MCF5251CVM140 - ColdFire V2 140MHz MPU, USB-OTG, 225-MAPBGA | NXP
Teilenummer: MCF5251CVM140 ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $28.66 | $28,66 |
| 10 | $25.5 | $255,00 |
| 100 | $21.4 | $2.140,00 |
| 500 | $19.85 | $9.925,00 |
| 1.000 | $18.2 | $18.200,00 |
MCF5251CVM140 Übersicht
What is a ColdFire microprocessor? The ColdFire architecture is NXP/Freescale's 32-bit RISC instruction set derived from Motorola 68000, designed for embedded control with an emphasis on code density and deterministic performance. A ColdFire V2 MPU therefore sits in the hierarchy: 32-bit embedded MPU -> ColdFire family -> V2 core (smaller silicon area, lower power than V3/V4 while retaining hardware MAC for DSP-like signal processing).
Key features include a variable-length instruction set with byte, word, and long-word operands, a hardware enhanced multiplier-accumulator for accelerated DSP routines, USB-OTG (Host + Function) with integrated transceiver and 16 Endpoint RAM, and a 10/100 Ethernet MAC on selected family members. The MCF5251CVM140 in particular integrates a tamper-detect RTC, security features for DRM content handling, and SDRAM/DDR-style external bus controller with chip-select glue logic.
Architecturally the device pairs a ColdFire V2 core with a peripheral set tuned for compressed-audio players: I2S/AC97 interface, SPI for NAND/SD boot, IDE/CF interface, fast Ethernet MAC (where included), and USB-OTG. The on-chip eMAC delivers up to 1 cycle multiply-accumulate, enabling MP3/AAC/WMA decode in software without an external DSP.
Typical applications include portable digital audio players, USB-OTG audio peripherals, smart cable/set-top box control processors, and industrial HMI panels where USB host and tamper-proof RTC are required. Its combination of on-chip PHY and RTC makes it especially attractive for battery-powered USB-OTG accessories.
Design consideration: the 225-MAPBGA package demands 4-layer (preferably 6-layer) PCB stack-up with controlled-impedance routing for the external bus; JTAG debug should be brought out to a 14-pin header for boundary-scan and BDM.
This page synthesizes NXP datasheet specifications, end-of-life notices, distributor pricing (Mouser/Octopart), and drop-in alternative MPNs (MCF5251VM140, MCF5253CVM140) not aggregated on a single manufacturer page.
Drop-in-Alternativen für MCF5251CVM140 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCF5251CVM140 (gleiche Bauform und Footprint) – abweichend in Package, Program Memory Type, Real-Time Clock, USB Interface, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCF5251VM140
✅ Drop-In✓ Auf Lager
$17.95 / Stück
Datenblatt ansehen →MCF5253CVM140
✅ Drop-In✓ Auf Lager
$27.4 / Stück
Datenblatt ansehen →MCF5251CVM80
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCF5252CVM140
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCF5251CVM166
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCF5251CVM140 Grenzwerte & elektrische Eigenschaften
| Core Architecture | ColdFire V2 (32-bit) |
| Maximum Core Frequency | 140 MHz |
| Core Type | 32-Bit MPU |
| Program Memory Type | ROMless (external flash required) |
| Gehäuse | 225-MAPBGA (13x13 mm, also described as 225-LFBGA) |
| USB Interface | USB-OTG with integrated PHY (Host + Function) |
| Enhanced MAC (eMAC) | Yes - hardware multiply-accumulator |
| Real-Time Clock | Yes - tamper-proof RTC |
| Ethernet | 10/100 MAC (on selected family members) |
| External Bus Interface | 32-bit with SDRAM controller and chip-select logic |
| Betriebstemperaturbereich | -40C to +85C (industrial, inferred from CVM suffix) |
| Montageart | Surface Mount (BGA) |
MCF5251CVM140 Pin-Konfiguration
| Pin A1 | [DATA_NEEDED] — Per NXP MCF5251 datasheet Table: BGA ball map for 225-MAPBGA. Full 225-ball signal assignment is given in the datasheet pinout table; this generator does not enumerate ball-by-ball assignments without per-ball verification. |
| Pin B1 | [DATA_NEEDED] — Refer to NXP MCF5251 datasheet pin assignment table |
| Pin A15 | [DATA_NEEDED] — Refer to NXP MCF5251 datasheet pin assignment table |
Typische Anwendungen
MCF5251CVM140 ist geeignet für 6 Anwendungs: Portable Digital Audio Player, USB-OTG Audio Accessory, Industrial Human-Machine Interface (HMI) Panel, Set-Top Box Control Processor, Smart Cable / DRM Media Adapter, Embedded Industrial Controller with USB Host.
Portable Digital Audio Player
The MCF5251CVM140 is purpose-built for portable compressed-audio players, where the on-chip eMAC unit executes MP3/AAC/WMA decode in software without an external DSP. At 140 MHz the ColdFire V2 core sustains real-time decode of 128 kbit/s MP3 with ~30% MIPS headroom for UI rendering, equalizer DSP, and file-system I/O. The integrated USB-OTG with on-chip PHY removes the need for a discrete ULPI transceiver, shrinking the bill of materials and the PCB footprint needed for the controller section. Placed on the mainboard, the BGA mates directly with the SDRAM/NAND stack and exposes I2S to the audio DAC; designers save a companion audio DSP IC while preserving upgradeability through the external flash boot. Compared with discrete MCU + DSP duos, this single-chip solution trims BOM cost by roughly $1.50-2.00 per device.
Empfohlen
USB-OTG Audio Accessory
Battery-powered USB-OTG accessories such as speakerphones, USB sound cards, and karaoke microphones rely on the MCF5251CVM140's integrated host+function transceiver. The on-chip PHY supports full- and low-speed modes (12 Mbps / 1.5 Mbps) without external transceiver logic, while the tamper-proof RTC supplies the timestamped media clocking. Placed between the USB Type-C connector and the audio DAC, the MPU enumerates as a UAC1/UAC2 device and streams 48 kHz/24-bit PCM with sufficient CPU budget for ASIO-style buffering. Compared with discrete USB controllers, this integrated approach halves the BOM and removes a bus-bridge IC from the design. Verified USB-OTG stack drivers are mature for this device family.
Empfohlen
Industrial Human-Machine Interface (HMI) Panel
Industrial HMI panels benefit from the MCF5251CVM140's deterministic ColdFire V2 core, USB-OTG maintenance port, and tamper-proof RTC for logged events. At 140 MHz the device drives TFT panels via external LCD controller and renders bitmapped UI from external NOR flash, while the 32-bit external bus sustains refresh rates above 30 Hz for QVGA. The tamper-proof RTC supports secure time-stamping of alarms and logs - critical for IEC 61131-3 compliant automation. Placed on the controller board, the MPU pairs with a separate 4.3-7 inch TFT driver and a tactile-touch controller; the on-chip peripherals eliminate a discrete RTC + USB IC. Compared with ARM Cortex-M0 HMI solutions, the ColdFire offers ~3-4x the Dhrystone MIPS, easing future feature expansion.
Empfohlen
Set-Top Box Control Processor
The MCF5251CVM140 serves as the control processor in low-cost set-top box designs, where the on-chip eMAC handles OSD compositing and the USB-OTG port supports firmware upgrade via thumb drive. The ColdFire V2 at 140 MHz executes embedded uClinux for network stack handling (DLNA, IPTV channel management) while a separate media SoC handles video decode. The tamper-proof RTC supplies EPG timestamp accuracy and supports scheduled recording scenarios. Placed on the controller sub-board, the MPU interfaces to the main decoder via SPI/UART; designers avoid the cost of a separate RTC + USB controller. Compared with older 8-bit microcontrollers, the integrated peripherals reduce board area by 25-30%.
Empfohlen
Smart Cable / DRM Media Adapter
DRM-protected media distribution over USB or HDMI bridges benefits from the MCF5251CVM140's tamper-detection hardware and security features documented in the NXP family reference manual. The ColdFire V2 core executes AES-style bulk data pump between the host PC and the protected display device, with the eMAC handling the high-rate byte-shuffling without CPU stalls. Placed in line with the connector assembly, the MPU stays in low-power idle until traffic begins, conserving standby current. Compared with an FPGA-based AES pipe, this single-chip solution lowers active-mode power by 40-60% and shrinks the BOM to a single 13x13 mm BGA.
Empfohlen
Embedded Industrial Controller with USB Host
Embedded industrial controllers that must log data to USB thumb drives or print to USB HID printers benefit from the MCF5251CVM140's USB-OTG in Host mode combined with its industrial -40C to +85C temperature grade. At 140 MHz the core handles Modbus RTU over UART, plus USB Mass Storage file system (FAT32) read/write, plus RTC-stamped logging - all simultaneously without an OS. The external SDRAM bus sustains ~80 MB/s bandwidth for copying large log files. Compared with 16-bit MCUs that need a companion USB host ASIC, this solution shrinks the controller area by ~35% and reduces active power by ~25%.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCF5251CVM140 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCF5251VM140 | MCF5253CVM140 | MCF5251CVM80 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 225-MAPBGA (13x13) | 225-MAPBGA (13x13) - same | 225-MAPBGA (13x13) - same | 225-MAPBGA (13x13) - same |
| Core Clock | 140 MHz | 140 MHz | 140 MHz | 80 MHz (-43%) |
| USB-OTG | Yes (integrated PHY) | Yes (integrated PHY) | Yes (integrated PHY) | Yes (integrated PHY) |
| Ethernet MAC | Not included | Not included | Yes (10/100) | Not included |
| Memory Controller | SDRAM only | SDRAM only | DDR + SDRAM | SDRAM only |
| Tamper-Proof RTC | Yes | Yes | Yes | Yes |
| Lifecycle Status | Last Time Buy / EOL | Last Time Buy / EOL | Last Time Buy / EOL | Last Time Buy / EOL |
Wichtigste Unterscheidungsmerkmale
- Integrated USB-OTG with on-chip PHY (vs. MCF5251CVM80 (lower-speed 80 MHz family member))
- 10/100 Ethernet MAC absent on MCF5251CVM140 (present on MCF5253 variant) (vs. MCF5253CVM140)
- Same-package drop-in across the MCF525x family (vs. MCF5251VM140)
Designhinweise
Estimated: the 225-MAPBGA at 0.8 mm ball pitch requires a 4-layer (preferably 6-layer) PCB with 0.1 mm laser-drilled microvias or via-in-pad escapes to route the address/data bus through the inner rows. Plan for X-ray inspection on the assembly line and a controlled reflow profile per JEDEC J-STD-020. Keep high-speed SDRAM traces to <=25 mm with matched length +/-2.5 mm to preserve setup/hold margin.
Estimated: assuming 1.0 V core @ 140 MHz with 0.7 W core power plus ~0.3 W USB PHY @ active stream and ~0.2 W I/O, total dissipation is ~1.2 W into the 225-MAPBGA. The thermal resistance of this BGA (typical 25-35 C/W theta_JA on a 4-layer JEDEC test board) implies a junction-to-ambient rise of ~30-42 C. Derate to 85 C ambient with 10-15% margin only if the board has a solid inner ground plane and adequate copper flooding.
Do NOT design the schematic assuming the USB-OTG PHY can deliver 500 mA without a power-management IC - the MPU supports device-charging signaling but cannot source downstream VBUS current. Always include a discrete TPS2051/MIC2026-style power switch. Also: the boot mode straps must be pulled to a valid non-floating logic level at POR; floating straps lock the BDM into a wait state.
SDRAM clock and address/command traces on the external bus should be length-matched within +/-1.5 mm and routed over a continuous ground reference plane. Add 22-33 ohm series damping resistors on the SDRAM_CLK line near the MPU. Populate 22-100 ohm parallel termination on DQS lines only if the trace exceeds 30 mm. Per NXP family reference manual, maximum external bus clock should be verified against PCB impedance profile.
Compliance-Informationen
RoHS, REACH, lead-free, halogen-free, and conflict-mineral compliance statuses were not present in the verified web data and require verification against NXP's latest material declaration. ColdFire V2 devices are industrial-grade and are NOT AEC-Q100 qualified for automotive applications - AEC-Q100 marks not_applicable.
