MK22FX512VMD12 - 120MHz Cortex-M4F MCU, 512KB Flash, USB, 144-MAPBGA | NXP
Teilenummer: MK22FX512VMD12 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.4 | $18,40 |
| 10 | $16.85 | $168,50 |
| 100 | $14.95 | $1.495,00 |
| 500 | $13.2 | $6.600,00 |
| 1.000 | $11.5 | $11.500,00 |
MK22FX512VMD12 Übersicht
What is a Kinetis K microcontroller? The Kinetis K series is NXP's Cortex-M4 based MCU portfolio organized into sub-families (K10/K20/K22/K60/K70) that share peripheral IP but scale flash, RAM, and package. The K22 sits in the mid-range with 512 KB flash, 128 KB RAM, and integrated USB OTG. In the broader taxonomy, this part is a 32-bit microcontroller -> ARM Cortex-M MCU -> Kinetis K-series -> K22 sub-family -> general-purpose embedded controller. USB OTG, FPU, and FlexMemory are its three defining technology differentiators versus older K10/K20 parts.
Key features include 120 MHz CPU with FPU, 512 KB flash, 128 KB FlexMemory (EEPROM emulation), 128 KB SRAM, full-speed USB OTG with on-chip transceiver, 16-bit SAR ADC, 12-bit DAC, multiple DMA channels, and low-power Run / VLPR / VLPS / LLS / VLLS modes. The part supports -40 C to +105 C industrial temperatures and is suitable for IEC 60730 class B safety applications. Hardware cryptography and tamper detection are not included, so secure boot must be implemented in firmware.
Technical depth: The K22 uses a Cortex-M4F core with DSP instructions and single-precision FPU, an 8-channel DMA, a multi-purpose FlexBus external bus controller, and a programmable gain amplifier. The MAPBGA 144-pin package exposes rich I/O including up to 4 UART, 3 SPI, 2 I2C, 2 CAN, USB OTG, and an SDHC interface. The MAPBGA 144 has a typical thermal resistance theta_JA of approximately 30-35 C/W on a 4-layer JEDEC test board.
Typical applications include industrial control, USB human-interface devices, point-of-sale terminals, low-power sensor hubs, motor control with FOC, building automation, and portable medical accessories. The combination of FPU, USB, and 128 KB RAM supports real-time control loops and USB stacks on a single die.
Design consideration: Route the MAPBGA fan-out on a 4-layer PCB minimum with micro-vias; supply the VBAT pin from a backup battery if RTC retention is needed across power cycles; configure the MCG mode (FEI/FEE/PBE/PEE) before enabling the on-chip USB transceiver to ensure 48 MHz USB clock accuracy.
This page synthesizes distributor pricing, same-package K-series alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für MK22FX512VMD12 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MK22FX512VMD12 (gleiche Bauform und Footprint) – abweichend in ADC, Core Architecture, Mounting Type, Package, Operating Temperature Range.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MK22FX512VMD12R
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MK22FX512AVMD12
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MK64FX512VMD12
✅ Drop-In✓ Auf Lager
$10.45 / Stück
Datenblatt ansehen →MK22FX512VMC12
✅ Drop-In✓ Auf Lager
$7.34 / Stück
Datenblatt ansehen →MK22FX512VMD12 Grenzwerte & elektrische Eigenschaften
| Core Architecture | ARM Cortex-M4F with single-precision FPU |
| Maximum CPU Frequency | 120 MHz |
| Program Flash | 512 KB |
| FlexMemory (EEPROM emulation) | 128 KB |
| SRAM | 128 KB |
| USB | USB OTG full-speed with on-chip transceiver |
| ADC | 16-bit SAR |
| DAC | 12-bit |
| Gehäuse | 144-MAPBGA (13 x 13 mm) |
| Operating Voltage | 1.71 V to 3.6 V |
| Betriebstemperatur | -40 C to +105 C |
| Montageart | Surface Mount (MAPBGA) |
| Series | Kinetis K22 |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
MK22FX512VMD12 144-mapbga (13 x 13 mm) Pinbelegungsleitfaden
Pinbelegung für MK22FX512VMD12 (144-mapbga (13 x 13 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MK22FX512VMD12.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MK22FX512VMD12 ist geeignet für 6 Anwendungs: Industrial USB Human-Interface Devices, Point-of-Sale Terminals, Building Automation Controllers, Low-Power Portable Sensor Hubs, Motor Control with Field-Oriented Control, Medical Accessory Controllers.
Industrial USB Human-Interface Devices
The MK22FX512VMD12's full-speed USB OTG with on-chip transceiver removes the need for an external PHY, reducing BOM cost in HID keyboards, barcode scanners, and industrial mice. The Cortex-M4F at 120 MHz provides plenty of headroom for HID report aggregation and vendor-specific control transfers. With 128 KB RAM and 16-bit SAR ADC, the same MCU can monitor battery state, switch inputs, and stream USB data simultaneously. The 1.71 V to 3.6 V operating range supports 5 V USB bus-powered designs without an extra regulator on the VBUS sensing path.
Empfohlen
Point-of-Sale Terminals
Point-of-sale terminals require USB device connectivity, secure keypad scanning, and real-time LCD handling. The K22 integrates USB OTG, two CAN interfaces, and a 16-bit ADC that supports magnetic-stripe and smart-card analogue front-ends. The 512 KB flash holds firmware for PCI-grade encryption libraries and the 128 KB SRAM accommodates EMV transaction buffers. Hardware FPU accelerates RSA exponentiation routines used in PIN-block encryption, while the MAPBGA 144 footprint allows 4-layer PCB designs that fit standard POS chassis.
Empfohlen
Building Automation Controllers
Building-automation hubs aggregate sensor data from HVAC, lighting, and security subsystems. The MK22FX512VMD12's FlexBus interface supports external SRAM expansion for protocol stacks like BACnet or KNX, while the integrated USB OTG serves as a service-port for firmware updates. Two CAN peripherals handle fieldbus connectivity, and the low-power Run/VLPR modes cut consumption between scheduled sensor reads. The -40 C to +105 C industrial temperature range covers unheated equipment rooms and outdoor enclosures.
Empfohlen
Low-Power Portable Sensor Hubs
Portable sensor hubs for wearables and remote telemetry benefit from the K22's full set of low-power modes - VLPR drops current draw below 1 mA while still keeping the core ready to wake on interrupt. The 16-bit ADC with PGA front-end handles thermocouple and load-cell conditioning directly, eliminating external analogue chips. USB OTG supports both charging and data sync from a single port. The FPU processes floating-point sensor-fusion algorithms in real time, which is critical for IMU-based orientation tracking.
Empfohlen
Motor Control with Field-Oriented Control
Field-oriented control of BLDC and PMSM motors demands single-precision FPU performance, high-resolution PWM, and fast ADC sampling. The K22's Cortex-M4F at 120 MHz executes FOC loops in tens of microseconds, while the 16-bit ADC with dual-sample-and-hold captures phase currents synchronously. FlexTimer/PWM outputs provide up to eight channels with complementary pairs and dead-time insertion. USB OTG allows live tuning of motor parameters from a host PC during commissioning.
Empfohlen
Medical Accessory Controllers
Medical accessories such as patient monitors and infusion-pump controllers require IEC 60730 class B software safety compliance and deterministic real-time response. The K22 supports class B libraries, hardware watchdog, CRC, and DMA-driven ADC sampling that meet these requirements. The 512 KB flash accommodates full class B self-test routines plus application firmware. USB OTG enables tethered diagnostics, and the low-leakage stops preserve battery life across patient-bedside deployments.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MK22FX512VMD12 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MK22FX512VMD12R | MK22FX512AVMD12 | MK64FX512VMD12 | MK22FX512VMC12 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-MAPBGA (13x13) | 144-MAPBGA (13x13) | 144-MAPBGA (13x13) | 144-MAPBGA (13x13) | 144-MAPBGA |
| Core | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz | ARM Cortex-M4F @ 120 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 256 KB | 128 KB |
| USB | OTG FS on-chip transceiver | OTG FS on-chip transceiver | OTG FS on-chip transceiver | OTG FS + Ethernet MAC | OTG FS on-chip transceiver |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
| Lifecycle Status | NRND | NRND | NRND | Active | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Crystal-less full-speed USB OTG with on-chip transceiver (vs. MK22FX512AVMD12)
- Lower RAM than K64 family at same package (vs. MK64FX512VMD12)
- Kinetis low-power VLPR sub-mA mode with FPU retention (vs. MK22FX512VMC12)
Designhinweise
Route the 144-MAPBGA on a 4-layer PCB minimum with laser-drilled micro-vias on the 1.0 mm ball pitch. Use a 0.4 mm drill and 0.2 mm pad via-in-pad with copper fill for thermal relief. Place 100 nF decoupling caps on each VDD pin within 2 mm trace length. The exposed die pad must be soldered to the ground plane with at least 9 thermal vias in a 3x3 pattern to keep theta_JA under 35 C/W.
The MK22 supports 1.71 V to 3.6 V on VDD and a separate VBAT pin for RTC retention. Decouple VBAT with a 1 uF X7R ceramic and a 100 nF bypass; tie VBAT to VDD through a 100 k resistor if battery backup is not needed. Configure the PMC regulator (PMC_REGSC) to enable the low-power modes only after locking the SystemCoreClock to avoid inadvertent core reset during Stop entry.
Firmware built for MK22FX512VMD12 is not guaranteed to run on MK22FX512AVMD12 due to register-map differences in DMA, MCG, SPI, UART, and USB. Per NXP Community thread 478763, the header files differ; verify against the specific mk22f12.h or mk22fa12.h before porting. Also note that the crystal-less USB mode is qualified for full-speed device only - high-speed or host certification requires a crystal reference.
Compliance-Informationen
RoHS and lead-free confirmed per NXP product page. Not AEC-Q100 qualified - for automotive-grade applications use the S32K or SPC56xx families. Reach and conflict-minerals statements are available in NXP environmental quality documents.
