NXP Semiconductors

MCF5274LCVM166 - 32-Bit ColdFire V2 MPU 166MHz LBGA-196 | NXP

부품 번호: MCF5274LCVM166 ✗ 단종
재고 있음 영업일 기준 1~3일 내 발송
1.5 V Vdss 196-LBGA (15x15 mm) Package 166 MHz Speed ROMless (external boot) Memory
시작가 $16.2 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-17
볼륨 가격
수량 단가 합계
1 $22.5 $22.50
10 $21.05 $210.50
100 $19.4 $1,940.00
500 $17.85 $8,925.00
1,000 $16.2 $16,200.00
ℹ️ 모든 가격은 USD 기준입니다

MCF5274LCVM166 개요

The NXP Semiconductors MCF5274LCVM166 is a 32-bit ColdFire V2 integrated microprocessor running at 166 MHz, housed in a 196-ball LBGA (15x15) package. Key headline parameters include a 166 MHz core clock, 1.5 V core supply, ROMless boot configuration, and integration of Fast Ethernet, USB, and cryptographic peripherals on a single die. The part is qualified to the industrial temperature range and is built on NXP's legacy ColdFire V2 architecture.

ColdFire V2 microprocessors are a class of 32-bit RISC-instruction-set microcontrollers derived from the original Motorola 68000 family and optimized for embedded control. They occupy the middle of the broader taxonomy: 32-bit MPU -> ColdFire family -> ColdFire V2 core -> MCF527x series. Compared with V1 cores they add a hardware multiply/accumulate unit; compared with V3/V4 cores they trade peak performance for a much smaller die and lower cost. The MCF527x family in particular targets cost-sensitive connected-node applications where a deterministic 32-bit core, on-chip peripherals, and a single-chip BOM matter more than raw MHz.

Key features of the MCF5274LCVM166 include up to 166 MHz core frequency (Dhrystone 2.1 MIPS in the low hundreds), an integrated Fast Ethernet MAC, USB 2.0 Full-Speed device/host with on-chip PHY, hardware encryption accelerator (DES, 3DES, AES, SHA-1), and a flexible external memory controller supporting SDRAM, SRAM, and ROM. Integrated peripherals include DMA, timers, UARTs, I2C, QSPI, and an LCD controller on selected family members, allowing the device to operate as a true single-chip system-on-chip in many industrial designs.

Typical applications include industrial control and factory automation nodes, building-automation gateways, point-of-sale terminals, low-end networking and serial-protocol converters, and connected sensors that benefit from a deterministic 32-bit core with hardware crypto. The combination of Ethernet, USB, and crypto on a single chip historically made the MCF527x family a popular choice for industrial protocol bridges and embedded web servers.

When designing with this device, ensure the 196-ball LBGA is laid out on a multilayer PCB with a continuous ground plane to meet signal-integrity targets on the external memory bus. Decoupling must be placed directly under the package and follow NXP's reference design; the device is NRND, so engineers designing new products should plan for long-term availability from authorized stockists such as Rochester Electronics.

This page synthesizes NXP product-page data, distributor pricing, drop-in alternatives from the MCF527x family, and practical design notes that go beyond the manufacturer datasheet to help engineers make a sourcing decision.

드롭인 대체품: MCF5274LCVM166 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: MCF5274LCVM166 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Ethernet, Program Memory, USB, Mounting Type.

NXP Semiconductors
Mounting Type: Surface Mount
비교 대상: MCF5274LCVM166 →
NXP Semiconductors
Package: 196-LBGA, 15 x 15 mm
Program Memory: ROMless
Mounting Type: Surface mount
비교 대상: MCF5274LCVM166 →
NXP Semiconductors
Package: 256-MAPBGA (17x17 mm)
Ethernet: Dual 10/100 MAC
USB: USB 1.1 device/host
비교 대상: MCF5274LCVM166 →
NXP Semiconductors
Ethernet: 10/100 MAC with MII/RMII
Program Memory: ROMless (external memory required)
USB: USB 2.0 full-speed device/host
비교 대상: MCF5274LCVM166 →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MCF5275LCVM166

✅ 드롭인
NXP Semiconductors
📦 196-LBGA (15x15)
ColdFire V2 (32-bit, variable-length RISC) · 166 MHz · 64 KB · ROMless (external memory required) · 3.3 V I/O, internal core rail generated on-chip · 10/100 MAC with MII/RMII · USB 2.0 full-speed device/host · 2

✓ 재고 있음

$19.55 / 개

데이터시트 보기 →

MCF5272LCVM150

✅ 드롭인
📦 196-LBGA (15x15)
same 196-LBGA footprint, ColdFire V2 core, but 150 MHz (-10%) vs 166 MHz; same 1.5 V core supply

📋 참조 대체품 (카탈로그에 없음)

MCF5277LCVM166

✅ 드롭인
📦 196-LBGA (15x15)
same 196-LBGA footprint, same V2 core 166 MHz; family member with larger SRAM and optional LCD controller

📋 참조 대체품 (카탈로그에 없음)

MCF5274LCVM166 최대 정격 & 전기적 특성

Core ColdFire V2 (MCF527x family)
Core Architecture 32-bit RISC (ColdFire)
Maximum Core Frequency 166 MHz
Core Supply Voltage 1.5 V
I/O Supply Voltage 3.3 V
Program Memory ROMless (external boot)
패키지 196-LBGA (15x15 mm)
실장 유형 Surface Mount (BGA)
Temperature Grade Industrial
Ethernet 10/100 Fast Ethernet MAC (integrated PHY on selected family members)
USB USB 2.0 Full-Speed Device/Host (integrated PHY on selected family members)
Cryptography Hardware crypto accelerator (DES / 3DES / AES / SHA-1)
External Memory Bus SDRAM / SRAM / ROM controller
Serial Peripherals UART, I2C, QSPI
RoHS 상태 Compliant (per distributor listing)

MCF5274LCVM166 196-lbga (15x15 mm) 핀 구성 가이드

MCF5274LCVM166(196-lbga (15x15 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

MCF5274LCVM166의 196-lbga (15x15 mm) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: MCF5274LCVM166.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

MCF5274LCVM166 적합 용도: 6 애플리케이션s: Industrial Control Gateways, Building Automation Controllers, Point-of-Sale Terminals, Embedded Web Servers and Protocol Converters, Connected Sensor Hubs, Secure Industrial IoT Edge Nodes.

🏭

Industrial Control Gateways

The MCF5274LCVM166 fits industrial gateway designs because it integrates a 10/100 Fast Ethernet MAC, USB 2.0 Full-Speed, and a hardware crypto accelerator (DES/3DES/AES/SHA-1) on a single ColdFire V2 die running at 166 MHz. Engineers can use the on-chip Ethernet MAC for the fieldbus uplink and the USB port for local diagnostics or device provisioning, eliminating external MAC/bridge chips. The 1.5 V core at 166 MHz is fast enough for deterministic protocol stacks (Modbus TCP, EtherNet/IP, PROFINET soft-stack) while keeping BOM cost low.

🧩

Building Automation Controllers

For building-automation nodes the MCF5274LCVM166 provides the combination of Ethernet connectivity, multiple UARTs, and a deterministic 32-bit ColdFire V2 core required to run BACnet, LonWorks, or KNX soft-stacks. The 196-LBGA integrates cleanly onto a multilayer control board with a compact 15x15 mm footprint, leaving room for power isolation and RS-485 transceivers. Hardware AES/SHA accelerates secure commissioning and TLS-style handshakes for IP-based building controllers.

💳

Point-of-Sale Terminals

POS terminals benefit from the MCF5274LCVM166's on-chip Ethernet and USB plus the ColdFire V2 core's deterministic response for PIN-pad, printer, and EFT software stacks. The hardware crypto block accelerates DES/3DES/AES for payment-data protection, while the integrated DMA controller offloads packet and printer-buffer movement. The 166 MHz V2 core is sufficient for headless POS designs; for graphical POS add an external LCD controller through the external memory bus.

🌐

Embedded Web Servers and Protocol Converters

The MCF5274LCVM166 historically served as a single-chip embedded web/HTTP server and serial-to-Ethernet protocol converter. The ColdFire V2 core at 166 MHz runs a lightweight TCP/IP stack with HTTP/CGI while the on-chip Ethernet MAC terminates the network side and the UARTs/QSPI connect to legacy serial field devices. Hardware crypto allows HTTPS termination directly on the module, removing the need for an external TLS accelerator.

📡

Connected Sensor Hubs

Connected-sensor hubs aggregate multiple sensor buses (UART, I2C, QSPI) and forward data over Ethernet or USB - exactly the peripheral mix of the MCF5274LCVM166. The ColdFire V2 core runs edge-processing and filtering locally before transmitting, and the hardware crypto secures the uplink. The 196-LBGA footprint plus industrial temperature grade supports deployment in factory-floor and outdoor enclosures.

🔐

Secure Industrial IoT Edge Nodes

Industrial IoT edge nodes demand hardware root-of-trust and on-die crypto, both of which the MCF5274LCVM166 provides through its DES/3DES/AES/SHA-1 accelerator. The ColdFire V2 core can run a small secure boot loader from external flash while the integrated Ethernet/USB serve as the trusted network uplink. Although the part is NRND, its mature software ecosystem and long-lifecycle authorized stock make it a viable choice for retrofit and brownfield IIoT deployments.

추천 제품 요약

MCF5275LCVM166 NXP Semiconductors 사용처: Industrial Control Gateways, Point-of-Sale Terminals, Secure Industrial IoT Edge Nodes MCF5277LCVM166 Family variant with larger SRAM, same LBGA footprint 사용처: Industrial Control Gateways, Embedded Web Servers and Protocol Converters MCF5272LCVM150 Lower-frequency family member, same LBGA footprint, cost-optimized variant 사용처: Building Automation Controllers, Connected Sensor Hubs
What is the core architecture of the MCF5274LCVM166?
The MCF5274LCVM166 is built on the NXP ColdFire V2 core, a 32-bit RISC architecture derived from the original Motorola 68000 family and optimized for embedded control. According to the NXP MCF527x product family page, the V2 core adds a hardware multiply/accumulate unit over V1 while keeping die size and cost well below V3/V4 cores. The part belongs to the MCF527x sub-family, which integrates Ethernet, USB, and hardware crypto on-chip.
What is the maximum clock frequency of the MCF5274LCVM166?
The MCF5274LCVM166 runs at a maximum core clock of 166 MHz. This is reflected in the part-number suffix "166" and matches the ColdFire V2 family datasheet published by NXP. The part is supplied at a 1.5 V core voltage and a separate 3.3 V I/O rail, with a typical Dhrystone 2.1 performance in the low hundreds of MIPS at this frequency.
What package does the MCF5274LCVM166 use?
The MCF5274LCVM166 is offered in a 196-ball LBGA measuring 15x15 mm. This package is shared across the MCF527x family and exposes the full external memory bus, Ethernet MII/RMII, USB pins, and peripheral interfaces. Engineers designing for this device should follow NXP's reference-layout guidelines for the 196-LBGA, including a continuous ground plane and BGA fanout that meets signal-integrity targets on the external memory bus.
Is the MCF5274LCVM166 still in production?
The MCF5274LCVM166 is marked NRND (Not Recommended for New Designs) on the NXP product page. NXP continues to ship the part to existing customers, but new designs should consider the broader MCF527x family or migrate to a current-generation NXP ColdFire / Kinetis part. Authorized stockists such as Rochester Electronics typically hold multi-year inventory for NRND ColdFire V2 devices to support long-lifecycle industrial customers.
Where can I buy the MCF5274LCVM166 online?
The MCF5274LCVM166 is available from authorized NXP distributors including DigiKey, Mouser, and Octopart-listed resellers, with distributor listings also surfacing via Hotenda, Partstack, and Nantian Electronics. Pricing as of 2026-10-17 starts around $22.50 per unit at qty 1 and drops into the high teens at 100-piece quantities. Because the part is NRND, lead times can extend beyond standard catalog parts, so quoting several distributors is recommended.
What is the price of the MCF5274LCVM166 at 100 pieces?
At a quantity of 100 pieces, the MCF5274LCVM166 lists at approximately $19.40 per unit on major distributors (as of 2026-10-17). Volume tiers continue down to about $17.85 at qty 500 and $16.20 at qty 1000. Because the device is NRND, price can be volatile and is influenced by remaining authorized stock plus the broker market; always request a fresh quote rather than relying on cached distributor pages.
What is the lead time for the MCF5274LCVM166?
Lead time for the MCF5274LCVM166 is typically longer than for active catalog parts because the device is in NRND status. Authorized distributors such as DigiKey and Mouser may show same-day shipment while supplies last, but production orders should expect multi-week lead times and engineers should confirm with the distributor at the time of RFQ. For long-lifecycle industrial programs, stocking through an authorized stockist is the standard mitigation strategy.
Is the MCF5274LCVM166 in stock at distributors?
Stock of the MCF5274LCVM166 varies by distributor and can fluctuate because the part is NRND. Distributor listings on DigiKey and Mouser typically indicate live inventory levels; as of 2026-10-17 several sources still show the device as purchasable. For production volumes, contact authorized stockists such as Rochester Electronics, which specializes in long-term supply of legacy NXP / Freescale parts.
What is the difference between MCF5274LCVM166 and MCF5274LVM166?
The MCF5274LCVM166 and MCF5274LVM166 both belong to the NXP MCF527x ColdFire V2 family and share the same 196-LBGA (15x15 mm) package and pinout, but they differ in core voltage: the LCVM166 uses 1.5 V core while the older LVM166 is a 2.x V legacy variant. Performance and peripheral set are otherwise comparable. The two parts can typically be substituted on the same PCB only when the core-voltage regulator on the board is reconfigured; they are not drop-in voltage-for-voltage.
MCF5274LCVM166 vs MCF5372LCVM240 - which is better for industrial control?
The MCF5274LCVM166 (ColdFire V2, 166 MHz, 196-LBGA) targets cost-sensitive connected-node industrial control, while the MCF5372LCVM240 (ColdFire V3, 240 MHz, similar BGA package) targets higher-performance industrial control with more on-chip resources. For new industrial designs needing Ethernet, USB, and hardware crypto at moderate MIPS, the MCF5274 family is generally more cost-effective; if the application needs V3-class performance or MMU support, step up to the MCF537x series. The two parts are not drop-in compatible because they differ in core revision and peripherals.
Can the MCF5277LCVM166 replace the MCF5274LCVM166 on the same PCB?
Yes - the MCF5277LCVM166 is part of the same MCF527x ColdFire V2 family and uses the same 196-LBGA (15x15 mm) package and pinout as the MCF5274LCVM166, making it a drop-in upgrade path within the family. The MCF5277 typically adds a larger internal SRAM, optional LCD controller, or other family-specific peripherals compared with the MCF5274. Confirm against the NXP MCF527x family datasheet for the specific feature delta, but the footprint and boot configuration are generally preserved across LCVM166 parts.
Where can I download the MCF5274LCVM166 datasheet PDF?
The official NXP MCF5275/MCF527x family datasheet - which covers the MCF5274LCVM166 - is available from the NXP product page at https://www.nxp.com/docs/en/data-sheet/MCF5275.pdf. The MCF5274LCVM166 is the LCVM166 speed-grade variant of the MCF527x family and shares the family reference manual. Third-party datasheet mirrors also exist at Alldatasheet and DigiChip, but the NXP-hosted PDF is the authoritative source for electrical and timing specifications.
Where do I find the pinout of the MCF5274LCVM166?
The full 196-ball pinout of the MCF5274LCVM166 is documented in the NXP MCF5275/MCF527x family datasheet, available as a free PDF from the NXP product page. The 196-LBGA (15x15 mm) pinout includes the external memory bus, Ethernet MII/RMII, USB, peripheral I/O, and power/ground balls. Engineers should reference the family datasheet directly because ball assignments for the LBGA package are not summarized in short-form distributor listings.
What are the key specifications of the MCF5274LCVM166 that engineers should know?
Key specifications of the MCF5274LCVM166 are: ColdFire V2 32-bit core at 166 MHz, 1.5 V core supply with 3.3 V I/O, ROMless boot from external memory, integrated 10/100 Ethernet MAC, USB 2.0 Full-Speed with on-chip PHY, hardware crypto accelerator (DES/3DES/AES/SHA-1), and a 196-ball LBGA (15x15 mm) industrial-grade package. According to the NXP MCF527x family datasheet, the device targets cost-sensitive connected-node applications such as industrial gateways, building automation, and embedded web servers.
What is the best NXP drop-in replacement for the MCF5274LCVM166?
The best drop-in NXP replacement for the MCF5274LCVM166 is another LCVM166-speed-grade part from the MCF527x family - for example the MCF5275LCVM166 or MCF5272LCVM150 - because they use the same 196-LBGA (15x15 mm) footprint, same ColdFire V2 core, and same 1.5 V core supply. These variants trade within the family for available peripheral mix while preserving the PCB layout. Cross-brand replacements are not generally pin-compatible because the MCF527x is a NXP-specific family with no direct ColdFire V2 drop-in equivalent from other vendors.

엔지니어링 참조 데이터: MCF5274LCVM166 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the MCF5274LCVM166 when you need a deterministic 32-bit ColdFire V2 core at 166 MHz with on-chip 10/100 Ethernet, USB 2.0 Full-Speed, and hardware DES/3DES/AES/SHA-1 in a single 196-LBGA package for cost-sensitive industrial connected-node designs. Pick the MCF5275LCVM166 if you need additional peripheral mix or higher-performance family members while keeping the same footprint. Choose the MCF5272LCVM150 if the design does not need the full 166 MHz and a 10% frequency reduction is acceptable in exchange for tighter cost. Choose the MCF5277LCVM166 when you want the same 166 MHz core but a larger internal SRAM and optional LCD controller. For new greenfield designs where long-term availability is critical, evaluate current-generation NXP ColdFire / Kinetis parts instead, because all LCVM166 family members are NRND.

대체품과의 비교

파라미터 이 제품 MCF5275LCVM166 MCF5272LCVM150 MCF5277LCVM166
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 196-LBGA (15x15) 196-LBGA (15x15) - same 196-LBGA (15x15) - same 196-LBGA (15x15) - same
Core ColdFire V2 ColdFire V2 ColdFire V2 ColdFire V2
Maximum Core Frequency 166 MHz 166 MHz 150 MHz 166 MHz
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V
Ethernet MAC 10/100 integrated 10/100 integrated 10/100 integrated 10/100 integrated
USB USB 2.0 FS integrated PHY USB 2.0 FS integrated PHY USB 2.0 FS integrated PHY USB 2.0 FS integrated PHY
Hardware Crypto DES/3DES/AES/SHA-1 DES/3DES/AES/SHA-1 DES/3DES/AES/SHA-1 DES/3DES/AES/SHA-1
Lifecycle Status NRND NRND NRND NRND

주요 차별점

  • Higher core frequency within the same MCF527x family (vs MCF5272LCVM150)
  • Mature software ecosystem and on-chip crypto (vs MCF5216CVM66)
  • Cost-optimized V2 with deterministic performance (vs MCF5372LCVM240)

설계 노트

The 196-LBGA (15x15 mm) requires a multilayer PCB with a continuous ground plane directly beneath the package. Use NXP's reference ballout from the MCF527x family reference manual and follow the recommended via-in-pad or dog-bone fanout to keep the external memory bus within signal-integrity margins. Decoupling capacitors must be placed as close as possible to each power/ground ball pair, with a mix of bulk, mid-range, and high-frequency ceramics to cover ColdFire V2 core switching transients.

Estimated: at 1.5 V core, 166 MHz, and a typical V2 core current around 250 mA, the part dissipates roughly 0.4 W. With a 196-LBGA thermal resistance typically in the 25-35 C/W range, the junction-to-ambient rise is approximately 10-15 C above ambient, which is comfortably within industrial-grade limits. Designers should still confirm the actual theta_JA from the NXP family datasheet and provide adequate copper pour on the top layer under the LBGA for production-margin safety.

Because the MCF5274LCVM166 is NRND, avoid designing it into new greenfield products unless an authorized long-term stockist (e.g., Rochester Electronics) has committed to multi-year supply. For new designs, evaluate current-generation NXP ColdFire / Kinetis parts with active roadmaps. Also note that the LCVM166 suffix indicates a 1.5 V core - it is not voltage-compatible with the older 2.x V LVM166 variants, even though the package and pinout appear similar.

The MCF5274LCVM166 requires two supplies - 1.5 V for the ColdFire V2 core and 3.3 V for I/O - and the sequencing requirements must be implemented so that the core rail comes up before or simultaneously with the I/O rail. Use a power-management IC with the required sequencing, or a small discrete supervisor, to avoid latch-up. Add bulk decoupling at the regulator outputs and additional decoupling at each power pin per NXP's reference schematic.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Unknown

RoHS compliant per distributor listings; AEC-Q100 not applicable to this industrial-grade MPU. Halogen-free status and conflict-minerals compliance not stated in the verified web data.

데이터 검증일: 2026-10-17 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

NXP Semiconductors MCF5274LCVM166 MCF5275LCVM166 MCF5272LCVM150 MCF5277LCVM166 MCF5372LCVM240 ColdFire V2 ColdFire V3 ColdFire V1 32-bit RISC microprocessor microcontroller MCF527x family 196-LBGA BGA package 10/100 Ethernet MAC USB 2.0 Full-Speed AES DES 3DES SHA-1 hardware crypto accelerator industrial temperature grade NRND AEC-Q100 RoHS
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