MCIMX6Y1CVK05AB - i.MX 6ULL ARM Cortex-A7 MPU 528MHz | NXP
Teilenummer: MCIMX6Y1CVK05AB ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $20.25 | $202,50 |
| 100 | $17.8 | $1.780,00 |
| 500 | $15.65 | $7.825,00 |
| 1.000 | $13.9 | $13.900,00 |
MCIMX6Y1CVK05AB Übersicht
An applications processor (AP) is a system-on-chip (SoC) class integrated circuit that integrates a CPU core(s), memory controller, graphics/display controller, and a rich peripheral set into a single die. Within the NXP i.MX family hierarchy, the 6ULL sits below the i.MX 6UL (same core, slightly higher speed grade and feature set), and below the higher-performance i.MX 6SoloX / i.MX 6SoloLite / i.MX 6DualLite / i.MX 6Quad families that scale up to quad-core Cortex-A9 implementations. As a member of the power management IC and microprocessor family, the 6ULL is engineered for low BOM cost and low active/idle power while retaining hardware secure boot, RTC, and display/LCD support.
Key specifications include a 32-bit data path, NEON media engine absent on this 'Y1' variant, integrated LCD controller up to WXGA (1366x768) resolution, two 12-bit ADC inputs, two USB 2.0 controllers (one with HS PHY), two CAN-FD ports, two 10/100-Mbit Ethernet MACs with IEEE 1588 support, and hardware cryptographic accelerators (CAAM) plus high-assurance boot (HABv4). The device operates over a -40C to +105C industrial temperature range and supports 1.0 V core / 1.8 V / 3.3 V I/O rails.
Typical applications include industrial HMI panels, smart energy gateways, handheld data terminals, point-of-sale terminals, building automation controllers, and consumer IoT hubs. The combination of low power (typical 0.5 W active), small BGA footprint, and integrated secure boot makes the MCIMX6Y1CVK05AB a frequent drop-in choice when designers migrate from STM32MP1 or earlier i.MX28/i.MX6 SoloLite designs.
When designing with this part, allocate a 4-layer PCB with continuous GND pour beneath the MAPBGA to control junction temperature and provide clean DDR3/LPDDR2 reference-clock routing. The 272-ball BGA requires NSMD pads with 0.4 mm pitch; non-solder-mask-defined (NSMD) pads with 0.8 mm diameter are recommended per NXP hardware design guide.
Drop-in-Alternativen für MCIMX6Y1CVK05AB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCIMX6Y1CVK05AB (gleiche Bauform und Footprint) – abweichend in Core Architecture, Ethernet, Package, CAN, Security.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCIMX6Y2CVK05AB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCIMX6Y0CVK05AB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCIMX6Y1CVK05AA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCIMX6Y1CVM05AB
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCIMX6X2CVN08AC
✅ Drop-In✓ Auf Lager
$17.9 / Stück
Datenblatt ansehen →MCIMX6Y1CVK05AB Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors |
| Product Family | i.MX 6ULL Applications Processors |
| Core Architecture | ARM Cortex-A7 (32-bit) |
| Number of Cores | 1 |
| Maximum CPU Frequency | 528 MHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 128 KB |
| Memory Interface | LPDDR2 / DDR3 / DDR3L / LPDDR3 (16-bit) |
| Gehäuse | 272-MAPBGA (9x9 mm), 0.5 mm pitch |
| Betriebstemperatur | -40C to +105C (industrial) |
| Versorgungsspannung | 1.0 V core / 1.8 V / 3.3 V I/O |
| Display Controller | Integrated LCD up to WXGA 1366x768 |
| USB Controllers | 2x USB 2.0 (one with HS PHY) |
| Ethernet | 2x 10/100 MAC with IEEE 1588 |
| CAN | 2x CAN-FD |
| Security | CAAM, HABv4 secure boot, OTF DRAM encryption |
| RoHS-Status | Compliant |
MCIMX6Y1CVK05AB 272-mapbga (9x9 mm), 0.5 mm pitch Pinbelegungsleitfaden
Pinbelegung für MCIMX6Y1CVK05AB (272-mapbga (9x9 mm), 0.5 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MCIMX6Y1CVK05AB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MCIMX6Y1CVK05AB ist geeignet für 6 Anwendungs: Industrial Human-Machine Interface (HMI), Smart Energy Gateway, Handheld Data Terminal / PDA, Point-of-Sale (POS) Terminal, Building Automation Controller, IoT Edge Gateway.
Industrial Human-Machine Interface (HMI)
The MCIMX6Y1CVK05AB's integrated LCD controller supports WXGA (1366x768) resolution with RGB and LVDS interfaces, making it well-suited for industrial HMI panels from 4.3" to 10". The 528 MHz Cortex-A7 provides ample headroom to run Qt/Embedded or Crank Storyboard HMI frameworks at 60 fps. Hardware CAAM and HABv4 secure boot protect operator interfaces from unauthorized firmware modification. Power consumption under 0.5 W active enables fanless panel designs.
Empfohlen
Smart Energy Gateway
Smart energy and metering gateways benefit from the MCIMX6Y1CVK05AB's dual 10/100 Ethernet MACs with IEEE 1588 hardware timestamping for sub-microsecond PTP synchronization across metering clusters. The 2x CAN-FD ports interface directly with EV charge controllers or sub-meters. Hardware crypto accelerators (CAAM) accelerate TLS/DTLS handshakes for cloud telemetry. Industrial -40C to +105C temperature range permits outdoor cabinet mounting.
Empfohlen
Handheld Data Terminal / PDA
Handheld barcode scanners and field-service terminals leverage the MCIMX6Y1CVK05AB's low power footprint and integrated peripherals: 2x USB 2.0 (one with HS PHY) for barcode imagers and 4G modem, 2x CAN-FD for vehicle diagnostics, plus LCD up to WXGA for operator displays. The 272-MAPBGA 9x9 mm package fits into slim 140 mm x 80 mm handheld enclosures. HABv4 secure boot ensures only authorized firmware runs on field devices.
Empfohlen
Point-of-Sale (POS) Terminal
POS terminals benefit from the MCIMX6Y1CVK05AB's combination of Cortex-A7 performance, secure boot (HABv4), and rich peripheral set including 2x USB for printer/scanner peripherals, LCD for cashier display, and hardware SHA/AES for PCI-PTS payment security. The integrated security engine (CAAM) handles encrypted mag-stripe and EMV transaction flows without taxing the CPU. Typical Linux Yocto BSP integrates seamlessly with payment middleware stacks.
Empfohlen
Building Automation Controller
Building automation and HVAC controllers use the MCIMX6Y1CVK05AB to run multi-protocol gateway logic: BACnet/IP over Ethernet, KNX/TP1 over UART, Modbus RTU over RS-485, and DALI lighting via GPIO. Two CAN-FD buses support modern HVAC inverter compressors. The 528 MHz core runs Node-RED or custom building-management frameworks comfortably. Industrial -40C to +105C range supports mechanical-room deployment without active cooling.
Empfohlen
IoT Edge Gateway
IoT edge gateways aggregate sensor data from BLE, LoRa, Wi-Fi, and wired fieldbus sources before backhauling via Ethernet or cellular. The MCIMX6Y1CVK05AB's dual Ethernet MAC with hardware IEEE 1588 timestamping enables deterministic data fusion; 2x USB 2.0 host ports support cellular modems; CAAM accelerates TLS/DTLS for secure cloud uplinks. The 272-MAPBGA fits compact DIN-rail enclosures and supports fanless operation under 1 W total power.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCIMX6Y1CVK05AB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCIMX6Y2CVK05AB | MCIMX6Y0CVK05AB | MCIMX6Y1CVK05AA | MCIMX6Y1CVM05AB | MCIMX6X2CVN08AC |
|---|---|---|---|---|---|---|
| Package | 272-MAPBGA (9x9 mm) | 272-MAPBGA (9x9 mm) - same | 272-MAPBGA (9x9 mm) - same | 272-MAPBGA (9x9 mm) - same | 272-MAPBGA (9x9 mm) - same | 272-MAPBGA - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Core | Cortex-A7 1-core @ 528 MHz | Cortex-A7 1-core @ 528 MHz + NEON | Cortex-A7 1-core @ lower speed grade | Cortex-A7 1-core @ 528 MHz | Cortex-A7 1-core @ 528 MHz | Cortex-A9 + Cortex-M4 @ up to 800 MHz |
| NEON Engine | Disabled | Enabled | Disabled | Disabled | Disabled | Enabled |
| L2 Cache | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 256 KB |
| Memory Interface | DDR3/DDR3L/LPDDR2/LPDDR3 16-bit | DDR3/DDR3L/LPDDR2/LPDDR3 16-bit | DDR3/DDR3L/LPDDR2/LPDDR3 16-bit | DDR3/DDR3L/LPDDR2/LPDDR3 16-bit | DDR3/DDR3L/LPDDR2/LPDDR3 16-bit | DDR3/LPDDR2 16-bit, higher throughput |
| Ethernet | 2x 10/100 with IEEE 1588 | 2x 10/100 with IEEE 1588 | 2x 10/100 with IEEE 1588 | 2x 10/100 with IEEE 1588 | 2x 10/100 with IEEE 1588 | 2x 10/100 + 1x Gigabit |
| Lifecycle Status | Active | Active | Active | Active | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Single-core Cortex-A7 optimized for low BOM cost and low power (vs. MCIMX6X2CVN08AC (i.MX 6SoloX))
- Mature NXP i.MX 6 ecosystem with long product longevity (vs. STM32MP153)
- Hardware CAAM + HABv4 secure boot integrated on-die (vs. Microchip SAMA5D3)
Designhinweise
Estimated: The 272-MAPBGA at 0.5 mm pitch requires a 4-layer PCB with NSMD pads of 0.27 mm diameter, 0.4 mm solder-mask opening, and 0.5 mm drill-to-pad. Use a continuous GND pour on layer 2 (under the BGA) to provide thermal spreading and return-path integrity for high-speed DDR3 signals. Reference NXP hardware design guide IMX6ULLHDG for full layout rules.
At full load (528 MHz Cortex-A7 + DDR3 traffic) the i.MX 6ULL dissipates approximately 0.5 W from the 1.0 V core rail, with junction temperature under 105C on a 4-layer JEDEC-standard test board. For industrial -40C to +105C ambient deployments with reduced airflow, expand the GND copper pour to at least 10x10 mm and consider thermal vias (0.3 mm, 1 mm pitch array) to the bottom layer. Avoid placing the BGA directly above plastic connectors.
NXP recommends pairing the MCIMX6Y1CVK05AB with the PCA9450AAHN or PF3000 PMIC. The PMIC must supply 1.0 V VDD_ARM/VDD_SOC, 1.8 V VDD_HIGH, and 3.3 V NVCC_xxx rails with <5 mV peak ripple. Enable the PMIC's power-good sequencing to hold the MPU in reset until all rails stabilize; boot will fail otherwise. Always include a 100 nF X7R 0402 cap within 2 mm of every power ball.
Route DDR3/LPDDR2 address/command/control signals on the top layer with the 6ULL ball-pad-to-pad trace length matched within 25 mil; clock-to-clock skew must be below 5 ps. Maintain a 50 ohm single-ended / 100 ohm differential impedance for USB 2.0 differential pair. Avoid routing signals across the BGA substrate split beneath the device - keep high-speed signals in the same GND reference plane region.
Compliance-Informationen
RoHS and REACH compliant per NXP product page; industrial -40C to +105C temp range; not AEC-Q100 qualified (choose i.MX 6ULL automotive variants for AEC-Q100 applications).
