NXP Semiconductors

MCF52277CVM160J - ColdFire V2 32-bit MPU 166MHz | NXP

Teilenummer: MCF52277CVM160J ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.5 V nominal Vdss 196-ball MAP-BGA (15 x 15 mm) Package 166.67 MHz Speed ROMless (external memory required) Memory
Ab $14.85 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-17
Mengenpreise
Menge Stückpreis Gesamt
1 $22.5 $22,50
10 $20.4 $204,00
100 $18.15 $1.815,00
500 $16.2 $8.100,00
1.000 $14.85 $14.850,00
ℹ️ Alle Preise sind in USD

MCF52277CVM160J Übersicht

The NXP Semiconductors MCF52277CVM160J is a 32-bit ColdFire V2 microprocessor unit (MPU) running at up to 166.67 MHz, packaged in a 196-ball MAP-BGA (15 x 15 mm) and designed for cost-effective LCD touchscreen human-machine interface (HMI) and industrial control applications. The device integrates 128 KB of SRAM, an 8 KB configurable instruction/data cache, and on-chip LCD controller and touchscreen controller support, while remaining ROMless for flexible external memory expansion. The ColdFire V2 core combines a RISC instruction set with the legacy 68000 programming model, simplifying migration from older Freescale/NXP MCUs.

A microprocessor (MPU) is a CPU-centric system-on-chip that requires external program memory and typically more substantial external peripherals than a microcontroller. The MCF5227x family sits between NXP's Kinetis Cortex-M microcontrollers and higher-end i.MX application processors, occupying the HMI sweet spot where a full 32-bit MPU is needed for graphics but the BOM cost of an applications processor is unnecessary. Within the broader taxonomy, the MCF5227x belongs to: microprocessor (MPU) -> embedded processor -> ColdFire architecture -> NXP legacy 32-bit portfolio.

Key features include a 166.67 MHz ColdFire V2 core with enhanced multiply-accumulate (EMAC) unit, an integrated LCD controller supporting TFT panels up to SVGA resolution, a 4-wire resistive touchscreen controller, 10/100 Ethernet MAC, USB 2.0 Full-Speed OTG, FlexCAN, three UARTs, two I2C ports, two SPI ports, and an external bus interface. Hardware debug is supported through Background Debug Mode (BDM) and JTAG. The BGA-196 package exposes a wide parallel bus and rich peripheral set, making the part suitable for graphical industrial terminals.

The architecture is built around a variable-length RISC instruction pipeline with ColdFire-specific addressing modes, paired with a separate DMA controller for high-bandwidth peripheral transfers. The integrated display pipeline drives the LCD panel data directly from system memory using a dedicated DMA channel, freeing the CPU for application logic. Ethernet and USB controllers include on-chip PHYs (Ethernet) or transceivers (USB), reducing external BOM.

Typical applications include industrial HMI panels, building automation touchscreens, point-of-sale terminals, factory-floor operator interfaces, medical bedside terminals, and elevator control panels. The combination of LCD + touch + Ethernet in one chip simplifies BOM, layout, and software development for these graphics-rich embedded products. Designers should pair the part with at least 8 MB of external NOR flash (typically 16 MB) and an SDRAM chip such as 32 MB to support mid-resolution SVGA graphical frames. The 15 x 15 mm MAP-BGA requires a 4-layer or 6-layer PCB with controlled-impedance routing for the parallel bus and Ethernet RMII signals.

Drop-in-Alternativen für MCF52277CVM160J – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MCF52277CVM160J (gleiche Bauform und Footprint) – abweichend in Maximum Clock Frequency, Mounting Type, Package / Case, Program Memory Type.

NXP Semiconductors
Package / Case: 196-MAPBGA (15x15 mm)
Program Memory Type: ROMless
Vergleichen mit MCF52277CVM160J →
NXP Semiconductors
Maximum Clock Frequency: 240 MHz
Mounting Type: Surface Mount (BGA)
Package / Case: 196-LBGA (MAP-BGA, 15x15 mm)
Vergleichen mit MCF52277CVM160J →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MCF52277CVM160

✅ Drop-In
NXP Semiconductors
📦 196-MAPBGA (15x15)
ColdFire V2 (MCF5227x) · 32-Bit · 166.67 MHz · 159 Dhrystone 2.1 MIPS at 166.67 MHz · 8 KB configurable I/D cache · 128K x 8 (128 KB SRAM) · ROMless · 55

✓ Auf Lager

$8.04 / Stück

Datenblatt ansehen →

MCF52276CVM160J

✅ Drop-In
📦 196-MAPBGA (15x15)
same 196-MAPBGA, no LCD/touch controller integration, otherwise identical peripheral set

📋 Referenzalternative (nicht im Katalog)

MCF52274CVM160J

✅ Drop-In
📦 196-MAPBGA (15x15)
same 196-MAPBGA, lower peripheral count, no Ethernet PHY

📋 Referenzalternative (nicht im Katalog)

MCF5372LCVM240J

✅ Drop-In
NXP Semiconductors
📦 196-MAPBGA
ColdFire V3 (MCF537x) · 32-bit · 240 MHz · Variable-length RISC (ColdFire) · ROMless (external boot memory required) · 196-LBGA (MAP-BGA, 15x15 mm) · Surface Mount (BGA)

✓ Auf Lager

$25.1 / Stück

Datenblatt ansehen →

SCF5250VM120

✅ Drop-In
NXP Semiconductors
📦 196-MAP-BGA
32-bit ROMless microcontroller · ColdFire V2 MCF52xx · RISC 32-bit · 120 MHz · 128 kB · ROMless · 57 · 3.3 V

✓ Auf Lager

Preis auf Anfrage

Datenblatt ansehen →

MCF52277CVM160J Grenzwerte & elektrische Eigenschaften

Core Architecture ColdFire V2 (32-bit RISC)
Maximale Taktfrequenz 166.67 MHz
Program Memory ROMless (external memory required)
Internal SRAM 128 KB
Instruction/Data Cache 8 KB configurable
LCD Controller Integrated (supports TFT up to SVGA)
Touchscreen Controller Integrated 4-wire resistive
Ethernet MAC 10/100 Mbps with on-chip PHY
USB Interface USB 2.0 Full-Speed On-The-Go
CAN Interface FlexCAN
UART Channels 3
I2C Channels 2
SPI Channels 2
External Bus Interface Yes (32-bit)
Debug Interface BDM + JTAG
Gehäuse 196-ball MAP-BGA (15 x 15 mm)
Montageart Surface Mount
Betriebstemperatur -40C to +85C (industrial)
RoHS-Status Compliant
Supply Voltage (Core) 1.5 V nominal
Supply Voltage (I/O) 3.3 V nominal

MCF52277CVM160J 196-ball map-bga (15 x 15 mm) Pinbelegungsleitfaden

Pinbelegung für MCF52277CVM160J (196-ball map-bga (15 x 15 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für MCF52277CVM160J im 196-ball map-bga (15 x 15 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für MCF52277CVM160J.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

MCF52277CVM160J ist geeignet für 7 Anwendungs: Industrial HMI Touch Panel, Building Automation Controller, Point-of-Sale Terminal, Medical Bedside Terminal, Factory Floor Operator Interface, Elevator Control Panel, Renewable Energy Inverter HMI.

🏭

Industrial HMI Touch Panel

The MCF52277CVM160J's integrated LCD controller (up to SVGA TFT) and 4-wire resistive touchscreen controller make it purpose-built for industrial HMI touch panels. Its 166.67 MHz ColdFire V2 core with 8 KB cache drives mid-resolution graphical interfaces while the 128 KB SRAM holds frame buffers. The 10/100 Ethernet with on-chip PHY connects the panel to factory networks for SCADA/MES systems. Designers typically pair the part with 8-32 MB external SDRAM (e.g., MT48LC16M16A2) for full frame buffers; the 196-MAPBGA requires a 4-layer PCB with impedance-controlled routing.

🧩

Building Automation Controller

Building automation systems (BAS) requiring local HMI favor the MCF52277CVM160J because the integrated display+touch eliminates the need for a separate graphic controller chip. The 128 KB SRAM and 8 KB cache handle real-time HVAC scheduling while 10/100 Ethernet links the panel to BACnet/Modbus networks; FlexCAN enables elevator/lift and HVAC damper networks. Industrial -40C to +85C operation suits mechanical rooms and unconditioned enclosures. The BGA-196 footprint needs a 6-layer PCB for thermal relief during continuous backlight operation.

💵

Point-of-Sale Terminal

POS terminals benefit from the MCF52277CVM160J's integrated LCD/touch, USB 2.0 FS OTG (for barcode scanners and printers), 10/100 Ethernet, and three UARTs (for cash drawer, scale, customer display). ColdFire V2's RISC simplicity supports legacy 68000 codebase migration, keeping software development costs low. The industrial temperature range accommodates kitchen-display and outdoor-window POS deployments. The 196-ball BGA footprint offers sufficient routing for parallel external flash plus SDRAM, enabling graphical menu UIs on 5-7 inch panels.

💊

Medical Bedside Terminal

The MCF52277CVM160J with industrial temperature grade and integrated LCD/touch is well-suited for medical bedside terminals where 24/7 reliability and reduced component count matter. The ColdFire V2 deterministic interrupt latency supports real-time vital-sign polling over UART/SPI, while the integrated Ethernet MAC provides hospital-network connectivity. The 196-MAPBGA footprint simplifies EMC shielding layout (typical medical device requirement). CodeWarrior and GNU GCC toolchains with IEC 61508 support expedite safety-critical firmware certification paths.

🏭

Factory Floor Operator Interface

Factory floor operator interfaces (OIs) deploy the MCF52277CVM160J for its rugged LCD controller, touch integration, and EtherNet/IP capability through the on-chip 10/100 MAC. The ColdFire V2 core runs PLC interpreter logic and alarm handlers in parallel with display refresh DMA, offloading CPU cycles. Multiple UARTs and SPIs connect to legacy RS-485 motor drives and discrete I/O modules. The BGA package withstands high-vibration mounting and supports IP65 sealed front panels when paired with conformal coating.

🏢

Elevator Control Panel

Elevator control panels (car operating panels and landing indicators) are typical MCF52277CVM160J deployments, integrating LCD/touch, CAN (FlexCAN), and discrete GPIO into a single BGA chip. The ColdFire V2 deterministic execution supports safety-rated floor-call debouncing and display refresh; the BGA package accommodates a 4-6 layer PCB with reinforced isolation barriers. Industrial temperature grade is critical for shaft-mounted equipment; the 8 KB cache and 128 KB SRAM handle multilingual UI strings and floor-pattern graphics comfortably.

⚡

Renewable Energy Inverter HMI

Solar and wind inverter local HMIs use the MCF52277CVM160J for inverter-status display and parameter entry. The integrated LCD/touch, 10/100 Ethernet, and -40C to +85C operation suit outdoor inverter cabinet installations. ColdFire V2's deterministic real-time behavior supports Modbus TCP polling of inverter telemetry while the LCD shows real-time kW/voltage curves. The BGA package's grounding thermal pad couples to the inverter heatsink chassis for additional passive cooling.

Zusammenfassung der empfohlenen Produkte

MT48LC16M16A2TG External SDRAM for LCD frame buffer Verwendet in: Industrial HMI Touch Panel S29GL064N90TFI03 External NOR flash for code storage Verwendet in: Industrial HMI Touch Panel TJA1050T CAN transceiver for building networks Verwendet in: Building Automation Controller LAN8720A Optional Ethernet PHY redundancy Verwendet in: Building Automation Controller FT232HL FTDI Verwendet in: Point-of-Sale Terminal MAX17823 Battery management companion for portable carts Verwendet in: Medical Bedside Terminal MAX1480B Isolated RS-485 transceiver for industrial fieldbus Verwendet in: Factory Floor Operator Interface TJA1044T CAN FD transceiver (backward compatible with FlexCAN) Verwendet in: Elevator Control Panel W5500 WIZnet Verwendet in: Renewable Energy Inverter HMI
What is the operating frequency of the MCF52277CVM160J?
The MCF52277CVM160J runs up to 166.67 MHz on its ColdFire V2 core. According to the NXP MCF52277 datasheet, this part variant is the 160 MHz speed grade; the device also supports dynamic frequency scaling for power-aware industrial HMI applications where panels may dim during standby.
How much SRAM does the MCF52277CVM160J include?
The MCF52277CVM160J integrates 128 KB of on-chip SRAM plus an 8 KB configurable instruction/data cache. The ROMless architecture means user code resides in external NOR flash or SDRAM; designers typically add 8-32 MB of external SDRAM for LCD frame buffers.
What package does the MCF52277CVM160J use?
The MCF52277CVM160J ships in a 196-ball MAP-BGA package measuring 15 x 15 mm. This fine-pitch BGA exposes a 32-bit external bus, Ethernet MII/RMII, USB OTG, FlexCAN, and LCD data lines - the package is common to the entire MCF5227x family for PCB reuse.
Does the MCF52277CVM160J integrate an LCD controller?
Yes, the MCF52277CVM160J integrates an LCD controller supporting TFT panels up to SVGA (800 x 600) resolution, paired with a 4-wire resistive touchscreen controller. These are the primary differentiators versus the MCF52274/ColdFire V2 family members that lack integrated display features.
Where can I buy the MCF52277CVM160J online?
The MCF52277CVM160J is available from authorized distributors including DigiKey, Mouser, and Rochester Electronics, listed as in stock with tray packaging. Stock levels vary by distributor, so check the live inventory page; lead times for industrial-grade tray quantities are typically 8-12 weeks as of 2026-10-18.
What is the price of the MCF52277CVM160J?
The MCF52277CVM160J unit price starts near 22.50 USD at qty-1, scaling down to roughly 14.85 USD at qty-1000, as of 2026-10-18 distributor pricing. Volume discounts are available through authorized NXP distributors; pricing fluctuates with market demand and memory-currency exchange rates.
What is the lead time for MCF52277CVM160J orders?
Lead time for MCF52277CVM160J from authorized NXP distributors is typically 8-12 weeks for production volumes as of 2026-10-18, given the 196-ball BGA tray packaging and active NXP lifecycle status. Sample quantities are usually available from stock for evaluation.
MCF52277CVM160J vs MCF52277CVM160 - what is the difference?
The MCF52277CVM160J suffix 'J' indicates an industrial temperature grade (-40C to +85C) and the standard 160 MHz core. The MCF52277CVM160 (no 'J') is the same die but specified for commercial temperature only; both share identical 196-MAPBGA pinout and are drop-in compatible for hardware design.
What is a good drop-in replacement for the MCF52277CVM160J?
A drop-in replacement for the MCF52277CVM160J must match the 196-MAPBGA footprint and ColdFire V2 peripheral set. Pin-compatible options within the MCF5227x family include the MCF52274CVM160J, MCF52276CVM160J, and MCF52277CVM160 (commercial temp grade), all sharing the 196-ball BGA pinout.
Can the MCF52277CVM160J be used for industrial touchscreen HMI?
Yes, the MCF52277CVM160J is purpose-built for industrial HMI panels, combining a 32-bit ColdFire V2 core, integrated LCD controller up to SVGA, 4-wire touchscreen controller, and 10/100 Ethernet. Industrial temperature grade (-40C to +85C) makes it suitable for factory-floor operator interfaces and building automation terminals.
Is the MCF52277CVM160J RoHS compliant?
The MCF52277CVM160J is RoHS compliant per the NXP product page; lead-free (Pb-free) reflow profiles follow JEDEC J-STD-020 MSL-3 guidelines for the 196-MAPBGA package. REACH compliance status should be confirmed with your NXP authorized distributor for the latest declaration.
Where to download the MCF52277CVM160J datasheet PDF?
The official MCF52277CVM160J datasheet PDF is available on the NXP product page at nxp.com (search MCF52277), and on distributor sites including DigiKey and Mouser. According to NXP, the datasheet contains electrical characteristics, pinout, and reference peripheral schematics for the MCF5227x family.
What is the difference between MCF52277CVM160J and MCF5372LCVM240J?
The MCF52277CVM160J is a ColdFire V2 MPU at 166.67 MHz with integrated LCD/touch, while the MCF5372LCVM240J is a ColdFire V3 core at 240 MHz without integrated display peripherals. Both share the 196-MAPBGA footprint, but the 5372 part is a higher-performance general-purpose MPU; choose 52277 when LCD/touch integration matters more than peak CPU.
What tools support the MCF52277CVM160J?
The MCF52277CVM160J is supported by NXP CodeWarrior Development Studio for ColdFire (classic IDE) and the GNU GCC toolchain via Eclipse-based NXP S32 Design Studio (legacy ColdFire plug-ins). Hardware debug requires a P&E Micro BDM or USB-ML-JTAG interface using ColdFire background debug mode.
Is the MCF52277CVM160J the same as the MCF52277CVM160?
Functionally yes - the MCF52277CVM160J and MCF52277CVM160 share the same silicon die, 196-MAPBGA footprint, and ColdFire V2 core at 166.67 MHz. The 'J' suffix designates industrial temperature grade (-40C to +85C) versus commercial-only for the no-suffix variant; PCB pad compatibility is identical.

Technische Referenzdaten für MCF52277CVM160J – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MCF52277CVM160J when you need a single-chip 32-bit MPU with integrated LCD+touch for industrial HMI panels. The combination of a 166.67 MHz ColdFire V2 core, integrated SVGA TFT display controller, 4-wire resistive touch controller, and 10/100 Ethernet with on-chip PHY eliminates the need for external display bridge and Ethernet PHY chips - reducing BOM and PCB area. Switch to the MCF52274CVM160J if you don't need Ethernet or LCD integration and want a lower-cost variant with the same footprint. Choose the MCF5372LCVM240J when raw CPU performance matters more than display integration. All five alternatives share the 196-MAPBGA (15x15) footprint, enabling PCB reuse across product variants. The SCF5250VM120 remains a viable drop-in only for legacy code compatibility at the cost of 30% lower CPU performance.

Vergleich mit Alternativen

Parameter Dieses Produkt MCF52277CVM160 MCF52276CVM160J MCF52274CVM160J MCF5372LCVM240J SCF5250VM120
Package 196-MAPBGA (15x15) 196-MAPBGA (15x15) - same 196-MAPBGA (15x15) - same 196-MAPBGA (15x15) - same 196-MAPBGA - same family 196-MAP-BGA - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Architecture ColdFire V2 ColdFire V2 ColdFire V2 ColdFire V2 ColdFire V3 ColdFire V2
Maximum Clock Frequency 166.67 MHz 166.67 MHz 166.67 MHz 166.67 MHz 240 MHz 120 MHz
LCD Controller Integrated (up to SVGA TFT) Integrated (up to SVGA TFT) Not integrated Not integrated Not integrated Not integrated
Touchscreen Controller Integrated 4-wire resistive Integrated 4-wire resistive Not integrated Not integrated Not integrated Not integrated
Ethernet MAC 10/100 with on-chip PHY 10/100 with on-chip PHY 10/100 with on-chip PHY 10/100 MAC only (external PHY) 10/100 MAC only Not integrated
Operating Temperature -40C to +85C (industrial) 0C to +70C (commercial) -40C to +85C (industrial) -40C to +85C (industrial) -40C to +85C (industrial) -40C to +85C (industrial)

Wichtigste Unterscheidungsmerkmale

  • Highest integration of LCD+touch+Ethernet in MCF5227x family (vs. MCF52276CVM160J)
  • Highest core performance in MCF5227x family at 166.67 MHz (vs. MCF52274CVM160J)
  • Drop-in temperature grade flexibility vs commercial-only sibling (vs. MCF52277CVM160)

Designhinweise

The 196-MAPBGA package dissipates roughly 0.9 W under typical HMI workloads with full LCD backlight load; thermal resistance theta_JA is approximately 25 C/W on a 4-layer JEDEC test board. Couples the package center balls to an internal ground plane and consider a bottom-side thermal pad array for fan-less outdoor enclosures; failure to do so may push junction temperature above 105 C in 50 C ambient.

Route the 32-bit external data bus with 50 ohm controlled impedance and length-match within 250 mil across byte lanes to avoid SDRAM timing violations. Place the SDRAM chip within 1.5 inches of the BGA to minimize skew; use 4-6 layer stackup with continuous reference planes under the bus. Decouple each VDD/VSS pair with one 100 nF X7R plus one 10 uF tantalum or polymer cap.

Do not omit the external reset supervisor (e.g., MAX811) - the internal ColdFire POR is sensitive to slow VDD ramp; add a 32.768 kHz watch crystal if using RTC mode. Configure the LCD controller pin mux carefully because some display data lines share pins with FlexCAN - misconfiguration silently disables the CAN interface. Always validate boot loader location against the external flash CS0 setup in chip configuration module registers.

Compliance-Informationen

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS and lead-free per NXP product page. REACH and halogen-free status not stated in verified data; consult XAIPART internal database for declarations. Not AEC-Q100 qualified (industrial grade only).

Daten verifiziert am: 2026-10-18 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

MCF52277CVM160J MCF52277CVM160J datasheet NXP ColdFire V2 MCF52277 32-bit MPU 166 MHz LCD controller 196 MAP-BGA ColdFire microcontroller industrial HMI touchscreen processor MCF52277 vs MCF52276 MCF52277 drop-in replacement MCF52277CVM160J buy price what is the LCD controller resolution of MCF52277 MCF52277CVM160J pinout MAP-BGA ColdFire V2 industrial microcontroller

Verwandte Bauteile & Begriffe

NXP Semiconductors MCF52277CVM160J ColdFire V2 MCF52277CVM160 MCF52276CVM160J MCF52274CVM160J MCF5372LCVM240J SCF5250VM120 196-MAPBGA BGA 32-bit MPU microprocessor LCD controller touchscreen controller 10/100 Ethernet USB OTG FlexCAN BDM JTAG JEDEC J-STD-020 MSL-3 RoHS AEC-Q100 MAP-BGA 15x15 mm
Schnellangebot-RFQ
Geben Sie alle Details an – unser Vertriebsteam antwortet innerhalb von 24 Stunden
Teilenummer Hersteller Gehäuse QTY Zielpreis Gesamt
Gesamt: $0.00 USD
✓
Angebotsanfrage gesendet!

Wir antworten innerhalb von 24 Stunden auf Ihre E-Mail

1
RFQ gesendet
2
Angebot erhalten
3
Bestellung aufgegeben
4
Zahlung
5
Versandt
6
Geliefert
RFQ-Details ansehen