MCIMX253DJM4 - i.MX25 ARM9 400MHz MPU, 400-LFBGA | NXP
Teilenummer: MCIMX253DJM4 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $21.15 | $211,50 |
| 100 | $19.4 | $1.940,00 |
| 500 | $17.85 | $8.925,00 |
| 1.000 | $16.2 | $16.200,00 |
MCIMX253DJM4 Übersicht
An applications processor (AP) is a system-on-chip (SoC) designed to run an operating system and rich user applications, sitting above microcontrollers in the embedded hierarchy: SoC > applications processor > microcontroller > DSP. The i.MX family from NXP targets human-interface, industrial control, and connected devices that need graphical UI, networking stacks, and real-time response. ARM926EJ-S adds Jazelle Java bytecode execution alongside the standard ARM/Thumb instruction set, enabling legacy Java ME and embedded workloads.
Key differentiating features include an integrated LCD controller supporting up to VGA-class panels, two on-chip USB 2.0 PHYs (one host, one OTG), a 10/100 Ethernet MAC, DDR2 memory controller, three 12-bit ADCs, and an integrated touch-screen controller. The MCIMX253DJM4 specifically targets the consumer and industrial product space, balancing peripheral richness with low-power operation. Operating voltage is centered at 1.45 V core. The 400-LFBGA package exposes the full peripheral set, including SSI/I2S audio ports, UART, I2C, SPI, and SD/MMC interfaces.
Typical applications include human-machine interface (HMI) panels, industrial control terminals, point-of-sale (POS) terminals, building automation controllers, and connected medical devices. The DDR2 controller and integrated LCD pipeline allow ports to drive a small TFT panel directly, eliminating the need for an external graphics controller. The pair of USB PHYs and Ethernet MAC support common industrial connectivity (USB device, USB host, networked sensor hubs).
Designers should plan for a multi-rail power tree (1.45 V core plus 3.3 V I/O) and ensure the LFBGA substrate uses microvia or via-in-pad technology for reliable BGA assembly. The 400-ball BGA also demands controlled-impedance routing on high-speed DDR2 traces and length-matched clocks on the memory bus for signal integrity.
This page synthesizes distributor availability, drop-in same-family alternatives, and practical design considerations not consolidated in the manufacturer datasheet, giving engineers a faster path to a working i.MX25 design.
Drop-in-Alternativen für MCIMX253DJM4 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCIMX253DJM4 (gleiche Bauform und Footprint) – abweichend in Core Architecture, ADC, LCD Controller, Mounting Type, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCIMX253DJM4A
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX255DJM4A
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX257DJM4A
✅ Drop-In✓ Auf Lager
$16.54 / Stück
Datenblatt ansehen →MCIMX257CJM4A
✅ Drop-In✓ Auf Lager
$15.95 / Stück
Datenblatt ansehen →MCIMX253DJM4 Grenzwerte & elektrische Eigenschaften
| Core Architecture | ARM926EJ-S |
| Number of Cores | 1 |
| Datenbusbreite | 32-bit |
| Maximum CPU Frequency | 400 MHz |
| Core Operating Voltage | 1.45 V |
| Gehäuse | 400-LFBGA (17x17 mm) |
| Montageart | Surface Mount |
| Instruction Set | ARM/Thumb + Jazelle |
| Memory Controller | DDR2 / LPDDR / SDRAM |
| Integrated USB PHYs | 2 (Host + OTG) |
| Ethernet MAC | 10/100 Mbps |
| LCD Controller | Integrated, up to VGA-class TFT |
| ADC | 3x 12-bit |
| Touch-Screen Controller | Integrated |
| RoHS-Status | Compliant |
MCIMX253DJM4 Pin-Konfiguration
| Pin A1 | [DATA_NEEDED - ball A1] — Refer to manufacturer datasheet for specific ball A1 function |
| Pin B20 | [DATA_NEEDED - ball B20] — Refer to manufacturer datasheet for specific ball B20 function |
Typische Anwendungen
MCIMX253DJM4 ist geeignet für 6 Anwendungs: Industrial HMI Panels, Point-of-Sale (POS) Terminals, Building Automation Controllers, Connected Medical Devices, Smart Energy / Metering Gateways, Portable Data Terminals.
Industrial HMI Panels
The MCIMX253DJM4 drives industrial HMI panels where its integrated LCD controller, three 12-bit ADCs, and touch-screen controller eliminate the need for a separate graphics or input controller. With an ARM926EJ-S core at 400 MHz and a DDR2 memory controller, it provides enough headroom for embedded Linux plus a Qt- or GTK-based UI. Designers typically pair it with a 64-128 MB DDR2 and an SPI NOR boot flash, keeping the total HMI BOM under $20 while supporting 800x480 WVGA panels.
Empfohlen
Point-of-Sale (POS) Terminals
POS terminals leverage the MCIMX253DJM4's dual USB 2.0 PHYs (host + OTG), 10/100 Ethernet MAC, and integrated LCD/touch controller to support barcode scanners, receipt printers, and magnetic-stripe readers on a single SoC. The 400 MHz ARM926EJ-S comfortably runs embedded Linux with payment-processing stacks and TLS, while the integrated peripherals remove external hub ICs. With a 1.45 V core and 3.3 V I/O, the design fits within standard POS power budgets.
Empfohlen
Building Automation Controllers
Building automation systems use the MCIMX253DJM4 for its industrial temperature range, integrated Ethernet, and dual USB PHYs that connect to BACnet/Modbus gateways, HVAC actuators, and occupancy sensors. The 400 MHz ARM926EJ-S is enough to run a real-time scheduling stack plus an HTML5-based configuration UI, while the DDR2 controller supports the memory footprint needed for protocol stacks and trend logging. The 400-LFBGA package suits compact DIN-rail enclosure layouts.
Empfohlen
Connected Medical Devices
Connected medical devices, such as patient monitors and bedside terminals, use the MCIMX253DJM4 because of its low-power ARM926EJ-S, integrated LCD/touch pipeline, and ability to drive isolated Ethernet and serial buses for bedside peripherals. The integrated 12-bit ADC trio supports front-end analog signal chains for vital-sign sensors without a separate ADC IC. Designers typically pair the part with a separate Wi-Fi or BLE module over UART/USB for hospital-network connectivity.
Empfohlen
Smart Energy / Metering Gateways
Smart metering gateways use the MCIMX253DJM4 to aggregate data from sub-meters over M-Bus, wireless M-Bus, or PLC links, then backhaul it via Ethernet or cellular modules over USB. The integrated 10/100 Ethernet MAC handles IP-based backhaul, while the dual USB PHYs support cellular modems. The ARM926EJ-S at 400 MHz plus DDR2 memory support is sufficient for TLS, IPv6 stacks, and protocol translation, fitting a DIN-rail gateway form factor with no active cooling.
Empfohlen
Portable Data Terminals
Portable data terminals (PDT) use the MCIMX253DJM4 because of its low-power ARM926EJ-S at 400 MHz, integrated touch screen, and DDR2 controller that supports Linux-based scan-and-go workflows. The integrated LCD pipeline drives 3.5-4.3 inch TFT panels without an external controller, and the dual USB PHYs enable barcode-scanner or RFID-reader expansion modules. The 400-LFBGA 17x17 footprint fits handheld enclosures with a Li-ion power tree.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCIMX253DJM4 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCIMX253DJM4A | MCIMX255DJM4A | MCIMX257DJM4A | MCIMX257CJM4A |
|---|---|---|---|---|---|
| Package | 400-LFBGA (17x17) | 400-LFBGA (17x17) - same | 400-LFBGA (17x17) - same | 400-LFBGA (17x17) - same | 400-LFBGA (17x17) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S |
| Maximum Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Core Voltage | 1.45 V | 1.45 V | 1.45 V | 1.45 V | 1.45 V |
| USB PHYs | 2 (Host + OTG) | 2 (Host + OTG) | 2 (Host + OTG) | 2 (Host + OTG) | 2 (Host + OTG) |
| Security Module | Standard | Standard | Enhanced | Enhanced (crypto accelerators) | Enhanced (crypto accelerators) |
| Lifecycle Status | Active | Active | Active | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Drop-in 400-LFBGA (17x17) upgrade path (vs. MCIMX257DJM4A)
- Lower BOM vs higher-tier i.MX (vs. MCIMX27LMOP4A)
- Integrated touch-screen controller (vs. Generic ARM9 MPU without touch)
Designhinweise
The 400-LFBGA 17x17 mm package requires microvia or via-in-pad PCB technology for reliable BGA assembly; standard through-via stackups will not yield acceptable yield. Use ENIG surface finish for fine-pitch BGA pads and follow NXP's recommended PCB pad and solder-paste aperture dimensions in the i.MX25 hardware design guide.
DDR2 memory traces must be length-matched per byte lane (within 25 mils of each other) and routed on a dedicated inner layer with a continuous ground reference plane. The clock pair (CK/CK#) needs 100 ohm differential impedance, and VTT termination must be within 6 mm of the DRAM chips. Estimated: based on standard DDR2 layout practices; refer to i.MX25 hardware design guide for definitive rules.
Plan a multi-rail power tree: 1.45 V core, 1.8 V DDR2, and 3.3 V I/O. Use a PMIC that supports dynamic voltage scaling to take advantage of the ARM926EJ-S low-power states. Decoupling: place 0.1uF X7R ceramics within 2 mm of every supply ball group, and add bulk 10uF/22uF tantalums or ceramics at each rail entry.
Boot-mode strapping pins must be pulled correctly at reset; misconfigured boot-mode pins are the most common first-board bring-up failure on i.MX25 designs. Also ensure the JTAG chain is not back-powered by external debuggers during power-down, which can cause high-current latch-up. Read the i.MX25 reference manual boot-mode table to match your boot source (NAND, SD/MMC, or serial).
Compliance-Informationen
RoHS and REACH compliance per NXP product page. AEC-Q100 not applicable for industrial/consumer MPU. Halogen-free status not confirmed in verified data.
