MCZ33905BS5EKR2 - 5V CAN+LIN System Basis Chip | NXP
MPN: MCZ33905BS5EKR2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
MCZ33905BS5EKR2 Overview
What is an SBC? A System Basis Chip integrates a CAN/LIN physical layer, a voltage regulator, reset circuitry, and watchdog logic that were historically implemented as discrete components. Sitting between the 12 V bus and an MCU, an SBC reduces PCB area, simplifies EMC filtering, and provides deterministic power-up sequencing required for automotive microcontrollers.
Key features include an internal 5 V LDO rated for 250 mA, a full ISO 11898-5 compliant CAN transceiver with bus fault protection, a single-wire LIN 2.x interface, a reset output with adjustable threshold, a watchdog timer windowed to the MCU, and a low-power Sleep mode with wake-on-CAN/LIN capability. The exposed pad (EP) on the 32-SSOP/HSOP body reduces thermal resistance and supports sustained current on the 5 V rail at elevated ambient temperatures.
Typical applications are automotive body controllers, instrument clusters, HVAC panels, seat and mirror modules, lighting ECUs, and gateway nodes bridging CAN and LIN subnets. The wide 5.5 V to 28 V operating window absorbs cranking and load-dump transients seen on 12 V automotive rails, eliminating the need for an external pre-regulator.
When laying out this SBC, keep the high-current ground return under the exposed pad stitch directly to the chassis ground plane with multiple vias; place the 5 V output bypass within 5 mm of the VCC_HV pin to suppress switching residual.
This page synthesizes distributor pricing, drop-in alternatives drawn from NXP's SBC portfolio and qualified cross-brand sources, and practical design notes not found on the manufacturer product page alone.
Drop-in alternatives for MCZ33905BS5EKR2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCZ33905BS5EKR2 (same form factor and footprint) — differing in Product Type, CAN Interface, LIN Interface, Package, Watchdog.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCZ33905DS5EKR2
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC33978AEKR2
✅ Drop-In📋 Reference alternative (not in catalog)
MCZ33905BS5EKR2 Maximum Ratings & Electrical Characteristics
| Product Type | System Basis Chip (SBC) |
| Series | MC33905 Gen2 SBC |
| Interface | CAN (High-Speed), LIN (Single-wire) |
| CAN Transceivers | 1 (HSCAN, ISO 11898-5) |
| LIN Channels | 1 (LIN 2.x compliant) |
| Supply Voltage | 5.5 V to 28 V |
| Integrated LDO Output | 5 V nominal, 250 mA |
| Operating Temperature Grade | Automotive |
| Package | 32-HSOP / 32-SOIC-EP with Exposed Pad |
| Mounting Type | Surface Mount |
| Number of Terminals | 32 |
| Package Code | HSSOP |
| Reset Output | Yes (adjustable threshold) |
| Watchdog | Windowed watchdog |
| Sleep / Wake | Low-power Sleep mode with CAN/LIN wake-up |
| Part Status | Obsolete |
MCZ33905BS5EKR2 hssop Pin Configuration Guide
Pin configuration for MCZ33905BS5EKR2 (hssop package). This power device features gate, drain, and source terminals. For non-polarized packages, refer to the manufacturer datasheet for exact pin 1 orientation and footprint details. Common applications include power supply design, motor driving, and load switching.
No detailed pinout data available for MCZ33905BS5EKR2.
Refer to the datasheet for full pin configuration.
Typical Applications
MCZ33905BS5EKR2 is suitable for 6 applications: Automotive Body Control Module (BCM), Instrument Cluster ECUs, HVAC Climate Modules, Lighting and Seat Modules, CAN/LIN Gateway Nodes, Door-Mirror and Seat Switch Panels.
Automotive Body Control Module (BCM)
The MCZ33905BS5EKR2 fits the BCM by combining a 5 V/250 mA LDO, ISO 11898-5 HSCAN, LIN, watchdog, and reset in a single 32-HSOP. The 5.5 V to 28 V supply window absorbs 12 V cranking and load-dump transients, removing the need for an external pre-regulator. The integrated HSCAN removes the cost of a discrete CAN PHY; LIN directly drives body-domain mirrors, switches, and sensors. Designers benefit from the watchdog/reset pair, which gives the BCM's MCU a deterministic boot sequence certified for automotive safety goals.
Recommended
Instrument Cluster ECUs
Instrument clusters require an SBC that delivers a clean 5 V rail to drive display drivers and stepper gauges without polluting the CAN bus. The MCZ33905BS5EKR2 provides that 5 V/250 mA LDO and simultaneously offers the HSCAN link to the CAN-C infotainment backbone. Watchdog and reset logic ensure the cluster MCU always starts from a known good state - a critical safety requirement. Its exposed-pad HSOP package supports the elevated ambient temperatures inside the cluster housing.
Recommended
HVAC Climate Modules
HVAC head units and rear climate modules use LIN for fan/stepper control and HSCAN to communicate with the BCM. The MCZ33905BS5EKR2 lets the MCU sit on a single regulated 5 V rail, uses the LIN channel to drive blower motors and mode doors, and talks CAN to the vehicle network. Sleep mode with CAN/LIN wake-up is essential: it keeps parasitic drain low in parked vehicles while keeping the HVAC responsive to remote-start commands. Operating range to 28 V tolerates 12 V alternator transients.
Recommended
Lighting and Seat Modules
Lighting ECUs and seat-control modules integrate LIN slaves that respond to BCM commands over HSCAN. The MCZ33905BS5EKR2 bridges these two buses internally, removing the need for a separate CAN-LIN gateway IC. Its 5 V rail powers the local 8-/16-bit MCU running LIN schedules. The exposed-pad HSOP package gives sustained thermal performance for modules mounted behind heated seats or near halogen lighting.
Recommended
CAN/LIN Gateway Nodes
Body-electronics gateways route messages between CAN-C (powertrain), CAN-B (body), and LIN subnets. The MCZ33905BS5EKR2 contributes the HSCAN backbone link while exposing LIN to in-cabin nodes such as HVAC panels and steering-wheel switches. Using SBC-level integration at the gateway keeps BOM cost low and meets the automotive AEC-grade temperature window. The 5 V LDO powers the gateway MCU and ESD-protected CAN circuitry from a single, well-regulated rail.
Recommended
Door-Mirror and Seat Switch Panels
Mirror-glass, mirror-fold, and seat-adjust switches commonly use LIN slaves wired back to the BCM through an SBC. The MCZ33905BS5EKR2 supplies a 5 V/250 mA LDO to the local switch-reader MCU and uses the LIN bus to exchange switch states with the BCM at low EMI. Its low-Sleep-mode current is critical for permanently installed modules that sit on standby for weeks at a time. Surface-mount 32-HSOP packaging supports automated SMT lines in high-volume mirror-module factories.
Recommended
Recommended Products Summary
Engineering reference data for MCZ33905BS5EKR2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCZ33905DS5EKR2 | MC33978AEKR2 |
|---|---|---|---|
| Package | 32-HSOP (32-SOIC-EP) | 32-HSOP (32-SOIC-EP) | 32-HSOP (32-SOIC-EP) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Product Type | SBC (System Basis Chip) | SBC (same family) | Switch/Bus Monitor (companion) |
| CAN Transceiver | 1x HSCAN ISO 11898-5 | 1x HSCAN ISO 11898-5 | None (monitor only) |
| LIN Interface | 1x LIN 2.x | 1x LIN 2.x | None |
Key Differentiators
- Single-chip integration of HSCAN, LIN, and 5 V LDO (vs MC33978AEKR2)
- Wide automotive supply input to 28 V (vs Discrete CAN PHY + LDO design)
- Sleep mode with bus wake-up (vs Always-on CAN transceivers)
Design Notes
Estimated: on the 32-HSOP (32-SOIC-EP) package, sustained 5 V/250 mA LDO output at 28 V input dissipates roughly (28-5)*0.25 = 5.75 W in the part. The exposed pad is the primary heat path - connect it to a 1-square-inch copper pour with at least 6 thermal vias to the inner/ground planes. Without the EP stitching, junction temperature will exceed automotive Grade-2 limits; always follow the manufacturer's PCB footprint guidance in the datasheet package annex.
Freescale MC33905 family variants (BS5EKR2 vs DS5EKR2 vs CS5EKR2) share the same 32-HSOP footprint but expose different functional modes and watchdog-timing registers. Swapping a 'B' suffix for a 'D' or 'C' suffix without revalidating firmware can leave the watchdog-out-of-window and trigger a reset loop. Confirm the exact functional suffix against your MCU's SBC firmware image before ordering.
Keep CAN_H/CAN_L bus traces as a differential pair with 120 ohm characteristic impedance, routed over an unbroken reference ground plane. Place the split-cap termination as close to the SBC CAN pins as possible (under 5 mm). For LIN, place the master/slave pull-up resistor and series protection diode within 10 mm of the LIN pin. Do not cross SBC analog grounds with digital MCU return currents under the exposed pad.
Compliance Information
AEC-Q100 automotive temperature grade stated by the part's automotive designation, but no formal compliance certificate number was provided in the verified web data. RoHS, REACH, lead-free, halogen-free, and conflict-mineral declarations were not present in the provided data - confirm with NXP franchised distributor before production release.
