NXP Semiconductors

MCIMX257CVM4 - i.MX25 ARM926 MPU 400MHz 400-LFBGA | NXP

Teilenummer: MCIMX257CVM4 ✓ Aktiv
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400-LFBGA (17x17 mm) Package 400 MHz Speed
Ab $19.4 USD / Stück
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Preis aktualisiert: 2026-10-16
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Menge Stückpreis Gesamt
1 $28.5 $28,50
10 $26.1 $261,00
100 $23.85 $2.385,00
500 $21.6 $10.800,00
1.000 $19.4 $19.400,00
ℹ️ Alle Preise sind in USD

MCIMX257CVM4 Übersicht

The NXP MCIMX257CVM4 is an i.MX25 family ARM926EJ-S microprocessor in a 400-ball LFBGA (17x17 mm) package, designed for consumer and industrial multimedia products. It integrates a single 32-bit ARM926EJ-S core running at 400 MHz, on-chip SRAM, a flexible LCD controller, USB, and a rich set of connectivity interfaces for connected embedded designs.

An ARM926EJ-S based microprocessor is a 32-bit RISC application processor with an MMU, DSP extensions, and tightly coupled memory that runs a memory management unit capable of running full operating systems such as Linux, WinCE, or a real-time OS. Within the broader hierarchy, this places the i.MX25 in the application processor class of embedded microprocessors (MPU), sitting above microcontrollers (MCU) and below higher-performance Cortex-A application processors. NXP positions the i.MX25 line for low-power, cost-sensitive human-machine interface (HMI) and connected device designs.

Key features of the MCIMX257CVM4 include a 400 MHz ARM926EJ-S core with 16 KB I-cache and 16 KB D-cache, a 400-ball LFBGA (17x17 mm) package, integrated LCD and image-processing peripherals, multiple connectivity options including USB and Ethernet MAC, and an industrial temperature grade. Compared with higher-tier i.MX applications processors, the i.MX25 trades peak CPU frequency for lower system BOM cost and lower active power.

Architecturally, the i.MX25 combines the ARM926EJ-S core with a multi-layer bus matrix, an image-processing unit (IPU) for LCD driving, and a hardware encryption accelerator. The integrated peripherals remove the need for companion display or image controllers, simplifying board layout and shrinking BOM cost for terminal-style products.

Typical applications include human-machine interface (HMI) panels, industrial control terminals, point-of-sale (POS) terminals, and connected consumer electronics that need an LCD controller and ARM117-class CPU performance at low power. The wide peripheral set also suits networked printers, smart-grid terminals, and remote sensor gateways.

When designing with this device, pay close attention to power-rail sequencing and DDR/SDRAM signal integrity; the part requires a properly terminated memory bus for stable operation at 400 MHz. PCB designers should follow NXP's i.MX25 hardware development guide for stack-up and decoupling.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

Drop-in-Alternativen für MCIMX257CVM4 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MCIMX257CVM4 (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, Touchscreen Controller, USB, Data Bus Width.

NXP Semiconductors
Package: 400-LFBGA (MAPBGA) 17x17 mm
USB: USB 2.0 OTG with PHY
Data Bus Width: 32 bit
Vergleichen mit MCIMX257CVM4 →
NXP Semiconductors
Package: 400-LFBGA (MAP-BGA) 17x17 mm
Core Architecture: ARM926EJ-S (ARM9 family)
Touchscreen Controller: Integrated 4-wire / 5-wire
Vergleichen mit MCIMX257CVM4 →
NXP Semiconductors
Package: 400-LFBGA (17x17 mm, 1.0 mm pitch)
Vergleichen mit MCIMX257CVM4 →
NXP Semiconductors
Package: 400-LFBGA (17 mm x 17 mm)
Core Architecture: ARM926EJ-S (ARM9)
Touchscreen Controller: 4-wire resistive integrated
Vergleichen mit MCIMX257CVM4 →
NXP Semiconductors
Core Architecture: ARM926EJ-S (ARMv5TEJ)
Touchscreen Controller: 4-wire resistive, integrated
USB: 2x USB 2.0 OTG with integrated PHY
Vergleichen mit MCIMX257CVM4 →
NXP Semiconductors
Package: 529-MAPBGA (19x19 mm, 0.8 mm pitch)
Core Architecture: ARM Cortex-A9 + ARM Cortex-M4
Vergleichen mit MCIMX257CVM4 →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MCIMX257CJM4A

✅ Drop-In
NXP Semiconductors
📦 400-LFBGA (17x17)
ARM926EJ-S (ARMv5TEJ) · 1 · 32-bit · 400 MHz · DDR/DDR2, NAND, NOR flash · 128 · 400-LFBGA (17x17 mm)

✓ Auf Lager

$15.95 / Stück

Datenblatt ansehen →

MCIMX255AJM4

✅ Drop-In
NXP Semiconductors
📦 400-MAPBGA
ARM926EJ-S (ARM9 family) · 1 · 32-bit · 400 MHz · 16 KB · 16 KB · 32 KB · 400-LFBGA (MAP-BGA) 17x17 mm

✓ Auf Lager

$17.85 / Stück

Datenblatt ansehen →

MCIMX255AVM4

✅ Drop-In
NXP Semiconductors
📦 400-LFBGA (17x17)
Applications Processor / SoC · ARM926EJ-S · 1 · 32-bit · 400 MHz · 128 Kbytes · DDR/DDR2, NAND, NOR · External

✓ Auf Lager

$17.4 / Stück

Datenblatt ansehen →

MCIMX6X4CVM08AC

✅ Drop-In
NXP Semiconductors
📦 400-MAPBGA
NXP Semiconductors · i.MX 6SoloX · ARM Cortex-A9 + ARM Cortex-M4 · 2 (heterogeneous: 1x A9 + 1x M4) · 32-bit · up to 800 MHz · up to 200 MHz · Vivante GC400T (2D/3D/OpenGL ES 2.0/OpenVG 1.1)

✓ Auf Lager

$41.5 / Stück

Datenblatt ansehen →

MCIMX6U7CVM08AB

✅ Drop-In
📦 400-MAPBGA
i.MX6U7 upgrade path; same 400-ball BGA footprint, requires software port to Cortex-A core

📋 Referenzalternative (nicht im Katalog)

MCIMX257CVM4 Grenzwerte & elektrische Eigenschaften

Core Architecture ARM926EJ-S
Core Count 1
Datenbusbreite 32-bit
Maximum CPU Clock 400 MHz
Series i.MX25
Family SENNA IMX25 INDUST
Gehäuse 400-LFBGA (17x17 mm)
Montageart Surface Mount
Temperature Grade Industrial
Integrated Peripherals LCD controller, USB, Ethernet MAC, image processing unit

MCIMX257CVM4 400-lfbga (17x17 mm) Pinbelegungsleitfaden

Pinbelegung für MCIMX257CVM4 (400-lfbga (17x17 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für MCIMX257CVM4 im 400-lfbga (17x17 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für MCIMX257CVM4.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

MCIMX257CVM4 ist geeignet für 6 Anwendungs: Industrial HMI Panels, Point-of-Sale (POS) Terminals, Connected Consumer Electronics, Networked Printers and MFDs, Smart-Grid and Metering Terminals, Remote Sensor Gateways.

🏭

Industrial HMI Panels

The MCIMX257CVM4's 400 MHz ARM926EJ-S core with integrated image processing unit (IPU) and LCD controller makes it a strong fit for industrial human-machine interface (HMI) panels. It drives TFT LCDs up to the resolution defined in the i.MX25 datasheet without an external display controller, simplifying the BOM. The industrial temperature grade and Linux BSP support allow continuous operation on factory floors with Qt-based GUIs and touchscreen overlays. Compared with a discrete MCU + graphics controller, BEV-supported architecture cuts part count and PCB area.

🖥️

Point-of-Sale (POS) Terminals

POS terminals benefit from the MCIMX257CVM4's ARM926EJ-S core running at 400 MHz, which can handle encrypted payment flows, barcode scanning, and a touchscreen GUI simultaneously under Linux. The integrated USB and Ethernet MAC peripherals support printer, scanner, and LAN connectivity without extra chips. Unlike higher-cost Cortex-A POS designs, the i.MX25 keeps the BOM low while delivering enough compute for typical retail transaction times.

🧩

Connected Consumer Electronics

Smart-home hubs and connected appliances leverage the MCIMX257CVM4's Ethernet MAC, USB, and LCD controller to deliver a low-cost networked UI appliance. The ARM926EJ-S at 400 MHz runs lightweight Linux stacks (Yocto, Buildroot) for MQTT, cloud connectivity, and local control. Power consumption stays low enough for always-on designs, and the industrial temperature grade supports appliance and metering enclosures.

🖥️

Networked Printers and MFDs

Multi-function printers and networked printers use the MCIMX257CVM4 to drive the control panel LCD, scan engine, network stack, and job queue. The 400 MHz ARM926EJ-S core handles PCL/PostScript interpretation and the integrated peripherals (USB, Ethernet) connect directly to host PCs and network. Industrial temperature operation supports the thermal environment inside printer enclosures.

⚡

Smart-Grid and Metering Terminals

Smart-grid terminals and advanced metering infrastructure benefit from the MCIMX257CVM4's industrial temperature grade, ARM926EJ-S core, and integrated LCD. It can drive a user-facing display, run secure communication stacks, and interface to metering ASICs via UART/SPI/I2C. Linux support with security extensions makes it suitable for encrypted AMI deployments requiring long product lifecycles.

🌐

Remote Sensor Gateways

Industrial IoT gateways that aggregate sensor data and forward to cloud services use the MCIMX257CVM4 to run lightweight Linux plus MQTT or CoAP stacks. The 400 MHz ARM926EJ-S handles multiple serial sensor buses (UART, SPI, I2C) via the integrated peripherals, and the Ethernet MAC provides the uplink. Low active power supports always-on remote installations where the gateway may be solar- or battery-powered.

What is the MCIMX257CVM4?
The MCIMX257CVM4 is an NXP i.MX25 family ARM926EJ-S microprocessor in a 400-ball LFBGA (17x17 mm) package, with a single 32-bit core running at 400 MHz. According to the manufacturer datasheet (i.MX25 Applications Processor for Consumer and Industrial Products), the part is targeted at multimedia HMI, industrial terminals, and connected consumer electronics. It includes an integrated LCD controller, USB, Ethernet MAC, and image processing unit.
What is the CPU core and clock speed of the MCIMX257CVM4?
The MCIMX257CVM4 integrates a single ARM926EJ-S core operating at up to 400 MHz. The ARM926EJ-S is a 32-bit RISC processor with MMU, DSP extensions, and separate instruction/data caches. Compared with Cortex-A class application SoCs, ARM926EJ-S targets lower-power HMI and industrial designs where Linux or RTOS support is required without the higher BOM cost of Cortex-A parts.
What package does the MCIMX257CVM4 use and how many pins does it have?
The MCIMX257CVM4 is supplied in a 400-ball LFBGA (Low-profile Fine-pitch Ball Grid Array) measuring 17x17 mm. According to the i.MX25 datasheet, this is the standard industrial temperature grade package option. Fine-pitch BGA assembly requires X-ray inspection and controlled reflow profiles per JEDEC J-STD-020.
Is the MCIMX257CVM4 still in production and what is its lifecycle status?
The MCIMX257CVM4 is currently shown as active by NXP distributors including DigiKey and Mouser. Industrial i.MX25 family parts have long product lifecycles under NXP's product longevity program. For end-of-life notifications, designers should monitor NXP's PCN portal; lifecycle status is verified as of 2026-10-16.
What is the difference between MCIMX257CVM4 and MCIMX257CJM4A?
The MCIMX257CVM4 and MCIMX257CJM4A are both i.MX25 family processors. The CVM4 ships in a 400-ball LFBGA (17x17 mm), industrial temperature grade configuration, while the CJM4A uses a different package and may carry different peripheral or temperature options. Both integrate the same ARM926EJ-S core at 400 MHz and share the i.MX25 software ecosystem; designers should confirm package and peripheral differences against the latest NXP datasheet before substituting.
What is the difference between MCIMX257CVM4 and MCIMX255AJM4?
The MCIMX257CVM4 (LFBGA-400, industrial grade) and MCIMX255AJM4 (MAP-BGA-400, tray packaging) are both i.MX25 family parts running ARM926EJ-S at 400 MHz. They differ in package code (LFBGA vs MAP-BGA) and possibly peripheral set. Both belong to the same i.MX25 software platform, but PCB layout footprints and pinout must be verified before any swap.
Where can I download the MCIMX257CVM4 datasheet PDF?
The MCIMX257CVM4 datasheet PDF (titled 'i.MX25 Applications Processor for Consumer and Industrial Products') is available from the manufacturer and from third-party datasheet archives. The official source is NXP's product page; a copy is also available at alldatasheet.com under part MCIMX257CVM4. Pinout, electrical characteristics, and reference designs are in this document.
What is the MCIMX257CVM4 pinout?
Pinout for the 400-ball LFBGA is documented in the i.MX25 datasheet and reference manual. Because the LFBGA has 400 balls arranged in a 17x17 mm grid, the pin assignment table is large and must be cross-referenced with the schematic symbol from the NXP hardware design package. Engineers should always use the official i.MX25 hardware design guide for board layout rather than recreating the pinout.
How much does the MCIMX257CVM4 cost and what is the lead time?
As of 2026-10-16, the MCIMX257CVM4 lists around 28.50 USD at qty 1 with distributor price breaks at 100, 500, and 1000 units. Authorized distributors DigiKey and Mouser typically show stock with same-day shipping for small quantities; larger orders may require 6-10 week factory lead time. Pricing and stock vary; check distributor pages for live quotes.
Is the MCIMX257CVM4 RoHS compliant and lead-free?
Per NXP's product page and distributor listings, the MCIMX257CVM4 is supplied in a lead-free finish consistent with RoHS requirements for the 400-LFBGA package. Specific RoHS and REACH compliance certificates are available in the NXP material declaration documents. Designers should request the latest MDDS or CoC letter for procurement compliance audits.
What operating system can run on the MCIMX257CVM4?
The MCIMX257CVM4's ARM926EJ-S core with MMU supports full operating systems including Linux (NXP provides BSPs for Yocto and Buildroot), Windows Embedded CE, and various RTOS options (FreeRTOS, ThreadX). NXP's i.MX25 Linux BSP is the most common starting point for industrial HMI designs. Memory management and DSP extensions enable multimedia workloads.
What is the best drop-in replacement for the MCIMX257CVM4?
Drop-in options within the i.MX25 family include the MCIMX255AJM4 and MCIMX257CJM4A, which share the same ARM926EJ-S core at 400 MHz but may differ in package code or peripheral set. Cross-brand drop-in equivalents are limited; engineers usually move to the i.MX28 or i.MX6 family for redesigns rather than pin-compatible swaps. Always verify ball B and pinout against the i.MX25 reference manual.
What are the main applications of the MCIMX257CVM4?
The MCIMX257CVM4 is designed for HMI panels, point-of-sale (POS) terminals, industrial control panels, connected consumer electronics, networked printers, and remote sensor gateways. The integrated LCD controller and image processing unit make it well suited for terminal-style products. The 400 MHz ARM926EJ-S provides enough performance for Qt-based GUIs and lightweight Linux stacks.
Does the MCIMX257CVM4 have an integrated LCD controller?
Yes. The MCIMX257CVM4 includes an integrated image processing unit (IPU) that drives LCD panels up to the supported resolution defined in the i.MX25 datasheet. This removes the need for an external LCD controller and simplifies BOM. The IPU supports both RGB and smart-panel interfaces, enabling direct connection to TFT LCD modules used in HMI panels.
What design considerations matter most when laying out the MCIMX257CVM4?
Critical design considerations for the MCIMX257CVM4 include proper DDR/SDRAM trace length matching, decoupling capacitor placement near each supply ball, controlled-impedance routing for high-speed signals, and thermal management through PCB copper. Engineers should follow the i.MX25 hardware design guide for stack-up, ball fanout, and reference clock routing to meet timing margins at 400 MHz.

Technische Referenzdaten für MCIMX257CVM4 – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MCIMX257CVM4 when you need a cost-optimized, industrial-temperature ARM926EJ-S processor with integrated LCD controller for HMI panels, POS terminals, or networked printers. It is the best fit when full Linux support is required but Cortex-A performance is not. Choose MCIMX257CJM4A if you need a different package suffix within the same i.MX257 silicon. Choose MCIMX255AJM4 / MCIMX255AVM4 if you want a lower-tier i.MX25 variant with reduced peripherals to save BOM cost. Choose MCIMX6X4CVM08AC or MCIMX6U7CVM08AB only when you need higher CPU performance and are willing to port the BSP to Cortex-A; treat these as redesign paths rather than drop-in swaps because the core architecture differs.

Vergleich mit Alternativen

Parameter Dieses Produkt MCIMX257CJM4A MCIMX255AJM4 MCIMX255AVM4 MCIMX6X4CVM08AC MCIMX6U7CVM08AB
Package 400-LFBGA (17x17 mm) 400-LFBGA 400-MAPBGA 400-LFBGA (17x17) 400-MAPBGA 400-MAPBGA
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core ARM926EJ-S ARM926EJ-S ARM926EJ-S ARM926EJ-S Cortex-A class Cortex-A class
Max CPU Clock 400 MHz 400 MHz 400 MHz 400 MHz up to 800 MHz up to 800 MHz
Series i.MX25 i.MX25 i.MX25 i.MX25 i.MX6 i.MX6
Temperature Grade Industrial Industrial Industrial Industrial Industrial Industrial
Integrated LCD Controller Yes (IPU) Yes (IPU) Yes (IPU) Yes (IPU) Yes (enhanced) Yes (enhanced)
Integrated Ethernet MAC Yes Yes Yes Yes Yes Yes
Datasheet Availability Yes Yes Yes Yes Yes Yes

Wichtigste Unterscheidungsmerkmale

  • Industrial-grade i.MX25 with integrated IPU (vs. MCIMX255AJM4)
  • Same 400-ball LFBGA footprint as i.MX6 family (vs. MCIMX6X4CVM08AC)
  • ARM926EJ-S with MMU supports full Linux (vs. Cortex-M class MCUs)

Designhinweise

The 400-ball LFBGA at 0.8 mm pitch requires a 4-6 layer PCB stack-up with dedicated ground and power planes. Follow NXP's i.MX25 hardware design guide for stack-up thickness, via-in-pad recommendations, and trace impedance targets. Use X-ray inspection post-reflow because BGA joints are not visible optically.

DDR/SDRAM termination and supply sequencing are critical for i.MX25 stability at 400 MHz. Use the recommended NXP power sequencing circuit and place decoupling capacitors within 2 mm of each supply ball. Estimated: a 4-layer board with proper decoupling typically holds core rail ripple under 30 mV peak-to-peak.

Industrial temperature grade i.MX25 parts are specified for -40C to +85C ambient operation. At 400 MHz the SoC dissipates a few hundred milliwatts depending on peripheral activity; provide a copper pour under the LFBGA thermal pad to spread heat. Enclosure designers should account for the SoC as the warmest component in sealed HMI housings.

Do not substitute a higher-clock i.MX6 family part (e.g. MCIMX6X4CVM08AC) without revalidating software. The i.MX6 uses Cortex-A cores and requires porting the entire BSP, even if the BGA footprint is similar. Use same-family i.MX25 variants for true drop-in replacements; treat i.MX6 as a redesign path.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Compliant

RoHS and REACH compliance inferred from NXP product family standards; specific certificates available on request from NXP. Not AEC-Q100 qualified - this is an industrial-grade part, not automotive. Cross-brand compliance data not available in Verified Web Data.

Daten verifiziert am: 2026-10-16 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

NXP Semiconductors MCIMX257CVM4 MCIMX257CJM4A MCIMX255AJM4 MCIMX255AVM4 MCIMX6X4CVM08AC MCIMX6U7CVM08AB i.MX25 i.MX6 ARM926EJ-S ARM Cortex-A LFBGA MAP-BGA RoHS REACH image processing unit LCD controller Ethernet MAC human-machine interface point-of-sale terminal Linux BSP Yocto Buildroot JEDEC J-STD-020 industrial temperature grade
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