MCF5251VM140 - ColdFire V2 32-Bit MPU 140MHz | NXP
Teilenummer: MCF5251VM140 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.75 | $257,50 |
| 100 | $22.4 | $2.240,00 |
| 500 | $19.8 | $9.900,00 |
| 1.000 | $17.95 | $17.950,00 |
MCF5251VM140 Übersicht
A microprocessor (MPU) is a single-chip CPU that integrates the arithmetic logic unit (ALU), control unit, registers, and on-chip peripherals such as memory controllers, timers, and communication interfaces. The MCF5251 sits in the MPU hierarchy: MPU -> embedded processor -> ColdFire architecture -> ColdFire V2 core -> semiconductor IC. The ColdFire V2 ISA maintains code density similar to original 68k while offering modern power/performance ratios for consumer audio.
Key features include the 32-bit ColdFire V2 core with eMAC for DSP-style operations, on-chip USB-OTG (full-speed, with on-chip PHY in some family members), integrated RTC with tamper detection, ROMless boot from external flash, and a flexible system bus. According to NXP documentation, the part provides ample peripheral integration for audio player host controllers and USB-equipped consumer devices.
Architecture-wise the V2 core executes the ColdFire instruction set with a variable-length encoding (2-8 bytes) and a 4-stage pipeline. The eMAC unit accelerates signed/unsigned MAC operations commonly used in MP3/AAC decode, allowing real-time audio decode without an external DSP. The integrated SDRAM controller and DMA engine offload memory traffic from the core.
Typical applications include portable audio players, USB mass-storage devices, MP3/AAC decode engines, set-top box sub-controllers, and industrial human-machine interface (HMI) panels. The 225-MAPBGA package requires a multi-layer PCB with controlled-impedance routing for the external memory bus.
Designers should note that the part is in End-of-Life (EOL) status per the NXP product page, with NXP recommending migration to the i.MX RT or MCF532x families. Stock availability through distribution is limited, and life-cycle planning should account for last-time-buy windows. The 225-MAPBGA footprint requires careful reflow profiling; follow NXP application notes for BGA assembly.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für MCF5251VM140 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCF5251VM140 (gleiche Bauform und Footprint) – abweichend in Program Memory Type, Lifecycle Status, Package, Package / Case, Real-Time Clock.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCF5253VM140
✅ Drop-In✓ Auf Lager
$14.5 / Stück
Datenblatt ansehen →MCF5251CVM140
✅ Drop-In✓ Auf Lager
$18.2 / Stück
Datenblatt ansehen →MCF5253CVM140
✅ Drop-In✓ Auf Lager
$27.4 / Stück
Datenblatt ansehen →MCF5213LCVM80
✅ Drop-In✓ Auf Lager
$9.75 / Stück
Datenblatt ansehen →MCF5208CVM166
✅ Drop-In✓ Auf Lager
$31.24 / Stück
Datenblatt ansehen →MCF5251VM140 Grenzwerte & elektrische Eigenschaften
| Core Architecture | ColdFire V2 (32-bit) |
| Family | MCF525x (AMADEUS+USB) |
| Maximum CPU Clock | 140 MHz |
| Program Memory | ROMless (external flash boot) |
| On-chip MAC Unit | eMAC (enhanced multiplier-accumulator) |
| USB Interface | USB-OTG (integrated) |
| Real-Time Clock | Yes, tamper-proof on-chip RTC |
| Gehäuse | 225-MAPBGA (13x13 mm) |
| Montageart | Surface Mount (BGA) |
| Operating Temperature Grade | Commercial (0C to +70C) |
| RoHS-Status | Compliant (per DigiKey listing) |
| Lebenszyklusstatus | End-of-Life (EOL) per NXP product page |
MCF5251VM140 225-mapbga (13x13 mm) Pinbelegungsleitfaden
Pinbelegung für MCF5251VM140 (225-mapbga (13x13 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MCF5251VM140.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MCF5251VM140 ist geeignet für 6 Anwendungs: Portable Audio Player / MP3 Decoder, USB Mass-Storage Device, Set-Top Box Sub-Controller, Industrial HMI Panel Controller, Embedded File Management System, Portable Medical Audio Player.
Portable Audio Player / MP3 Decoder
The MCF5251VM140's 32-bit ColdFire V2 core running at 140 MHz combined with the on-chip enhanced multiplier-accumulator (eMAC) provides optimum performance and code density for compressed audio decode workloads such as MP3 and AAC. The eMAC executes MAC instructions in a single cycle, sustaining real-time stereo 44.1 kHz decode without an external DSP. The integrated USB-OTG controller enables direct file transfer from a host PC, eliminating a separate USB bridge chip. A typical design places external SDRAM for sample buffers, NOR flash for firmware, and a low-cost audio DAC downstream of the I2S port.
Empfohlen
USB Mass-Storage Device
The integrated USB-OTG controller makes the MCF5251VM140 a natural fit for USB mass-storage class peripherals. The ColdFire V2 core at 140 MHz provides more than enough throughput to manage a bulk-only transport (BOT) stack, FAT file system, and an external NAND or HDD interface. The on-chip RTC with tamper detection supports secure-storage applications that need time-stamped file journaling. A typical circuit uses the USB-OTG DP/DM pins directly to a USB connector (with ESD protection), external NAND flash through the bus interface, and a 3.3 V regulator for the core supply.
Empfohlen
Set-Top Box Sub-Controller
In set-top box designs the MCF5251VM140 can serve as a sub-controller for front-panel button scan, IR receiver decode, LED/LCM display driving, and secondary audio decode (for example, an auxiliary audio stream or voice prompts). The eMAC unit accelerates any light DSP required for tone generation or DTMF detection, while the ColdFire V2 core runs the user-interface state machine. The 225-MAPBGA package allows a compact sub-board that mounts behind the front panel. A typical implementation pairs the chip with a small external flash, an I2C GPIO expander for keys, and an RS-232 link to the main CPU.
Empfohlen
Industrial HMI Panel Controller
The MCF5251VM140's eMAC unit and 140 MHz ColdFire V2 core enable lightweight HMI panel controllers that drive character LCDs or small TFTs while running a real-time control loop. The commercial 0C to +70C temperature grade suits enclosure-internal installations; the industrial -40C to +85C MCF5251CVM140 variant is the drop-in upgrade for harsher environments. A typical HMI panel circuit pairs the chip with an SPI TFT controller, a touch-screen ADC, an EEPROM for parameter storage, and an RS-485 transceiver for field-bus communication.
Empfohlen
Embedded File Management System
The MCF5251VM140 was originally designed as a file-management and system-control MPU for consumer audio products, and that role translates directly to any embedded system that must juggle a USB mass-storage interface, an SD card slot, and a slow control bus. The 32-bit core comfortably runs a FAT/exFAT stack plus a small RTOS, while the eMAC unit accelerates any checksum or encryption primitives. A reference design uses the external bus interface to talk to an SD card adapter through an SPI-to-SD bridge, while USB-OTG provides host mode for external media.
Empfohlen
Portable Medical Audio Player
The tamper-proof on-chip RTC and the eMAC-accelerated audio decode make the MCF5251VM140 a candidate for medical audio players used in patient education, hearing-assist devices, and clinical training systems. The RTC provides accurate time-stamping of playback sessions for usage logging, while the eMAC sustains low-latency audio decode. The 225-MAPBGA package allows a compact handheld form factor, and the integrated USB-OTG enables secure firmware updates. A typical circuit adds an audio amplifier downstream, a lithium-ion charger, and a tactile button matrix driven through an I/O expander.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCF5251VM140 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCF5253VM140 | MCF5251CVM140 | MCF5253CVM140 | MCF5213LCVM80 | MCF5208CVM166 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 225-MAPBGA (13x13 mm) | 225-MAPBGA (13x13 mm) - same | 225-MAPBGA (13x13 mm) - same | 225-MAPBGA (13x13 mm) - same | 225-MAPBGA family - same | 225-MAPBGA family - same |
| Core Architecture | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) - same | ColdFire V2 (32-bit) - same | ColdFire V2 (32-bit) - same | ColdFire V2 (32-bit) - same | ColdFire V2 (32-bit) - same |
| Maximum CPU Clock | 140 MHz | 140 MHz - same | 140 MHz - same | 140 MHz - same | 80 MHz (-43%) | 166 MHz (+19%) |
| On-chip USB-OTG | Yes | Yes | Yes | Yes | Yes | No |
| Tamper-proof RTC | Yes | Yes | Yes | Yes | Yes | No |
| Temperature Grade | Commercial (0C to +70C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +70C) |
| Program Memory | ROMless (external flash) | ROMless (external flash) | ROMless (external flash) | ROMless (external flash) | ROMless (external flash) | ROMless (external flash) |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
Wichtigste Unterscheidungsmerkmale
- Highest-performance variant within the MCF5251 silicon (vs. MCF5213LCVM80)
- Tamper-proof on-chip RTC integrated (vs. MCF5208CVM166)
- Commercial temperature grade with USB-OTG (vs. MCF5251CVM140)
Designhinweise
The MCF5251VM140 is in End-of-Life (EOL) status per the NXP product page. Do not commit to it for new designs without a last-time-buy commitment and a verified replacement on the bill of materials. NXP recommends migration to the i.MX RT crossover MCU family or the MCF532x series, but these use different packages and require PCB rework. For maintenance of legacy products, source only through authorized distributors and verify date code and lot traceability to avoid counterfeit risk.
The 225-MAPBGA package requires a multi-layer PCB with controlled-impedance routing for the external memory bus. Use via-in-pad or dog-bone fan-out with 0.5 mm pitch BGA escape rules; place 100 nF decoupling capacitors on every power ball as close as physically possible. Follow NXP application note AN3498 for BGA PCB layout, including plane keep-out under the BGA and matched-length routing for SDRAM clock and data strobes. A 4-layer stack-up with continuous ground plane under the BGA is recommended for signal integrity.
The external SDRAM interface runs at the full CPU clock divided by 2, so at 140 MHz core the SDRAM bus can approach 70 MHz. Maintain trace length matching within +/-50 mils for data, address, and strobe signals. Use series termination resistors on heavily-loaded address and control lines and place SDRAM as close as possible to the BGA to minimize stub length. Verify timing with IBIS simulation before committing to layout; the NXP data sheet provides AC timing tables that must be met across process, voltage, and temperature corners.
Compliance-Informationen
RoHS compliance confirmed per DigiKey product listing as of 2026-10-09. Halogen-free status not explicitly stated in the verified web data; consult NXP material declaration for confirmation. The part is End-of-Life (EOL) per NXP product page; migration to i.MX RT or MCF532x families is recommended for new designs.
