MCF5274LCVM166 - 32-Bit ColdFire V2 MPU 166MHz LBGA-196 | NXP
Teilenummer: MCF5274LCVM166 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $21.05 | $210,50 |
| 100 | $19.4 | $1.940,00 |
| 500 | $17.85 | $8.925,00 |
| 1.000 | $16.2 | $16.200,00 |
MCF5274LCVM166 Übersicht
ColdFire V2 microprocessors are a class of 32-bit RISC-instruction-set microcontrollers derived from the original Motorola 68000 family and optimized for embedded control. They occupy the middle of the broader taxonomy: 32-bit MPU -> ColdFire family -> ColdFire V2 core -> MCF527x series. Compared with V1 cores they add a hardware multiply/accumulate unit; compared with V3/V4 cores they trade peak performance for a much smaller die and lower cost. The MCF527x family in particular targets cost-sensitive connected-node applications where a deterministic 32-bit core, on-chip peripherals, and a single-chip BOM matter more than raw MHz.
Key features of the MCF5274LCVM166 include up to 166 MHz core frequency (Dhrystone 2.1 MIPS in the low hundreds), an integrated Fast Ethernet MAC, USB 2.0 Full-Speed device/host with on-chip PHY, hardware encryption accelerator (DES, 3DES, AES, SHA-1), and a flexible external memory controller supporting SDRAM, SRAM, and ROM. Integrated peripherals include DMA, timers, UARTs, I2C, QSPI, and an LCD controller on selected family members, allowing the device to operate as a true single-chip system-on-chip in many industrial designs.
Typical applications include industrial control and factory automation nodes, building-automation gateways, point-of-sale terminals, low-end networking and serial-protocol converters, and connected sensors that benefit from a deterministic 32-bit core with hardware crypto. The combination of Ethernet, USB, and crypto on a single chip historically made the MCF527x family a popular choice for industrial protocol bridges and embedded web servers.
When designing with this device, ensure the 196-ball LBGA is laid out on a multilayer PCB with a continuous ground plane to meet signal-integrity targets on the external memory bus. Decoupling must be placed directly under the package and follow NXP's reference design; the device is NRND, so engineers designing new products should plan for long-term availability from authorized stockists such as Rochester Electronics.
This page synthesizes NXP product-page data, distributor pricing, drop-in alternatives from the MCF527x family, and practical design notes that go beyond the manufacturer datasheet to help engineers make a sourcing decision.
Drop-in-Alternativen für MCF5274LCVM166 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCF5274LCVM166 (gleiche Bauform und Footprint) – abweichend in Package, Ethernet, Program Memory, USB, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCF5275LCVM166
✅ Drop-In✓ Auf Lager
$19.55 / Stück
Datenblatt ansehen →MCF5272LCVM150
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCF5277LCVM166
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCF5274LCVM166 Grenzwerte & elektrische Eigenschaften
| Core | ColdFire V2 (MCF527x family) |
| Core Architecture | 32-bit RISC (ColdFire) |
| Maximum Core Frequency | 166 MHz |
| Core Supply Voltage | 1.5 V |
| I/O Supply Voltage | 3.3 V |
| Program Memory | ROMless (external boot) |
| Gehäuse | 196-LBGA (15x15 mm) |
| Montageart | Surface Mount (BGA) |
| Temperature Grade | Industrial |
| Ethernet | 10/100 Fast Ethernet MAC (integrated PHY on selected family members) |
| USB | USB 2.0 Full-Speed Device/Host (integrated PHY on selected family members) |
| Cryptography | Hardware crypto accelerator (DES / 3DES / AES / SHA-1) |
| External Memory Bus | SDRAM / SRAM / ROM controller |
| Serial Peripherals | UART, I2C, QSPI |
| RoHS-Status | Compliant (per distributor listing) |
MCF5274LCVM166 196-lbga (15x15 mm) Pinbelegungsleitfaden
Pinbelegung für MCF5274LCVM166 (196-lbga (15x15 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MCF5274LCVM166.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MCF5274LCVM166 ist geeignet für 6 Anwendungs: Industrial Control Gateways, Building Automation Controllers, Point-of-Sale Terminals, Embedded Web Servers and Protocol Converters, Connected Sensor Hubs, Secure Industrial IoT Edge Nodes.
Industrial Control Gateways
The MCF5274LCVM166 fits industrial gateway designs because it integrates a 10/100 Fast Ethernet MAC, USB 2.0 Full-Speed, and a hardware crypto accelerator (DES/3DES/AES/SHA-1) on a single ColdFire V2 die running at 166 MHz. Engineers can use the on-chip Ethernet MAC for the fieldbus uplink and the USB port for local diagnostics or device provisioning, eliminating external MAC/bridge chips. The 1.5 V core at 166 MHz is fast enough for deterministic protocol stacks (Modbus TCP, EtherNet/IP, PROFINET soft-stack) while keeping BOM cost low.
Empfohlen
Building Automation Controllers
For building-automation nodes the MCF5274LCVM166 provides the combination of Ethernet connectivity, multiple UARTs, and a deterministic 32-bit ColdFire V2 core required to run BACnet, LonWorks, or KNX soft-stacks. The 196-LBGA integrates cleanly onto a multilayer control board with a compact 15x15 mm footprint, leaving room for power isolation and RS-485 transceivers. Hardware AES/SHA accelerates secure commissioning and TLS-style handshakes for IP-based building controllers.
Empfohlen
Point-of-Sale Terminals
POS terminals benefit from the MCF5274LCVM166's on-chip Ethernet and USB plus the ColdFire V2 core's deterministic response for PIN-pad, printer, and EFT software stacks. The hardware crypto block accelerates DES/3DES/AES for payment-data protection, while the integrated DMA controller offloads packet and printer-buffer movement. The 166 MHz V2 core is sufficient for headless POS designs; for graphical POS add an external LCD controller through the external memory bus.
Empfohlen
Embedded Web Servers and Protocol Converters
The MCF5274LCVM166 historically served as a single-chip embedded web/HTTP server and serial-to-Ethernet protocol converter. The ColdFire V2 core at 166 MHz runs a lightweight TCP/IP stack with HTTP/CGI while the on-chip Ethernet MAC terminates the network side and the UARTs/QSPI connect to legacy serial field devices. Hardware crypto allows HTTPS termination directly on the module, removing the need for an external TLS accelerator.
Empfohlen
Connected Sensor Hubs
Connected-sensor hubs aggregate multiple sensor buses (UART, I2C, QSPI) and forward data over Ethernet or USB - exactly the peripheral mix of the MCF5274LCVM166. The ColdFire V2 core runs edge-processing and filtering locally before transmitting, and the hardware crypto secures the uplink. The 196-LBGA footprint plus industrial temperature grade supports deployment in factory-floor and outdoor enclosures.
Empfohlen
Secure Industrial IoT Edge Nodes
Industrial IoT edge nodes demand hardware root-of-trust and on-die crypto, both of which the MCF5274LCVM166 provides through its DES/3DES/AES/SHA-1 accelerator. The ColdFire V2 core can run a small secure boot loader from external flash while the integrated Ethernet/USB serve as the trusted network uplink. Although the part is NRND, its mature software ecosystem and long-lifecycle authorized stock make it a viable choice for retrofit and brownfield IIoT deployments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCF5274LCVM166 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCF5275LCVM166 | MCF5272LCVM150 | MCF5277LCVM166 |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 196-LBGA (15x15) | 196-LBGA (15x15) - same | 196-LBGA (15x15) - same | 196-LBGA (15x15) - same |
| Core | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| Maximum Core Frequency | 166 MHz | 166 MHz | 150 MHz | 166 MHz |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Ethernet MAC | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated |
| USB | USB 2.0 FS integrated PHY | USB 2.0 FS integrated PHY | USB 2.0 FS integrated PHY | USB 2.0 FS integrated PHY |
| Hardware Crypto | DES/3DES/AES/SHA-1 | DES/3DES/AES/SHA-1 | DES/3DES/AES/SHA-1 | DES/3DES/AES/SHA-1 |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Wichtigste Unterscheidungsmerkmale
- Higher core frequency within the same MCF527x family (vs. MCF5272LCVM150)
- Mature software ecosystem and on-chip crypto (vs. MCF5216CVM66)
- Cost-optimized V2 with deterministic performance (vs. MCF5372LCVM240)
Designhinweise
The 196-LBGA (15x15 mm) requires a multilayer PCB with a continuous ground plane directly beneath the package. Use NXP's reference ballout from the MCF527x family reference manual and follow the recommended via-in-pad or dog-bone fanout to keep the external memory bus within signal-integrity margins. Decoupling capacitors must be placed as close as possible to each power/ground ball pair, with a mix of bulk, mid-range, and high-frequency ceramics to cover ColdFire V2 core switching transients.
Estimated: at 1.5 V core, 166 MHz, and a typical V2 core current around 250 mA, the part dissipates roughly 0.4 W. With a 196-LBGA thermal resistance typically in the 25-35 C/W range, the junction-to-ambient rise is approximately 10-15 C above ambient, which is comfortably within industrial-grade limits. Designers should still confirm the actual theta_JA from the NXP family datasheet and provide adequate copper pour on the top layer under the LBGA for production-margin safety.
Because the MCF5274LCVM166 is NRND, avoid designing it into new greenfield products unless an authorized long-term stockist (e.g., Rochester Electronics) has committed to multi-year supply. For new designs, evaluate current-generation NXP ColdFire / Kinetis parts with active roadmaps. Also note that the LCVM166 suffix indicates a 1.5 V core - it is not voltage-compatible with the older 2.x V LVM166 variants, even though the package and pinout appear similar.
The MCF5274LCVM166 requires two supplies - 1.5 V for the ColdFire V2 core and 3.3 V for I/O - and the sequencing requirements must be implemented so that the core rail comes up before or simultaneously with the I/O rail. Use a power-management IC with the required sequencing, or a small discrete supervisor, to avoid latch-up. Add bulk decoupling at the regulator outputs and additional decoupling at each power pin per NXP's reference schematic.
Compliance-Informationen
RoHS compliant per distributor listings; AEC-Q100 not applicable to this industrial-grade MPU. Halogen-free status and conflict-minerals compliance not stated in the verified web data.
