MPC8245ARVV400D - 400MHz PowerPC 603e Host Processor | NXP
Teilenummer: MPC8245ARVV400D ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72 | $720,00 |
| 100 | $65 | $6.500,00 |
| 500 | $58.5 | $29.250,00 |
| 1.000 | $52 | $52.000,00 |
MPC8245ARVV400D Übersicht
An Integrated Host Processor is a system-on-chip (SoC) class device that combines a high-performance microprocessor core with peripheral and memory interfaces, allowing designers to build complete embedded systems with fewer external components. The MPC8245 belongs to the MPC82xx family of host processors, which sit in the hierarchy: microprocessor -> embedded processor -> integrated host processor -> system-on-chip -> semiconductor. By collapsing the northbridge functions onto the chip, the MPC8245 lowers board complexity, BOM cost and power consumption compared with discrete CPU + bridge designs.
Key differentiating features include the PowerPC 603e execution core with separate 16 KB instruction and 16 KB data L1 caches, an integrated PCI 2.2 bus interface running up to 66 MHz, a 64-bit memory controller supporting SDRAM, and a flexible peripheral set including I2C, UART and GPIO. The device supports both big-endian and little-endian byte ordering, allowing it to integrate into either legacy PowerPC or x86-style software stacks. Power consumption is held under typical embedded workloads via low-power modes, and the 35x35 TBGA footprint enables high-density board designs.
Architecturally the MPC8245 uses a Harvard-style internal bus connecting the 603e core, the internal L2-style memory controller and the PCI bridge. The 603e core implements out-of-order execution, branch prediction and a double-precision FPU, delivering performance appropriate for network routers, RAID controllers, industrial controllers and imaging systems. A typical design pairs the MPC8245 with DDR/SDRAM, Flash boot ROM and a PCI-attached peripheral device.
Typical applications include network switches, RAID storage controllers, industrial automation controllers, print/image processing engines, and embedded PCI peripherals. The integrated host bridge simplifies board layout and reduces system cost compared to discrete CPU + bridge solutions.
When designing with this part, ensure that the 352-ball TBGA is laid out on a board with at least 6 PCB layers to provide adequate power planes and signal integrity for the DDR/SDRAM and PCI interfaces. Thermal management for the TBGA-352 is critical in closed enclosures - the theta_JA must be calculated against the application's worst-case ambient and air-flow conditions.
This page synthesizes distributor pricing, drop-in alternative MPNs within the MPC82xx family, and practical design considerations not all present in the standalone manufacturer datasheet.
Drop-in-Alternativen für MPC8245ARVV400D – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8245ARVV466D
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8245ARVV300D
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8245ARVV266D
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8245ARVV400D Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | MPC82xx |
| Core Architecture | PowerPC 603e |
| Core Count | 1 |
| Datenbusbreite | 32-bit |
| Maximale Taktfrequenz | 400 MHz |
| Betriebstemperatur | 0 C to 85 C |
| Gehäuse | 352-TBGA (35x35 mm) |
| Montageart | Surface Mount |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| Integrated PCI Interface | PCI 2.2, up to 66 MHz |
| Memory Controller | Integrated, supports SDRAM |
| Byte Ordering | Big-endian / Little-endian selectable |
| Lifecycle | Obsolete - Rochester Electronics is an authorized continuing source |
MPC8245ARVV400D 352-tbga (35x35 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8245ARVV400D (352-tbga (35x35 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8245ARVV400D.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8245ARVV400D ist geeignet für 6 Anwendungs: Network Switch / Router Host Processor, RAID Storage Controller, Industrial Automation Controller, Print and Image Processing Engine, Embedded PCI Peripheral Card, Long-Life Military / Aerospace Embedded System.
Network Switch / Router Host Processor
The MPC8245ARVV400D is well suited as the main host CPU inside mid-range managed Ethernet switches and routers. Its 400 MHz PowerPC 603e core delivers enough compute for forwarding tables, ACL processing and routing daemons, while the integrated PCI 2.2 bridge at up to 66 MHz attaches directly to switch fabric ASICs or PHY management interfaces. The 64-bit SDRAM controller supports the high-bandwidth memory traffic typical of network processors, and the integrated host design reduces the PCB footprint relative to discrete CPU + northbridge architectures. Compared to ARM9 alternatives, the PowerPC 603e offers stronger integer performance for network-control-plane workloads and better legacy code reuse. The TBGA-352 footprint is also recognized by long-life embedded design teams that need parts with multi-decade support from authorized continuing-source distributors.
Empfohlen
RAID Storage Controller
In RAID controller cards and storage subsystems the MPC8245ARVV400D acts as the host processor that runs the RAID firmware and exposes the logical volumes to the host system through a PCI interface. Its 400 MHz core plus 16 KB instruction / 16 KB data L1 caches keep I/O latency low, and the integrated PCI bridge directly connects to SATA/SAS controller ASICs without an external bridge chip. The 64-bit memory controller feeds the on-board DDR/SDRAM buffer cache used for stripe writes, and the integrated host architecture shortens the design cycle compared to discrete CPU + bridge solutions. Embedded storage OEMs value the long-term availability of the MPC8245 platform, since storage controllers typically ship for ten years or more. Rochester Electronics as the authorized continuing source further extends the lifecycle.
Empfohlen
Industrial Automation Controller
The MPC8245ARVV400D serves as the host processor inside industrial automation controllers - PLCs, motion controllers and machine-vision inspection systems. Its 400 MHz PowerPC 603e core runs real-time control loops and HMI software simultaneously, while the integrated PCI interface attaches to motion-control cards, vision-capture ASICs and fieldbus gateways. The integrated memory controller feeds deterministic SDRAM access for real-time control tasks, and the part's 0 C to 85 C commercial operating range (per the 'D' suffix) suits factory-floor enclosures. Industrial-grade MPC8245AZU400D variants are available from the same RVV footprint family for harsher -40 C to 85 C environments. Compared with ARM Cortex alternatives, the PowerPC toolchain is mature for industrial software stacks and many legacy fieldbus stacks were originally written for it.
Empfohlen
Print and Image Processing Engine
The MPC8245ARVV400D is widely used as the engine controller in production-class printers, multifunction devices, and large-format image processors. Its 400 MHz PowerPC 603e core accelerates the raster image processor (RIP) and the JPEG/MIFF pipelines that drive the print engine, while the PCI interface attaches to scanner ASICs and the network-side print server. The 64-bit SDRAM controller provides high-bandwidth access to frame buffers used in 600/1200 DPI image pipelines. Compared to discrete host designs, the integrated host bridge reduces the controller card to a small footprint, important for the tight mechanical constraints of printer engine boards. The TBGA-352 footprint is well understood by mechanical and thermal engineering teams that have shipped many generations of printer controllers on it.
Empfohlen
Embedded PCI Peripheral Card
OEMs building embedded PCI peripheral cards - data-acquisition cards, software-defined radio front ends, machine-vision capture cards, and protocol analyzers - use the MPC8245ARVV400D as an on-card host processor. The integrated PCI 2.2 bridge lets the card present itself as a PCI target to a host system and run on-card preprocessing in parallel with the host CPU, offloading I/O and DSP work. The 64-bit SDRAM controller hosts the on-card frame buffers and FIFOs, and the integrated host architecture means a single chip replaces CPU + bridge + glue logic, reducing card cost and power. The TBGA-352 (RVV) footprint has standard card-mechanical keep-out and a known reference schematic that OEM designers can re-use across product generations.
Empfohlen
Long-Life Military / Aerospace Embedded System
The MPC8245ARVV400D is a candidate for long-life military and aerospace embedded systems where the host processor must be supported for 15-25 years. Although the part is marked obsolete by NXP, Rochester Electronics as an authorized distributor continues to manufacture and stock the part for these long-life programs, providing full traceability and conformance documentation. The PowerPC 603e core, the integrated PCI bridge, and the 64-bit memory controller have been qualified on RDATA avionics and ground-vehicle platforms, and the same RVV-package family is familiar to avionics mechanical and thermal designers. For new designs where long-life is the dominant requirement, the part remains the lowest-risk choice when the existing software stack is already PowerPC based.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8245ARVV400D – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8245ARVV466D | MPC8245ARVV300D | MPC8245ARVV266D |
|---|---|---|---|---|
| Package | 352-TBGA (35x35 mm) | 352-TBGA (35x35 mm) - same | 352-TBGA (35x35 mm) - same | 352-TBGA (35x35 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock Frequency | 400 MHz | 466 MHz (+16.5%) | 300 MHz (-25%) | 266 MHz (-33%) |
| Core Architecture | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit |
| L1 Instruction Cache | 16 KB | 16 KB | 16 KB | 16 KB |
| L1 Data Cache | 16 KB | 16 KB | 16 KB | 16 KB |
| Integrated PCI Bridge | PCI 2.2, up to 66 MHz | PCI 2.2, up to 66 MHz | PCI 2.2, up to 66 MHz | PCI 2.2, up to 66 MHz |
| Operating Temperature | 0 C to 85 C | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) |
| Lifecycle Status | Obsolete (Rochester continuing source) | Obsolete (Rochester continuing source) | Obsolete (Rochester continuing source) | Obsolete (Rochester continuing source) |
Wichtigste Unterscheidungsmerkmale
- Higher core clock within the same RVV footprint (vs. MPC8245ARVV466D)
- Lower-power 300 MHz option in the same RVV footprint (vs. MPC8245ARVV300D)
- Industrial-temperature drop-in option in the same RVV footprint (vs. MPC8245AZU400D)
Designhinweise
The 352-ball TBGA package requires at least 6 layers: 2 outer signal layers plus 4 inner power/ground planes. Use a 1.0 mm pitch BGA land pattern per the NXP package drawing, with non-solder-mask-defined (NSMD) pads for better joint fatigue life. Power-plane stitching vias should be placed on a 1.0 mm grid under the BVB keep-out to provide a low-impedance return path for the DDR/SDRAM and PCI buses. Estimated: theta_JA for the TBGA-352 is approximately 12 C/W with a JEDEC 4-layer test board; closed-enclosure applications should add 20-30% margin for the lack of forced airflow.
The 64-bit SDRAM interface runs at a divided ratio of the core clock; route all SDRAM signals on inner stripline layers with matched lengths within +/- 50 mils for the byte lanes and a separate +/- 25 mils match for the clock pair. PCI signals at 66 MHz must be routed as a 50-ohm controlled-impedance bus with series damping resistors near the driver as recommended in the NXP MPC8245 hardware-design guide. Add 22-33 ohm series resistors on PCI outputs to dampen reflections on long backplane stubs.
The MPC8245ARVV400D dissipates approximately 2-3 W at typical embedded workloads, and worst-case workloads can push power to 4 W. The TBGA-352 (RVV) package has a thermal resistance of approximately 12 C/W on a JEDEC 4-layer board, giving a junction-to-ambient rise of 24-36 C at typical load and up to 48 C at worst case. For closed enclosures without airflow, attach a small aluminum heatsink with thermal interface material to the top of the package; the part's commercial 85 C limit must include this self-heating. Estimated: assumes typical 2.5 W dissipation at 400 MHz input operation.
Use a low-impedance power decoupling network: place 0.1 uF X7R ceramic decoupling caps on every power pin pair, plus 10 uF bulk tantalum or polymer caps at each supply rail entry point. The 603e core voltage rail requires a dedicated VRM with output voltage accuracy of +/- 5% and load-step response of <50 mV. Power-on strapping pins must be pulled to the correct logic level with 4.7 kohm resistors for PLL configuration and boot-mode selection.
Compliance-Informationen
RoHS, REACH, lead-free and halogen-free status are not provided in the verified distributor listings for this obsolete NXP part; mark unknown. The part is not AEC-Q100 qualified - it targets industrial/commercial embedded systems. Conflict-minerals status not reported on distributor listings.