MCIMX6Y1CVK05AB - i.MX 6ULL ARM Cortex-A7 MPU 528MHz | NXP
Référence : MCIMX6Y1CVK05AB ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $20.25 | $202,50 |
| 100 | $17.8 | $1 780,00 |
| 500 | $15.65 | $7 825,00 |
| 1 000 | $13.9 | $13 900,00 |
MCIMX6Y1CVK05AB Présentation
An applications processor (AP) is a system-on-chip (SoC) class integrated circuit that integrates a CPU core(s), memory controller, graphics/display controller, and a rich peripheral set into a single die. Within the NXP i.MX family hierarchy, the 6ULL sits below the i.MX 6UL (same core, slightly higher speed grade and feature set), and below the higher-performance i.MX 6SoloX / i.MX 6SoloLite / i.MX 6DualLite / i.MX 6Quad families that scale up to quad-core Cortex-A9 implementations. As a member of the power management IC and microprocessor family, the 6ULL is engineered for low BOM cost and low active/idle power while retaining hardware secure boot, RTC, and display/LCD support.
Key specifications include a 32-bit data path, NEON media engine absent on this 'Y1' variant, integrated LCD controller up to WXGA (1366x768) resolution, two 12-bit ADC inputs, two USB 2.0 controllers (one with HS PHY), two CAN-FD ports, two 10/100-Mbit Ethernet MACs with IEEE 1588 support, and hardware cryptographic accelerators (CAAM) plus high-assurance boot (HABv4). The device operates over a -40C to +105C industrial temperature range and supports 1.0 V core / 1.8 V / 3.3 V I/O rails.
Typical applications include industrial HMI panels, smart energy gateways, handheld data terminals, point-of-sale terminals, building automation controllers, and consumer IoT hubs. The combination of low power (typical 0.5 W active), small BGA footprint, and integrated secure boot makes the MCIMX6Y1CVK05AB a frequent drop-in choice when designers migrate from STM32MP1 or earlier i.MX28/i.MX6 SoloLite designs.
When designing with this part, allocate a 4-layer PCB with continuous GND pour beneath the MAPBGA to control junction temperature and provide clean DDR3/LPDDR2 reference-clock routing. The 272-ball BGA requires NSMD pads with 0.4 mm pitch; non-solder-mask-defined (NSMD) pads with 0.8 mm diameter are recommended per NXP hardware design guide.
Alternatives de remplacement direct pour MCIMX6Y1CVK05AB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MCIMX6Y1CVK05AB (même facteur de forme et même empreinte) — différant par Core Architecture, Ethernet, Package, CAN, Security.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MCIMX6Y2CVK05AB
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCIMX6Y0CVK05AB
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCIMX6Y1CVK05AA
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MCIMX6Y1CVM05AB
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MCIMX6X2CVN08AC
✅ Remplacement direct✓ En stock
$17.9 / unité
Voir la fiche technique →MCIMX6Y1CVK05AB Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors |
| Product Family | i.MX 6ULL Applications Processors |
| Core Architecture | ARM Cortex-A7 (32-bit) |
| Number of Cores | 1 |
| Maximum CPU Frequency | 528 MHz |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 128 KB |
| Memory Interface | LPDDR2 / DDR3 / DDR3L / LPDDR3 (16-bit) |
| Boîtier | 272-MAPBGA (9x9 mm), 0.5 mm pitch |
| Température de fonctionnement | -40C to +105C (industrial) |
| Tension d'alimentation | 1.0 V core / 1.8 V / 3.3 V I/O |
| Display Controller | Integrated LCD up to WXGA 1366x768 |
| USB Controllers | 2x USB 2.0 (one with HS PHY) |
| Ethernet | 2x 10/100 MAC with IEEE 1588 |
| CAN | 2x CAN-FD |
| Security | CAAM, HABv4 secure boot, OTF DRAM encryption |
| Statut RoHS | Compliant |
Guide de configuration des broches du MCIMX6Y1CVK05AB 272-mapbga (9x9 mm), 0.5 mm pitch
Configuration des broches du MCIMX6Y1CVK05AB (boîtier 272-mapbga (9x9 mm), 0.5 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MCIMX6Y1CVK05AB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MCIMX6Y1CVK05AB convient pour 6 applications: Industrial Human-Machine Interface (HMI), Smart Energy Gateway, Handheld Data Terminal / PDA, Point-of-Sale (POS) Terminal, Building Automation Controller, IoT Edge Gateway.
Industrial Human-Machine Interface (HMI)
The MCIMX6Y1CVK05AB's integrated LCD controller supports WXGA (1366x768) resolution with RGB and LVDS interfaces, making it well-suited for industrial HMI panels from 4.3" to 10". The 528 MHz Cortex-A7 provides ample headroom to run Qt/Embedded or Crank Storyboard HMI frameworks at 60 fps. Hardware CAAM and HABv4 secure boot protect operator interfaces from unauthorized firmware modification. Power consumption under 0.5 W active enables fanless panel designs.
Recommandé
Smart Energy Gateway
Smart energy and metering gateways benefit from the MCIMX6Y1CVK05AB's dual 10/100 Ethernet MACs with IEEE 1588 hardware timestamping for sub-microsecond PTP synchronization across metering clusters. The 2x CAN-FD ports interface directly with EV charge controllers or sub-meters. Hardware crypto accelerators (CAAM) accelerate TLS/DTLS handshakes for cloud telemetry. Industrial -40C to +105C temperature range permits outdoor cabinet mounting.
Recommandé
Handheld Data Terminal / PDA
Handheld barcode scanners and field-service terminals leverage the MCIMX6Y1CVK05AB's low power footprint and integrated peripherals: 2x USB 2.0 (one with HS PHY) for barcode imagers and 4G modem, 2x CAN-FD for vehicle diagnostics, plus LCD up to WXGA for operator displays. The 272-MAPBGA 9x9 mm package fits into slim 140 mm x 80 mm handheld enclosures. HABv4 secure boot ensures only authorized firmware runs on field devices.
Recommandé
Point-of-Sale (POS) Terminal
POS terminals benefit from the MCIMX6Y1CVK05AB's combination of Cortex-A7 performance, secure boot (HABv4), and rich peripheral set including 2x USB for printer/scanner peripherals, LCD for cashier display, and hardware SHA/AES for PCI-PTS payment security. The integrated security engine (CAAM) handles encrypted mag-stripe and EMV transaction flows without taxing the CPU. Typical Linux Yocto BSP integrates seamlessly with payment middleware stacks.
Recommandé
Building Automation Controller
Building automation and HVAC controllers use the MCIMX6Y1CVK05AB to run multi-protocol gateway logic: BACnet/IP over Ethernet, KNX/TP1 over UART, Modbus RTU over RS-485, and DALI lighting via GPIO. Two CAN-FD buses support modern HVAC inverter compressors. The 528 MHz core runs Node-RED or custom building-management frameworks comfortably. Industrial -40C to +105C range supports mechanical-room deployment without active cooling.
Recommandé
IoT Edge Gateway
IoT edge gateways aggregate sensor data from BLE, LoRa, Wi-Fi, and wired fieldbus sources before backhauling via Ethernet or cellular. The MCIMX6Y1CVK05AB's dual Ethernet MAC with hardware IEEE 1588 timestamping enables deterministic data fusion; 2x USB 2.0 host ports support cellular modems; CAAM accelerates TLS/DTLS for secure cloud uplinks. The 272-MAPBGA fits compact DIN-rail enclosures and supports fanless operation under 1 W total power.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MCIMX6Y1CVK05AB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MCIMX6Y2CVK05AB | MCIMX6Y0CVK05AB | MCIMX6Y1CVK05AA | MCIMX6Y1CVM05AB | MCIMX6X2CVN08AC |
|---|---|---|---|---|---|---|
| Package | 272-MAPBGA (9x9 mm) | 272-MAPBGA (9x9 mm) - same | 272-MAPBGA (9x9 mm) - same | 272-MAPBGA (9x9 mm) - same | 272-MAPBGA (9x9 mm) - same | 272-MAPBGA - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Core | Cortex-A7 1-core @ 528 MHz | Cortex-A7 1-core @ 528 MHz + NEON | Cortex-A7 1-core @ lower speed grade | Cortex-A7 1-core @ 528 MHz | Cortex-A7 1-core @ 528 MHz | Cortex-A9 + Cortex-M4 @ up to 800 MHz |
| NEON Engine | Disabled | Enabled | Disabled | Disabled | Disabled | Enabled |
| L2 Cache | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 256 KB |
| Memory Interface | DDR3/DDR3L/LPDDR2/LPDDR3 16-bit | DDR3/DDR3L/LPDDR2/LPDDR3 16-bit | DDR3/DDR3L/LPDDR2/LPDDR3 16-bit | DDR3/DDR3L/LPDDR2/LPDDR3 16-bit | DDR3/DDR3L/LPDDR2/LPDDR3 16-bit | DDR3/LPDDR2 16-bit, higher throughput |
| Ethernet | 2x 10/100 with IEEE 1588 | 2x 10/100 with IEEE 1588 | 2x 10/100 with IEEE 1588 | 2x 10/100 with IEEE 1588 | 2x 10/100 with IEEE 1588 | 2x 10/100 + 1x Gigabit |
| Lifecycle Status | Active | Active | Active | Active | Active | Active |
Principaux différenciateurs
- Single-core Cortex-A7 optimized for low BOM cost and low power (vs MCIMX6X2CVN08AC (i.MX 6SoloX))
- Mature NXP i.MX 6 ecosystem with long product longevity (vs STM32MP153)
- Hardware CAAM + HABv4 secure boot integrated on-die (vs Microchip SAMA5D3)
Notes de conception
Estimated: The 272-MAPBGA at 0.5 mm pitch requires a 4-layer PCB with NSMD pads of 0.27 mm diameter, 0.4 mm solder-mask opening, and 0.5 mm drill-to-pad. Use a continuous GND pour on layer 2 (under the BGA) to provide thermal spreading and return-path integrity for high-speed DDR3 signals. Reference NXP hardware design guide IMX6ULLHDG for full layout rules.
At full load (528 MHz Cortex-A7 + DDR3 traffic) the i.MX 6ULL dissipates approximately 0.5 W from the 1.0 V core rail, with junction temperature under 105C on a 4-layer JEDEC-standard test board. For industrial -40C to +105C ambient deployments with reduced airflow, expand the GND copper pour to at least 10x10 mm and consider thermal vias (0.3 mm, 1 mm pitch array) to the bottom layer. Avoid placing the BGA directly above plastic connectors.
NXP recommends pairing the MCIMX6Y1CVK05AB with the PCA9450AAHN or PF3000 PMIC. The PMIC must supply 1.0 V VDD_ARM/VDD_SOC, 1.8 V VDD_HIGH, and 3.3 V NVCC_xxx rails with <5 mV peak ripple. Enable the PMIC's power-good sequencing to hold the MPU in reset until all rails stabilize; boot will fail otherwise. Always include a 100 nF X7R 0402 cap within 2 mm of every power ball.
Route DDR3/LPDDR2 address/command/control signals on the top layer with the 6ULL ball-pad-to-pad trace length matched within 25 mil; clock-to-clock skew must be below 5 ps. Maintain a 50 ohm single-ended / 100 ohm differential impedance for USB 2.0 differential pair. Avoid routing signals across the BGA substrate split beneath the device - keep high-speed signals in the same GND reference plane region.
Informations de conformité
RoHS and REACH compliant per NXP product page; industrial -40C to +105C temp range; not AEC-Q100 qualified (choose i.MX 6ULL automotive variants for AEC-Q100 applications).
