MPC565CZP40 vs MPC563MZP56 Vergleich

Detaillierter Direktvergleich von MPC565CZP40 von NXP Semiconductors und MPC563MZP56 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC565CZP40 MPC565CZP40 - 32-bit PowerPC MCU, 1MB Flash, 40MHz, PBGA-388 | NXP

MPC565CZP40 - 32-bit PowerPC MCU, 1MB Flash, 40MHz, PBGA-388 | NXP

MPC565CZP40 ⚠ Letzte Bestellmöglichkeit
NXP Semiconductors
MPC563MZP56 MPC563MZP56 - 32-Bit 56MHz PowerPC MCU, 512KB Flash | NXP

MPC563MZP56 - 32-Bit 56MHz PowerPC MCU, 512KB Flash | NXP

MPC563MZP56 Nrnd

Spezifikationsvergleich

Parameter MPC565CZP40 MPC563MZP56
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Letzte Kaufgelegenheit NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $52,10 $17,95
Core Architecture PowerPC MPC5xx (Power Architecture) PowerPC MPC5xx (32-bit)
CPU Core 32-bit PowerPC with integrated FPU —
Maximum CPU Clock 40 MHz —
Program Memory 1 MB Flash (1M x 8) —
SRAM [DATA_NEEDED: total SRAM size in KB] —
FPU Yes - IEEE-754 single and double precision —
Operating Voltage [DATA_NEEDED: VDD core/IO range] 5 V (typical)
Betriebstemperatur -40C to +85C (automotive grade) [DATA_NEEDED: operating temperature range]
Gehäuse 388-PBGA (27 x 27 mm) 388-PBGA (27 x 27 mm)
Montageart Surface Mount (BGA) Surface Mount (BGA)
MSL-Level [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL rating]
Family MPC500 —
Automotive Grade Yes (AEC-Q100 qualified per family) —
RoHS-Status [DATA_NEEDED: RoHS compliance] Compliant (per distributor listing)
Lead-Free [DATA_NEEDED: lead-free status] —
Peripherals TouCAN, USIU, TPU, QADC, MIOS, USART Peripheral pin multiplexing, CAN, SPI, serial interfaces
Process Technology 0.35 micrometer CMOS, 5-metal —
Maximum CPU Frequency — 56 MHz
Program Memory (Flash) — 512 KB (512K x 8)
RAM Size — 36 KB
Number of I/O Pins — [DATA_NEEDED: I/O count]
Temperature Grade — Standard (P)
Code Compression — Yes (on-chip)
Intermodule Bus — Common IMB
Debug Interface — Background Debug Mode (BDM)
Manufacturer — NXP USA Inc. (formerly Freescale/Motorola)

Datenblätter & Ressourcen

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