and Data Loggers
Battery-powered or hand-held instruments benefit from the MCF5253VM140's low core voltage (1.8 V) and on-chip eMAC for sensor-filter math, while still providing Fast Ethernet for tethered data download. The tamper-proof RTC guarantees time-stamped samples even when the main supply is removed, satisfying FDA 21 CFR Part 11-style audit trails in medical accessories. Engineers should budget for an external low-quiescent LDO and a coin-cell backup for the RTC domain. The 225-MAPBGA supports dense 4-layer PCB layouts that fit into a 100 x 60 mm enclosure.
Empfohlen
Factory Automation Gateways and Protocol Bridges
Bridging legacy RS-485 or CAN fieldbus segments to Ethernet/IP backbones is a classic use of the MCF5253VM140. Two on-chip UARTs, an SPI bus, and a Fast Ethernet MAC let a single device translate multiple industrial protocols concurrently. ColdFire's deterministic interrupt response simplifies real-time protocol handling. The 225-MAPBGA package is well matched to IP65-sealed gateways where a compact, conformal-coated design is needed. Designers should isolate fieldbus lines with digital isolators to meet IEC 61800 industrial surge immunity.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCF5253VM140 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCF5253VM140J | MCF5253CVM140 | MCF5251VM140 | MCF5251CVM140 |
|---|---|---|---|---|---|
| Package | 225-MAPBGA (13x13 mm) | 225-MAPBGA (13x13) - same | 225-MAPBGA (13x13) - same | 225-MAPBGA (13x13) - same | 225-MAPBGA (13x13) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ColdFire V2 with eMAC | ColdFire V2 with eMAC | ColdFire V2 with eMAC | ColdFire V2 with eMAC | ColdFire V2 with eMAC |
| Maximum Clock Frequency | 140 MHz | 140 MHz | 140 MHz | 140 MHz | 140 MHz |
| Internal SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Program Memory Type | ROMless (external) | ROMless (external) | ROMless (external) | ROMless (external) | ROMless (external) |
| USB-OTG with PHY | Yes | Yes | Yes | Subset / different peripheral mix | Subset / different peripheral mix |
| Fast Ethernet Controller | Yes (FEC) | Yes | Yes | Yes | Yes |
| Operating Temperature Grade | Consumer/Industrial | Consumer/Industrial (Pb-free) | Extended Industrial | Consumer/Industrial | Extended Industrial |
Wichtigste Unterscheidungsmerkmale
- Integrated USB-OTG with on-chip PHY (vs. MCF5251VM140)
- Pin-compatible Pb-free option for RoHS builds (vs. MCF5253VM140J)
- Higher internal SRAM than legacy ColdFire V1 parts (vs. ColdFire V1 baseline MCUs)
Designhinweise
Estimated: the 225-MAPBGA at 0.8 mm pitch requires a 4-layer PCB minimum with microvia-in-pad for reliable BGA assembly. Use an NSMD (non-solder mask defined) pad with a 0.4 mm diameter and a 0.27 mm solder-mask opening per IPC-7351. Place 0.1 uF decoupling within 2 mm of every VDD/VSS pair and add 4.7 uF bulk caps at each supply domain (1.8 V core, 3.3 V I/O, PLL, RTC).
Estimated: at 140 MHz with 1.8 V core and full peripheral activity, the part dissipates roughly 1.0 W. A 1 square-inch copper pour on the top layer plus a thermal via array under the central BGA balls keeps the junction below 90 C in still air. Avoid placing tall components directly above the BGA to preserve rework access.
Because the MCF5253VM140 is ROMless, the boot sequence must come from an external flash or EEPROM on the bus - do not assume internal boot ROM exists. Also confirm the SDRAM clock and CAS-latency configuration matches the chosen memory chip; an incorrectly programmed SDRAM controller is the most common bring-up failure. Finally, observe JTAG pin sequencing at power-on to avoid latching into a debug state that blocks normal boot.
Compliance-Informationen
Per NXP product page, the 225-MAPBGA is supplied Pb-free; for REACH SVHC, halogen-free, and conflict-minerals declarations, request the latest MDDS document directly from NXP. Not AEC-Q100 qualified - not intended for automotive safety-critical applications.
