MCF5372LCVM240J vs SCF5250VM120 Vergleich
Detaillierter Direktvergleich von MCF5372LCVM240J von NXP Semiconductors und SCF5250VM120 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MCF5372LCVM240J - ColdFire V3 240MHz 32-Bit MPU | NXP | 196-LBGA
MCF5372LCVM240J NrndSpezifikationsvergleich
| Parameter | MCF5372LCVM240J | SCF5250VM120 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Unknown |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $25,10 | $0,00 |
| Core | ColdFire V3 (MCF537x) | — |
| Datenbusbreite | 32-bit | — |
| Maximale Taktfrequenz | 240 MHz | — |
| Architecture | Variable-length RISC (ColdFire) | RISC 32-bit |
| Program Memory Type | ROMless (external boot memory required) | — |
| Gehäuse / Bauform | 196-LBGA (MAP-BGA, 15x15 mm) | — |
| Montageart | Surface Mount (BGA) | — |
| Betriebstemperatur | [DATA_NEEDED: industrial temperature grade confirmed by 'J' suffix; full range not in provided web data] | [DATA_NEEDED: operating temperature range] |
| Number of I/O | [DATA_NEEDED: number of GPIO pins not in provided web data] | — |
| Versorgungsspannung | [DATA_NEEDED: core and I/O voltage not in provided web data] | 3.3 V |
| Peripherals | Ethernet MAC, USB, UART, timers (per MCF5372 family) | — |
| External Memory Interface | External SDRAM/NOR Flash bus | — |
| RoHS-Status | [DATA_NEEDED: explicit RoHS statement not in provided web data] | [DATA_NEEDED: RoHS compliance] |
| MSL-Level | [DATA_NEEDED: MSL rating not in provided web data] | — |
| Lebenszyklusstatus | NRND (Not Recommended for New Designs) | — |
| Product Type | — | 32-bit ROMless microcontroller |
| Processor Core | — | ColdFire V2 MCF52xx |
| Maximum Processor Frequency | — | 120 MHz |
| RAM Size | — | 128 kB |
| Program Memory | — | ROMless |
| Number of I/O Pins | — | 57 |
| Process Technology | — | 0.13 um |
| Gehäuse | — | 196-LBGA (15 x 15 mm) |
| Package Type | — | MAP-BGA-196 |
| Tray Packaging | — | Tray |
| Manufacturer | — | NXP Semiconductors |
| Datasheet File Size | — | 1 MB |
| Datasheet Page Count | — | 56 pages |
| REACH Status | — | [DATA_NEEDED: REACH compliance] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification] |