MCF5372LCVM240J - ColdFire V3 240MHz 32-Bit MPU | NXP | 196-LBGA
Teilenummer: MCF5372LCVM240J ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.95 | $2.995,00 |
| 250 | $27.4 | $6.850,00 |
| 500 | $25.1 | $12.550,00 |
MCF5372LCVM240J Übersicht
A microprocessor (MPU) is a CPU chip without on-chip Flash memory; the system stores code in external NOR/NAND Flash or SDRAM. The ColdFire V3 core is a variable-length RISC architecture derived from the original Motorola 68k family, optimized for embedded control with deterministic interrupt response and a compact code footprint. MCF537x parts sit in the NXP ColdFire hierarchy as: ColdFire V3 -> MCF537x family -> 32-bit microprocessor -> embedded MPU -> semiconductor.
Key specifications include a 240 MHz core clock, ROMless architecture requiring external boot memory, a 196-pin LBGA package, and an integrated peripheral set typical of the MCF5372 family (Ethernet MAC, USB, UARTs, timers, and external memory bus). The 'J' suffix designates industrial temperature grade (-40C to +85C). The LBGA-196 footprint provides generous thermal dissipation and high I/O density, suited to multilayer PCBs.
Typical applications include industrial automation controllers, HMI panels, building automation gateways, point-of-sale terminals, and networked sensor hubs. The combination of ColdFire determinism, integrated Ethernet, and ROMless expandability supports long-lifecycle embedded platforms.
Designers should plan an external boot Flash and SDRAM interface with proper bus-termination and decoupling. Verify firmware boot mode selection resistors before PCB fabrication. For thermal management, the LBGA's exposed die and large copper area on inner PCB layers provide adequate heat spreading at typical industrial workloads.
This page synthesizes distributor availability, lifecycle (NRND) status, parametric cross-reference data, and practical design considerations not collated on individual datasheet sites.
Drop-in-Alternativen für MCF5372LCVM240J – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCF5372LCVM240J (gleiche Bauform und Footprint) – abweichend in Mounting Type, Core Architecture, Ethernet MAC, Maximum Clock Frequency, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCF5372LCVM240
✅ Drop-In✓ Auf Lager
$15.4 / Stück
Datenblatt ansehen →MCF5372LVM240
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCF5373LCVM240
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCF52277CVM160J
✅ Drop-In✓ Auf Lager
$14.85 / Stück
Datenblatt ansehen →MCF5372LCVM240J Grenzwerte & elektrische Eigenschaften
| Core | ColdFire V3 (MCF537x) |
| Datenbusbreite | 32-bit |
| Maximale Taktfrequenz | 240 MHz |
| Architecture | Variable-length RISC (ColdFire) |
| Program Memory Type | ROMless (external boot memory required) |
| Gehäuse / Bauform | 196-LBGA (MAP-BGA, 15x15 mm) |
| Montageart | Surface Mount (BGA) |
| Peripherals | Ethernet MAC, USB, UART, timers (per MCF5372 family) |
| External Memory Interface | External SDRAM/NOR Flash bus |
| Lebenszyklusstatus | NRND (Not Recommended for New Designs) |
MCF5372LCVM240J 196-lbga (map-bga, 15x15 mm) Pinbelegungsleitfaden
Pinbelegung für MCF5372LCVM240J (196-lbga (map-bga, 15x15 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MCF5372LCVM240J.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MCF5372LCVM240J ist geeignet für 6 Anwendungs: Industrial Automation Controllers, Human-Machine Interface (HMI) Panels, Building Automation Gateways, Point-of-Sale (POS) Terminals, Networked Sensor Hubs, Embedded Networking Equipment.
Industrial Automation Controllers
The MCF5372LCVM240J's 240 MHz ColdFire V3 core and integrated Ethernet MAC make it well suited to PLC-class industrial controllers requiring deterministic real-time response. Placed on a multilayer PCB with external SDRAM and boot Flash, the part executes IEC 61131-3 style control loops and communicates with field I/O over EtherNet/IP or Modbus TCP. The industrial -40C to +85C temperature range supports cabinet-mount installations, while the ROMless architecture lets integrators size memory to their application footprint. Unlike smaller Cortex-M parts, the ColdFire V3 deterministic interrupt latency simplifies hard-real-time scheduling without an RTOS in many loop-control designs.
Empfohlen
Human-Machine Interface (HMI) Panels
The 240 MHz ColdFire V3 performance and 196-pin LBGA's generous I/O budget suit HMI panels driving TFT LCDs and touch controllers. With external SDRAM for framebuffers and external NOR Flash for assets, the MCF5372LCVM240J serves as the main MPU for operator-interface panels in factory automation. The integrated Ethernet and USB simplify connection to PLCs and programming ports. Compared with MCUs lacking an external memory bus, the ROMless architecture accommodates large graphical assets and multi-language UI strings without on-chip Flash constraints.
Empfohlen
Building Automation Gateways
Building automation gateways aggregate BACnet, Modbus, and proprietary HVAC protocols, and the MCF5372LCVM240J's ColdFire V3 core with on-chip Ethernet MAC addresses this requirement. The 32-bit data path and 240 MHz clock sustain multiple concurrent protocol stacks (BACnet/IP, Modbus TCP, and LonWorks gateways) without task starvation. The industrial temperature range allows deployment in unconditioned mechanical rooms, and the external memory bus permits large protocol-stack libraries plus trend-logging buffers in SDRAM. Compared to single-protocol MCUs, this MPU's peripheral mix reduces external glue logic.
Empfohlen
Point-of-Sale (POS) Terminals
POS terminals combine transaction processing, receipt printing, and network connectivity, and the MCF5372LCVM240J's integrated Ethernet and USB peripherals address these needs. The 240 MHz ColdFire V3 core runs the terminal application with payment flow control, while the external memory bus supports customer-facing displays and encrypt/decrypt libraries. The 196-LBGA package provides sufficient I/O for magnetic-stripe readers, thermal printers, and customer LCDs. Compared with entry-level Cortex-M0 designs, this MPU's bandwidth and peripheral mix reduce host-side latency in retail checkout flows.
Empfohlen
Networked Sensor Hubs
Networked sensor hubs aggregate analog and digital sensor data and forward it over Ethernet to supervisory systems. The MCF5372LCVM240J's integrated Ethernet MAC, multiple UARTs, and SPI/I2C interfaces accommodate multi-sensor topologies in industrial sensor hubs. The 240 MHz core performs local filtering, calibration, and protocol framing before transmission, offloading work from central servers. The industrial -40C to +85C range supports outdoor or factory-floor deployment. Compared with smaller MCUs, this MPU's bandwidth and external memory bus handle large data logger buffers without off-chip RAM contention.
Empfohlen
Embedded Networking Equipment
Embedded networking equipment such as protocol converters and edge routers benefit from the MCF5372LCVM240J's integrated Ethernet MAC, USB, and serial peripherals. The ColdFire V3 32-bit core at 240 MHz executes TCP/IP stacks and routing tables efficiently, while the external memory bus supports large routing tables and packet buffers. The 196-LBGA package's I/O density accommodates multiple PHY connections and status LEDs. Compared with microcontroller-class alternatives, this MPU provides the throughput and memory bandwidth needed for sustained multi-Mbps traffic without processor saturation.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCF5372LCVM240J – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCF5372LCVM240 | MCF5372LVM240 | MCF5373LCVM240 | MCF52277CVM160J |
|---|---|---|---|---|---|
| Package | 196-LBGA (MAP-BGA, 15x15 mm) | 196-LBGA (MAP-BGA, 15x15 mm) - same | 196-LBGA (MAP-BGA, 15x15 mm) - same | 196-LBGA (MAP-BGA, 15x15 mm) - same | MAP-BGA - same family footprint |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ColdFire V3 (MCF537x) | ColdFire V3 (MCF537x) - same | ColdFire V3 (MCF537x) - same | ColdFire V3 (MCF537x) - same family | ColdFire V2 (MCF5227x) |
| Maximum Clock Frequency | 240 MHz | 240 MHz | 240 MHz | 240 MHz | 160 MHz (-33%) |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Program Memory | ROMless (external boot memory required) | ROMless | ROMless | ROMless | ROMless |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade (-40C to +85C) (vs. MCF5372LCVM240)
- 240 MHz ColdFire V3 core performance (vs. MCF52277CVM160J)
- ColdFire V3 deterministic interrupt architecture (vs. MCF52277CVM160J)
Designhinweise
Estimated: The 196-LBGA (15x15 mm) package requires multilayer PCB design with at least 4 layers and a continuous ground plane beneath the BGA. Use 0.5 mm pitch BGA fanout with microvia-in-pad (if the PCB fabricator supports it) to route the 196 balls. Inner ground and power planes directly under the BGA reduce inductance and improve signal integrity for the external memory bus, which typically runs at 80-120 MHz. Daisy-chain or point-to-point memory topology depends on trace length and SDRAM datasheet requirements.
Route the external SDRAM and NOR Flash data/address/control traces with matched length (within +/- 50 mil) and 50-ohm controlled impedance. Place external boot Flash closer than SDRAM to minimize boot-time access latency. The MCF5372LCVM240J requires careful boot-mode configuration via pull-up/pull-down resistors on dedicated pins; verify these resistor positions against the NXP MCF537x reference manual before PCB fabrication to avoid board respins.
Estimated: At full 240 MHz operation with sustained GPIO toggling, the MCF5372LCVM240J may dissipate 1-2 W depending on peripheral activity. The LBGA package's thermal pad should be soldered to a copper pour on the top layer connected to inner ground planes via thermal vias (typically a 4x4 via array at 1.0 mm pitch). With proper thermal design, the industrial -40C to +85C range is achievable without active cooling in most enclosed-cabinet environments.
Verify the exact MCF5372LCVM240J boot-mode resistor values against the latest NXP reference manual before PCB layout. The part is in NRND status, so design teams should plan a migration path to the i.MX RT crossover MCU family or another actively-produced NXP MPU before committing to high-volume production. Order evaluation samples early and confirm supply through NXP franchised distributors to avoid counterfeit risk.
Compliance-Informationen
RoHS and REACH status not stated in the provided web data. AEC-Q100 is not applicable - the part is intended for industrial/embedded use, not automotive. Lead-free assumed for LBGA packaging but explicit confirmation not in provided data.
