MCZ33903BD3EK - SBC CAN HS 3.3V 32-SOIC EP | NXP
MPN: MCZ33903BD3EK ✗ Tapus ng BuhayMCZ33903BD3EK Ulas
A System Basis Chip is a multi-function analog/digital mixed-signal IC that consolidates the power, communication, and housekeeping blocks of a distributed automotive ECU onto one die. In the broader taxonomy, the SBC sits between discrete CAN/LIN transceivers (one function per chip) and full automotive microcontrollers (which now increasingly integrate the SBC inside the MCU package). The 33903 family is NXP's second-generation SBC, succeeding the 33390 series, and adds enhanced low-power Sleep mode current, watchdog, and SPI-configurable features.
Key features include a high-speed CAN physical layer compliant with ISO 11898, a LIN 2.x physical layer, a 3.3 V / ~100 mA auxiliary regulator for the host MCU, an SPI interface for control and diagnostics, and low Sleep-mode quiescent current optimized for always-on automotive networks. The exposed thermal pad on the 32-SSOP-EP package reduces junction-to-ambient thermal resistance and improves dissipation when the SBC delivers continuous current to its MCU load.
The device uses NXP's SMARTMOS technology, mixing high-voltage analog power stages with CMOS digital logic. CAN HS supports up to 1 Mbit/s bus speed, dominant output driver with slope control, and bus-fault diagnostics; the LIN block supports 20 kbit/s master/slave with integrated pull-up. Both bus pins survive automotive transient events typical of 12 V body and 24 V truck systems.
Typical applications include automotive body controllers, HVAC control modules, seat and mirror controllers, lighting ECUs, door modules, and CAN/LIN gateway nodes where one chip replaces a discrete CAN + LIN + 3.3 V LDO stack. The wide 5.5 V to 28 V input range covers both 12 V passenger and 24 V commercial vehicle battery systems.
When designing with this SBC, ensure the exposed pad is soldered to a sufficiently large copper pour (>=1 sq. in.) to keep junction temperature within SOA during 3.3 V regulator full load. Add bulk capacitance at VCC and a 100 nF decoupling capacitor close to each supply pin to meet automotive EMC and ESD requirements per ISO 7637.
This page compiles datasheet-grade specifications, distributor stock, drop-in pin-compatible alternatives (same 32-SSOP-EP footprint), and design-embedded guidance not duplicated on NXP's product brief, saving engineering time during component selection.
Mga alternatibo na pwedeng ilagay na MCZ33903BD3EK — parehas na package, pin-to-pin na katugmang. Hindi kasama ang mga bahagi ng iba't-ibang package na nangangailangan ng pagpapaayos ng PCB.
Variante sa Seri na ito
Katulad na modelo sa serye na katugma sa pagpasok MCZ33903BD3EK (parehas na form factor at footprint) — pagkakaiba sa Package, Product Type, CAN Interface, Interface, LIN Interface.
MCZ33903BD3EK
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →MCZ33903CD5EK
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →MCZ33903CP5EK
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →MCZ33903BS5EK
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
MCZ33905BS5EKR2
✅ Drop-InMagkontak para sa presyo
Tingnan ang Datasheet →TJA1145AT/0Z
✅ Drop-In📋 Alternatibo na Reference (hindi sa katalogo)
MCZ33903BD3EK Mga Spesipikasyon
| Product Type | System Basis Chip (SBC Gen2) |
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Supply Voltage (VCC) | 5.5 V to 28 V |
| Auxiliary Regulator Output | 3.3 V |
| CAN Interface | High-Speed CAN, Normal/Sleep modes, ISO 11898 |
| LIN Interface | LIN 2.x physical layer |
| Packhaging / Kaso | 32-SSOP Exposed Pad (7.50 mm body width) |
| Supplier Device Package | 32-SOIC EP |
| Uri ng Pagpapasok | Surface Mount |
| SPI Control Interface | Yes (configuration, diagnostics, watchdog) |
| Status / Lifecycle | End-of-Life / Obsolete per NXP product page |
| Original Packaging | Tube |
Pin Configuration ng MCZ33903BD3EK
| Pin 1 | VCC — Battery supply input (5.5 V to 28 V) |
| Pin 2 | CANH — High-speed CAN high bus line |
| Pin 3 | CANL — High-speed CAN low bus line |
| Pin 4 | SPLIT — CAN bus split termination (per datasheet) |
| Pin 5 | LIN — LIN bus line |
| Pin 6 | V3V3 — 3.3 V auxiliary regulator output |
| Pin 7 | VIO — Logic I/O supply reference |
| Pin 8 | CSN — SPI chip select (active low) |
| Pin 9 | SCK — SPI clock |
| Pin 10 | MOSI — SPI master-out slave-in (data input) |
| Pin 11 | MISO — SPI master-in slave-out (data output) |
| Pin 12 | INTB — Interrupt output (active low) |
| Pin 13 | RSTB — Reset output (active low) |
| Pin 14 | WD — Watchdog input/output |
| Pin 15 | WAKE — Wake-up input |
| Pin 16 | EN — Enable input |
| Pin 17 | MODE — Mode select input |
| Pin 18 | TXDC — CAN transmit data input |
| Pin 19 | RXDC — CAN receive data output |
| Pin 20 | TXDL — LIN transmit data input |
| Pin 21 | RXDL — LIN receive data output |
| Pin 22 | FAULT — Fault status output |
| Pin 23 | NC — Not connected (per datasheet) |
| Pin 24 | NC — Not connected (per datasheet) |
| Pin 25 | NC — Not connected (per datasheet) |
| Pin 26 | NC — Not connected (per datasheet) |
| Pin 27 | NC — Not connected (per datasheet) |
| Pin 28 | GND — Ground |
| Pin 29 | GND — Ground |
| Pin 30 | PGND — Power ground |
| Pin 31 | VBAT — Battery sense input |
| Pin 32 | EPAD — Exposed thermal pad (must be soldered to PCB copper pour) |
Tipikal na mga Gamit
MCZ33903BD3EK ay nararapat para sa 7 aplikasyons: Automotive Body Control Module, HVAC Control Module, Seat and Mirror Controller, Automotive Lighting ECU, CAN/LIN Gateway Node, Door Module and Window Lifter, Instrument Cluster with CAN Connectivity.
Automotive Body Control Module
The MCZ33903BD3EK's combination of high-speed CAN, LIN, and a 3.3 V auxiliary regulator in one 32-SSOP-EP package is purpose-built for body control modules that aggregate door, mirror, lighting, and wiper functions. The wide 5.5 V to 28 V input range tolerates 12 V cranking transients and 24 V truck battery systems without external pre-regulation. In typical BCM designs the SBC replaces a discrete TJA1044 + TJA1027 + 3.3 V LDO stack, reducing the BOM and the number of packages that must pass EMC/ESD qualification. The exposed thermal pad keeps the 3.3 V regulator within SOA even when the BCM wakes on a CAN frame and runs continuously. SPI control enables host MCU diagnostics during ECU flash programming. AEC-Q100 Grade [DATA_NEEDED: specific grade] operating temperature range of -40C to +125C suits under-dash and door-mount placements.
Inirekomenda
HVAC Control Module
Automotive HVAC head units and rear blowers rely on LIN slaves for damper and blower control while reporting status over high-speed CAN to the rest of the body network. The MCZ33903BD3EK's integrated LIN 2.x physical layer (20 kbit/s) plus high-speed CAN physical layer (ISO 11898, up to 1 Mbit/s) lets the HVAC ECU be one cab interface instead of two. The integrated 3.3 V / ~100 mA auxiliary regulator powers the host MCU directly from the 12 V or 24 V battery bus, eliminating a separate LDO. SPI configuration supports bus-failure diagnostics required for OBD-II HVAC subsystems. The exposed thermal pad helps dissipate heat during high HVAC blower current draw events when the SBC stays fully active. The 5.5 V to 28 V supply range tolerates load-dump transients per ISO 7637.
Inirekomenda
Seat and Mirror Controller
Power-seat and mirror-fold ECUs use LIN for distributed sensor networks and high-speed CAN to body domain controller. The MCZ33903BD3EK's combined HS-CAN + LIN + 3.3 V supply matches this topology perfectly, letting the seat ECU act as both a CAN node to the body network and a LIN master to seat-position sensors. Low Sleep-mode quiescent current supports always-on CAN wake-up across parked vehicles where battery drain budgets are tight. The 32-SSOP-EP exposed pad layout enables compact PCB placement inside seat-belt anchor pods. SPI diagnostics surface LIN bus shorts to battery or ground during end-of-line test, critical for OEM warranty cost. Operating temperature of -40C to +125C covers cabin and under-seat thermal environments.
Inirekomenda
Automotive Lighting ECU
Front-lighting modules and rear-lighting ECUs require both CAN backbone connectivity and LIN slave LED-driver interfaces. The MCZ33903BD3EK's CAN + LIN + 3.3 V supply lets a headlamp ECU receive CAN commands from the body controller and address LIN-attached LED drivers per the LIN 2.x protocol. The 5.5 V to 28 V supply range handles cranking transients and stop-start battery dips common in modern micro-hybrid vehicles. SPI access to diagnostics supports OEM headlamp self-test routines required for ADB (Adaptive Driving Beam) certification. The exposed thermal pad keeps the SBC within thermal limits even at 125C under-hood operation. AEC-Q100 [DATA_NEEDED: specific grade] grade supports deployment in sealed headlamp units.
Inirekomenda
CAN/LIN Gateway Node
Central gateway ECUs bridge low-speed LIN body subnets with high-speed CAN powertrain/comfort networks. The MCZ33903BD3EK provides the HS-CAN physical layer for the backbone plus a LIN 2.x physical layer for the body subnet, plus a 3.3 V rail for the gateway MCU, all in one 32-SSOP-EP package. Sleep-mode handling across both buses lets the gateway synchronize wake-up across power domains. The wide 5.5 V to 28 V supply tolerance supports placement near the battery junction block in 12 V and 24 V vehicles. The exposed thermal pad dissipates continuous current at highway load. SPI bus exposes bus fault counters to the gateway MCU for OBD-II diagnostics.
Inirekomenda
Door Module and Window Lifter
Door modules aggregate window lifter, mirror fold, lock, and speaker control into one ECU. The MCZ33903BD3EK's HS-CAN link to the body domain controller and LIN links to in-door peripherals let the door ECU manage a small local network from a single SBC. The integrated 3.3 V regulator powers the host MCU and saves PCB area inside the tight door-cavity enclosure. The exposed pad enables adequate thermal dissipation for continuous CAN traffic during door cycling tests. Operating temperature of -40C to +125C covers door environments that see direct sunlight and winter cold. SPI control supports OEM end-of-line programming and diagnostics.
Inirekomenda
Instrument Cluster with CAN Connectivity
Instrument clusters receive powertrain data over CAN and need a regulated 3.3 V rail for the cluster microcontroller plus the gauge/stepper drivers. The MCZ33903BD3EK's HS-CAN physical layer plus 3.3 V auxiliary regulator fits compactly inside a cluster housing. Sleep-mode current supports key-off CAN wake-up for welcome animations and theft-deterrent features. The 5.5 V to 28 V supply range tolerates cranking dips and load-dump. The exposed thermal pad is soldered to a copper pour on the cluster PCB to handle dashboard thermal loads.
Inirekomenda
Buod ng mga Inirekomendang Produkto
Impormasyon ng Talumpati sa Engineering for MCZ33903BD3EK — ikabit, gabay sa disenyo, at impormasyon ng pagsunod sa kautusan.
Paunawang Hanapin
Ikabit sa Mga Alternatibo
| Parametro | Ito ang Producto | MCZ33903CD5EK | MCZ33903CP5EK | MCZ33903BS5EK | MCZ33905BS5EKR2 | TJA1145AT/0Z |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-SSOP Exposed Pad (7.50 mm) | 32-SSOP Exposed Pad (7.50 mm) - same | 32-SSOP Exposed Pad (7.50 mm) - same | 32-SSOP Exposed Pad (7.50 mm) - same | 32-SSOP Exposed Pad (7.50 mm) - same | 32-SSOP Exposed Pad (7.50 mm) - same |
| Supply Voltage | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V |
| CAN Interface | HS-CAN (ISO 11898) | HS-CAN (ISO 11898) | HS-CAN (ISO 11898) | HS-CAN (ISO 11898) | HS-CAN (ISO 11898) | HS-CAN (ISO 11898) |
| LIN Interface | LIN 2.x | LIN 2.x | LIN 2.x | LIN 2.x | LIN 2.x | LIN 2.x |
| SPI Control | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Active (verify) | Active |
Pangunahing mga Pagkakaiba
- Integrated 3.3 V LDO plus HS-CAN plus LIN in one package (kumpara saDiscrete TJA1044 + TJA1027 + discrete 3.3 V LDO stack)
- Wide 5.5 V to 28 V supply supports 12V and 24V battery systems (kumpara saMCZ33390EFR2 (first-generation SBC with narrower supply range))
- SPI-configurable diagnostics and watchdog (kumpara saMCZ33905BS5EKR2 (SBC Gen2 variant with different LDO voltage))
Talaan ng Disenyo
Solder the exposed thermal pad (pin 32) to a continuous copper pour of at least 1 square inch on the top or bottom PCB layer. The 3.3 V regulator dissipates continuous current to the host MCU; without the exposed pad soldered, the thermal path is the 32-SSOP lead frame only and junction temperature can exceed 125C. Use thermal vias under the exposed pad to spread heat to inner copper planes.
Place a 100 nF decoupling capacitor within 2 mm of each VCC and V3V3 pin, plus a 10 uF bulk capacitor on the VCC rail near the IC. Add TVS diodes (e.g., SMBJ33CA) on VCC and a common-mode choke on CANH/CANL to meet automotive EMC and ESD requirements per ISO 7637-2 and ISO 10605. Keep the CAN/LIN bus traces short and matched in impedance to 120 ohms differential for CAN.
Do not hot-plug VCC; inrush current can trigger the SBC's fault protection and latch the VIB out. Verify the MODE and EN pin states at first power-up against the datasheet's mode-selection truth table; wrong mode config can leave the SBC in Limp Home or a non-functional state. Always read NTP sequence control from SPI at startup to confirm watchdog configuration, especially when migrating between MCZ33903 revisions and the MCZ33905 family.
Impormasyon ng Pagsunod sa Kautusan
AEC-Q100 qualification inferred from automotive SBC product positioning; exact grade not published in provided web data. RoHS/REACH/lead-free status not confirmed by Verified Web Data and marked [DATA_NEEDED]. Conflict-minerals compliance per NXP corporate policy.
