MPC565CZP40 - 32-bit PowerPC MCU, 1MB Flash, 40MHz, PBGA-388 | NXP
Teilenummer: MPC565CZP40 ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $71.2 | $712,00 |
| 100 | $64.85 | $6.485,00 |
| 500 | $58.4 | $29.200,00 |
| 1.000 | $52.1 | $52.100,00 |
MPC565CZP40 Übersicht
A Power Architecture microcontroller (also called PowerPC embedded processor) is a high-performance RISC processor family designed for deterministic real-time control. Within the broader taxonomy it sits at: PowerPC -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. The MPC500 line was Freescale/NXP's flagship automotive MCU family before being succeeded by the MPC55xx and MPC56xx series, and it remains in production for long-lifecycle automotive programs.
Key features include a 32-bit PowerPC core with integrated FPU, 1 MB embedded Flash (1M x 8 organization), an advanced peripheral set including TouCAN, USIU, dual TPU and QADC, 8 KB unified cache, 36 KB SRAM, and a 32-channel interrupt controller. The integrated FPU enables single- and double-precision IEEE-754 floating-point math directly in hardware, which is critical for engine-control algorithms.
The MPC565 integrates the CPU, FPU, Flash, SRAM, and a rich automotive peripheral set on a single die using a 0.35 micrometer CMOS process with five metal layers. The 388-ball PBGA package provides a robust surface-mount interconnect qualified for under-hood automotive environments including engine control units (ECUs) and transmission control modules.
Typical applications include automotive engine management (gasoline/diesel ECUs), electronic stability control, transmission control units, body controllers, and industrial real-time control. The integrated FPU and 1 MB Flash make it particularly suitable for complex powertrain control software.
When designing with this device, attention must be paid to the 3.3V I/O and 2.6V core supply rails, decoupling on all VDD pins, and PCB thermal management through the central thermal ball array. The 40 MHz bus clock and internal PLL support peripheral timing flexibility.
This page synthesizes distributor inventory (as of 2026-10-17), drop-in MPC5xx/MPC56xx alternatives, application guidance, and design notes not consolidated in the original datasheet.
Drop-in-Alternativen für MPC565CZP40 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC565CZP40 (gleiche Bauform und Footprint) – abweichend in Core Architecture, Operating Temperature, Supply Voltage, Series, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC563CZP40
✅ Drop-In✓ Auf Lager
$58.5 / Stück
Datenblatt ansehen →MPC564MZP56
✅ Drop-In✓ Auf Lager
$78.1 / Stück
Datenblatt ansehen →MPC563MZP56
✅ Drop-In✓ Auf Lager
$17.95 / Stück
Datenblatt ansehen →MPC535CZP40
✅ Drop-In✓ Auf Lager
$24.5 / Stück
Datenblatt ansehen →MPC565CZP40 Grenzwerte & elektrische Eigenschaften
| Core Architecture | PowerPC MPC5xx (Power Architecture) |
| CPU Core | 32-bit PowerPC with integrated FPU |
| Maximum CPU Clock | 40 MHz |
| Program Memory | 1 MB Flash (1M x 8) |
| FPU | Yes - IEEE-754 single and double precision |
| Betriebstemperatur | -40C to +85C (automotive grade) |
| Gehäuse | 388-PBGA (27 x 27 mm) |
| Montageart | Surface Mount (BGA) |
| Family | MPC500 |
| Automotive Grade | Yes (AEC-Q100 qualified per family) |
| Peripherals | TouCAN, USIU, TPU, QADC, MIOS, USART |
| Process Technology | 0.35 micrometer CMOS, 5-metal |
MPC565CZP40 388-pbga (27 x 27 mm) Pinbelegungsleitfaden
Pinbelegung für MPC565CZP40 (388-pbga (27 x 27 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC565CZP40.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC565CZP40 ist geeignet für 6 Anwendungs: Automotive Engine Control Unit (ECU), Transmission Control Module (TCM), Electronic Stability Control (ESC), Body Control Module (BCM), Industrial Real-Time Control, Aerospace Flight Control Auxiliary.
Automotive Engine Control Unit (ECU)
The MPC565CZP40's 32-bit PowerPC core at 40 MHz with integrated IEEE-754 FPU makes it well suited to gasoline and diesel engine ECUs. The 1 MB on-chip Flash holds calibration tables and torque-based control software, while the FPU accelerates air-charge estimation and knock-detection math. Compared with the MPC563 family, the MPC565 adds hardware floating-point which removes integer-emulation overhead. Used downstream of 5V sensor conditioning, the part interfaces via TouCAN to the vehicle CAN bus and QADC to crank/cam position sensors. Trade-off vs newer MPC56xx: lower 40 MHz clock versus 56 MHz and beyond on e200z4 successors.
Empfohlen
Transmission Control Module (TCM)
Transmission control modules benefit from the MPC565CZP40's deterministic interrupt response and rich automotive peripheral set including the Time Processing Unit (TPU) for PWM generation on shift solenoids. The 388-PBGA package dissipates heat from continuous solenoid-drive scheduling, while 1 MB Flash holds gear-ratio maps and adaptive learning tables. QADC channels sample line-pressure sensors at the 40 MHz system bus rate. Migration to MPC564MZP56 is recommended for new TCM designs given its higher 56 MHz clock and active production status versus the MPC565's last-time-buy position.
Empfohlen
Electronic Stability Control (ESC)
ESC modules use the MPC565CZP40 for yaw-rate control loops at sub-10 ms cycle times. The integrated FPU computes vehicle dynamics matrices (slip-angle, yaw-rate reference) in single cycle, and the MIOS/timer subsystem schedules wheel-brake intervention PWM. The 40 MHz PowerPC core is deterministic enough for ISO 26262 ASIL-B braking-system targets when paired with external watchdog and voltage supervisor. The 388-PBGA's central thermal pad supports the high-utilization duty cycle of brake-by-wire processing. Replace with MPC564MZP56 or MPC56xx for new ASIL-D programs.
Empfohlen
Body Control Module (BCM)
Body control modules use the MPC565CZP40 for central body-electronics coordination including lighting, door locks, and LIN/CAN gateway duties. The TouCAN peripheral interfaces with the vehicle CAN network, and the integrated FPU handles message-filtering and network-management algorithms. The 1 MB Flash stores BCM application code and OEM-specific variant tables. The -40C to +85C automotive grade supports under-dash and engine-bay-near deployments. For cost-sensitive BCMs the MPC563 (no FPU) is a viable drop-in where floating-point math is not needed.
Empfohlen
Industrial Real-Time Control
Beyond automotive, the MPC565CZP40 serves industrial real-time control systems including servo drives, robotic controllers, and high-end PLCs where deterministic 32-bit compute and a rich peripheral set are required. The IEEE-754 FPU accelerates kinematics and PID-loop math while the 388-PBGA survives harsh factory-floor thermal and vibration environments. The TPU channels generate high-resolution PWM for servo amplifiers. Engineers migrating to a current-production part should consider the MPC564MZP56 (active, 56 MHz, e200z4) which shares the PBGA footprint for direct PCB reuse.
Empfohlen
Aerospace Flight Control Auxiliary
Some aerospace flight-control auxiliary systems and engine FADEC peripherals have qualified the MPC565CZP40 for non-primary-flight applications. The automotive-grade -40C to +85C spec is acceptable for cockpit-avionics enclosures, while the integrated FPU handles guidance algorithms. The Power Architecture compliance allows use of existing automotive-derived software stacks. Note: primary flight-critical applications require DO-178C-qualified variants and additional environmental screening beyond the standard automotive MPC565CZP40 datasheet ratings.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC565CZP40 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC563CZP40 | MPC564MZP56 | MPC563MZP56 | MPC535CZP40 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 388-PBGA (27x27) | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same | 388-PBGA (27x27) - same |
| CPU Clock | 40 MHz | 40 MHz | 56 MHz (+40%) | 56 MHz (+40%) | 40 MHz |
| Floating-Point Unit | Yes (IEEE-754) | No | Yes (e200z4 FPU) | No | Yes |
| Core Architecture | PowerPC MPC5xx | PowerPC MPC5xx | PowerPC e200z4 | PowerPC e200z4 | PowerPC MPC5xx |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +125C | -40C to +85C |
| Lifecycle Status | Last-time-buy | Last-time-buy | Active | Active | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Highest Flash density with same footprint in the MPC565 family (vs. MPC563CZP40)
- Integrated IEEE-754 floating-point unit (vs. MPC563CZP40)
- Highest clock speed in same PBGA footprint among drop-ins (vs. MPC563CZP40)
Designhinweise
The MPC565CZP40 typically requires a 2.6V core supply and 3.3V I/O supply; both rails must be brought up in a defined sequence (VDD before VDDSYN per the datasheet). Use a low-dropout regulator such as an automotive-grade LDO with power-good output to drive the core rail, and place 100 nF decoupling on every AVDD/DVDD ball plus bulk 4.7 uF tantalum or ceramic on each supply plane. Inrush current during Flash programming peaks near 200 mA so the supply must hold regulation during mass-erase operations.
The 388-PBGA's central thermal-ball grid must be soldered to a thermal pad on the PCB that is connected to an internal copper plane with thermal vias (estimated: 25+ vias at 0.3 mm drill on a 1.2 mm pitch). Without adequate PCB copper, junction temperature can exceed 125C at full 40 MHz operation. Reference NXP application note AN2400 for BGA thermal management patterns. Monitor junction temperature via the on-chip thermal sensor during worst-case environmental qualification.
Route the 388-PBGA fan-out on a 4-layer or higher PCB with the top layer dedicated to escape routing and inner layers as ground/power planes. Maintain 50 ohm controlled impedance on the external bus interface signals. Place the external 4 MHz or 8 MHz crystal within 10 mm of the XTAL pins with a guard ring tied to analog ground to minimize EMI coupling. BGA escape vias should be 0.2 mm drill / 0.4 mm pad with via-in-pad recommended for inner-row balls to route out cleanly.
Do not confuse the MPC565CZP40 (PBGA package, 40 MHz, 1 MB Flash) with the MPC565CVR40 (different package, 40 MHz) when sourcing - the package code is part of the orderable part number. Also note that the MPC563CZP40 has half the Flash density (512 KB) and lacks the FPU. Cross-check against NXP's product discontinuance notice before committing to a new design - the part is in last-time-buy status as of 2026-10-17, and Rochester Electronics inventory is finite.
Compliance-Informationen
Automotive grade per family datasheet; specific RoHS/REACH/lead-free markings were not present in the verified distributor snippets. AEC-Q100 qualification inferred from -40C to +85C automotive temperature grade and family-level automotive positioning; consult NXP compliance certificate for definitive status.