MK21FX512VMD12 - 120MHz Cortex-M4F 512KB MCU | NXP
Teilenummer: MK21FX512VMD12 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
MK21FX512VMD12 Übersicht
A microcontroller is a compact programmable system containing a processor core, memory, and integrated peripherals. It executes firmware to acquire data, evaluate control logic, and operate communications or human-interface systems. The Cortex-M4F architecture belongs to the ARM Cortex-M family and combines general-purpose embedded processing with digital signal processing capabilities. Kinetis K21 devices target cost-sensitive embedded systems requiring low-power functionality and broad peripheral integration.
The supplied product information identifies a 512 K × 8 Flash configuration, 512 KB program memory, 128 KB RAM, 128 KB FlexMem, a 120 MHz maximum CPU frequency, and a 144-MAPBGA package. The Mouser listing additionally identifies USB and anti-tamper functionality. The NXP product page states that the family includes hardware encryption, tamper detection, and a rich selection of analog, communication, timing, and control peripherals.
The FlexMem memory can support applications that benefit from flexible nonvolatile data storage, while the USB interface supports USB-connected control or data-transfer designs. The integrated analog and timing resources can reduce the need for external components in sensing, motor-control, communications, and general industrial products. Exact peripheral assignments, electrical limits, pin functions, clock ranges, and operating-temperature limits require confirmation from the manufacturer datasheet.
Typical uses include industrial control equipment, USB-enabled embedded controllers, security-aware access systems, sensor nodes, communications equipment, and compact consumer products. Because this part is identified as NRND, new designs should confirm lifecycle, availability, and migration implications with NXP before committing to production.
For PCB design, use the exact 144-MAPBGA land pattern and verify every ball assignment against the datasheet before routing power, ground, communications, and debug signals. Confirm package dimensions, ball-map orientation, decoupling requirements, and exposed thermal-management requirements rather than relying on generic BGA layout assumptions.
This product page consolidates the supplied manufacturer, distributor, and cross-reference information while clearly separating verified facts from parameters that require datasheet confirmation. It also highlights the need to evaluate lifecycle status, package-level compatibility, firmware support, and electrical equivalence before selecting a replacement or alternative.
Drop-in-Alternativen für MK21FX512VMD12 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MK21FX512VMD12 (gleiche Bauform und Footprint) – abweichend in Package, ADC, Mounting Type, Core, DAC.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MK60FX512VMD12
✅ Drop-In✓ Auf Lager
$10.4 / Stück
Datenblatt ansehen →MK21FX512AVMD12
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MK21FX512VMD12
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MK22FX512AVLK12
✅ Drop-In✓ Auf Lager
$8.85 / Stück
Datenblatt ansehen →MK22FN1M0AVLK12
✅ Drop-In✓ Auf Lager
$7.95 / Stück
Datenblatt ansehen →MK21FX512VMD12 Grenzwerte & elektrische Eigenschaften
| Product Type | 32-bit ARM Cortex-M4F microcontroller |
| Processor Core | ARM Cortex-M4F |
| Maximum CPU Frequency | 120 MHz |
| Flash Memory | 512 KB (512 K × 8) |
| RAM | 128 KB |
| FlexMem | 128 KB |
| Schnittstelle | USB |
| Security Feature | Anti-tamper |
| Security Feature | Hardware encryption |
| Gehäuse | 144-MAPBGA (13 mm × 13 mm) |
| Package Type | MAPBGA |
| Terminal Count | 144 terminals |
| Montageart | Surface mount |
| Lebenszyklusstatus | NRND |
| Application Segment | Cost-sensitive embedded applications requiring low-power functionality |
| Analog and Control Peripherals | Rich suite of analog, communication, timing, and control peripherals |
MK21FX512VMD12 mapbga Pinbelegungsleitfaden
Pinbelegung für MK21FX512VMD12 (mapbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MK21FX512VMD12.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MK21FX512VMD12 ist geeignet für 6 Anwendungs: USB Embedded Control, Industrial Sensor Node, Secure Access Controller, Communications Equipment, Data Acquisition System, Low-Power Embedded Product.
USB Embedded Control
MK21FX512VMD12 fits USB embedded control because the supplied Mouser listing identifies USB connectivity and the device combines a 120 MHz ARM Cortex-M4F core with 512 KB Flash and 128 KB RAM. Firmware can run USB device or host-related control tasks while using the 128 KB FlexMem for data-oriented storage, subject to the manufacturer’s memory and peripheral configuration. The 144-MAPBGA package minimizes board area but requires exact ball-map routing, short high-speed USB connections, proper decoupling, and firmware support for the selected USB stack. The USB specification, transceiver integration, operating modes, and signal-integrity requirements must be confirmed in the datasheet before layout release.
Empfohlen
Industrial Sensor Node
MK21FX512VMD12 is appropriate for an industrial sensor node when the design needs local processing, flexible data storage, and integrated communications. Its 120 MHz Cortex-M4F core can execute acquisition, filtering, and control firmware, while 512 KB Flash supports a substantial embedded application and 128 KB FlexMem can assist with nonvolatile data workloads where supported by the device configuration. The rich analog, communication, timing, and control peripheral suite cited by NXP may reduce external component count. Actual sensor accuracy, ADC resolution, timer resources, operating temperature, and industrial qualification must be verified from the exact datasheet and qualification records.
Empfohlen
Secure Access Controller
MK21FX512VMD12 can support secure access-control designs because the supplied NXP information identifies hardware encryption and tamper detection, while the distributor listing identifies anti-tamper capability. These features can protect firmware, keys, credentials, or communication sessions when implemented with the correct security architecture. The MCU’s 512 KB Flash, 128 KB RAM, and 120 MHz processing capacity allow it to combine security services with local control and communications logic. Designers must still validate threat coverage, key lifecycle, peripheral security configuration, boot behavior, and package-level implementation against the manufacturer security documentation.
Empfohlen
Communications Equipment
MK21FX512VMD12 fits communications equipment when a compact controller needs deterministic embedded processing, USB connectivity, and flexible memory. The 120 MHz ARM Cortex-M4F core provides a performance-oriented control platform, while the Kinetis family’s analog, communication, timing, and control peripherals can support protocol handling and peripheral management. The supplied data does not identify specific UART, SPI, CAN, Ethernet, or radio interfaces beyond USB, so those functions must be checked in the exact device datasheet. Board planning should separate sensitive or high-speed routes, provide robust grounding, and verify termination and voltage levels for the selected communication links.
Empfohlen
Data Acquisition System
MK21FX512VMD12 can serve as the control core of a compact data-acquisition system when multiple analog and timing resources are needed near the sensor interface. NXP describes a rich suite of analog, communication, timing, and control peripherals for the K21 family, and the supplied distributor information confirms a 120 MHz Cortex-M4F core with 512 KB Flash. Firmware can coordinate sampling, buffering, filtering, and host transfer through USB, subject to the exact ADC, timer, DMA, and memory-map configuration. Validate input ranges, sampling latency, reference accuracy, calibration strategy, and package-level signal routing in the manufacturer datasheet.
Empfohlen
Low-Power Embedded Product
MK21FX512VMD12 is positioned for cost-sensitive embedded applications requiring low-power functionality, according to the supplied NXP information. The device can consolidate control logic, memory, USB, security, analog functions, and timing resources in one 144-MAPBGA package, reducing external component count in compact products. Low-power behavior still depends on the selected clock mode, peripheral activity, firmware execution state, and package design, none of which are fully specified in the supplied data. Validate sleep modes, active current, wake-up behavior, I/O retention, and USB suspend requirements directly from the datasheet before selecting it for battery-operated equipment.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MK21FX512VMD12 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MK60FX512VMD12 | MK21FX512AVMD12 | MK21FX512VMD12 | MK22FX512AVLK12 | MK22FN1M0AVLK12 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-MAPBGA | 144-MAPBGA candidate; exact compatibility not verified | 144-MAPBGA candidate; exact compatibility not verified | 144-MAPBGA | 144-MAPBGA candidate; exact compatibility not verified | 144-MAPBGA candidate; exact compatibility not verified |
| Flash Memory | 512 KB | 512 KB indicated by MPN comparison title | 512 KB indicated by family MPN context | 512 KB | 512 KB indicated by Site MPN context | 1 MB indicated by Site MPN context |
Wichtigste Unterscheidungsmerkmale
- Integrated USB connectivity (vs. MK60FX512VMD12)
- Memory configuration (vs. MK22FN1M0AVLK12)
- Security positioning (vs. MK21FX512AVMD12)
- Lifecycle transparency (vs. MK22FX512AVLK12)
Designhinweise
Use the manufacturer’s exact 144-MAPBGA land pattern and ball map rather than a generic 144-BGA footprint. Confirm power balls, ground balls, decoupling requirements, USB routing, debug access, analog inputs, and exposed thermal features directly from the package drawing and reference layout. Because the supplied data does not include individual pin assignments, do not release a PCB or replacement design based on inferred ball names.
Do not treat MK21FX512VMD12 as a generic drop-in replacement candidate solely because a distributor comparison lists another Kinetis MPN. A valid substitution must match the exact 144-MAPBGA ball map, supply rails, clock architecture, memory map, USB requirements, security configuration, peripheral set, and firmware startup assumptions. MK60FX512VMD12 and related family parts should remain unapproved replacements until NXP or a qualified distributor confirms compatibility.
Plan the power tree only after obtaining the datasheet’s absolute maximum ratings, recommended operating voltages, regulator sequencing, and decoupling values. The supplied results identify USB, memory, analog, timing, and control resources but do not provide voltage rails or current limits. Verify every supply domain against the selected ball map, provide local bulk and high-frequency decoupling as specified by NXP, and validate power sequencing during startup, suspend, reset, and fault recovery.
Keep USB and other high-speed routes short, controlled, and referenced to a continuous ground plane, while observing the manufacturer’s differential-routing and via guidance. The exact USB transceiver mode, signal voltage, impedance requirement, connector integration, and package escape geometry are not supplied, so they must be taken from the datasheet and hardware design guidance. Validate the final board with the intended USB host, cable, enclosure, and power configuration.
The supplied package information identifies a 144-MAPBGA but does not provide a verified thermal resistance or exposed-pad arrangement. Do not estimate production thermal performance from package size alone. After obtaining the package drawing, follow the manufacturer’s land pattern, copper, via, and thermal-via recommendations and validate junction temperature using the actual board stack-up, enclosure, ambient conditions, and workload. This is especially important for sustained USB, analog, and processing activity.
Compliance-Informationen
The supplied verified data does not state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status. Confirm current compliance and qualification records on the official NXP product page or current manufacturer documentation.
