MPC8245TVV266D - PowerPC 603e 266MHz Host Processor | NXP
Teilenummer: MPC8245TVV266D ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $44.75 | $447,50 |
| 100 | $39.2 | $3.920,00 |
| 500 | $34.95 | $17.475,00 |
| 1.000 | $31.4 | $31.400,00 |
MPC8245TVV266D Übersicht
An integrated host processor (IHP) is a system-on-chip that merges an application CPU, a peripheral bridge, and a memory controller to reduce board area and component count. In the MPC82xx family hierarchy, the MPC8245 sits between entry-level embedded PowerPC devices and higher-performance MPC8240/MPC8250 parts, targeting cost-sensitive applications where PCI connectivity, performance, and low power must coexist.
Key features include a 266 MHz core speed, a 64-bit system bus (32-bit data path on external memory), 32 KB L1 cache, integrated PCI bus controller supporting PCI 2.2, SDRAM/DDR memory controller, and a power-management unit. The device operates at 3.3 V core with 5 V-tolerant I/O and uses a 0.25 micrometer CMOS process. Operating temperature range spans -40 C to +105 C for industrial environments.
The chip combines the proven PowerPC 603e core (superscalar, out-of-order execution) with an Application-Specific Integrated Logic block to handle I/O and memory. The integrated PCI bridge provides master/target capability and arbitration, eliminating an external bridge chip. The memory controller supports SDRAM, Flash, and ROM with ECC for fault-tolerant operation, while dedicated DMA engines accelerate I/O without CPU intervention.
Typical applications include networking line cards, RAID controllers, industrial control systems, printing and imaging equipment, and PCI-based peripheral cards. The combination of low power and integrated I/O also suits SOHO routers, storage controllers, and telematics platforms.
When designing with this part, careful attention must be paid to the 352-pin TBGA routing - the 35x35 mm footprint requires a multilayer PCB with microvia technology to escape the dense BGA pin field. Decoupling capacitor placement within 100 mils of power pins is essential to maintain signal integrity for the parallel memory bus, especially at full 66 MHz PCI operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes drawn from the NXP datasheet and reference designs, offering engineering context beyond a bare data summary.
Drop-in-Alternativen für MPC8245TVV266D – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8245TVV266D (gleiche Bauform und Footprint) – abweichend in Operating Temperature, PCI Interface, Package, Memory Controller, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8245TVV300D
✅ Drop-In✓ Auf Lager
$60 / Stück
Datenblatt ansehen →MPC8245LZU266D
✅ Drop-In✓ Auf Lager
$52.4 / Stück
Datenblatt ansehen →MPC8245LZU300D
✅ Drop-In✓ Auf Lager
$71.9 / Stück
Datenblatt ansehen →MPC8245TVV266D Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale, Motorola) |
| Part Number | MPC8245TVV266D |
| Core Architecture | PowerPC 603e (32-bit Power Architecture) |
| Core Frequency | 266 MHz |
| Number of Cores | 1 |
| Bus Width | 32-bit (64-bit internal) |
| L1 Cache | 32 KB (unified) |
| Integrated Functions | PCI bridge, memory controller, DMA |
| PCI Interface | PCI 2.2 compliant, 32-bit/64-bit, 33/66 MHz |
| Memory Controller | SDRAM/DDR support with ECC |
| Process Technology | 0.25 um CMOS |
| Core Supply Voltage | 3.3 V |
| I/O Voltage | 3.3 V (5 V tolerant) |
| Betriebstemperatur | -40 C to +105 C (industrial) |
| Gehäuse | 352-pin TBGA (35 mm x 35 mm) |
| Montageart | Surface Mount |
| RoHS-Status | Non-Compliant (legacy Sn/Pb) |
| Status | Obsolete / End of Life |
MPC8245TVV266D 352-pin tbga (35 mm x 35 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8245TVV266D (352-pin tbga (35 mm x 35 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8245TVV266D.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8245TVV266D ist geeignet für 7 Anwendungs: PCI-Based Networking Line Cards, RAID Storage Controllers, Industrial Control Systems, Printing and Imaging Equipment, Telematics and In-Vehicle Computing, SOHO Router and Gateway Designs, Medical Imaging Peripherals.
PCI-Based Networking Line Cards
The integrated PCI 2.2 bridge makes the MPC8245TVV266D ideal for networking line cards that need a host CPU plus PCI connectivity for framer or MAC ASICs. Its 266 MHz PowerPC 603e core delivers enough performance for control-plane forwarding and management, while the integrated bridge eliminates an external PCI chip. Designers route the PCI bus directly to the edge connector and use the memory controller to attach DDR/SDRAM for packet buffers. The 5 V-tolerant I/O simplifies legacy backplane interfacing.
Empfohlen
RAID Storage Controllers
The combination of a 266 MHz PowerPC 603e core, ECC-capable memory controller, and integrated DMA channels suits RAID controller designs. The CPU handles command queuing, parity calculation, and host-side protocols, while DMA engines offload bulk data movement between SATA/SCSI PHYs and system memory. The 5 V-tolerant PCI interface supports legacy RAID HBAs, and ECC on the SDRAM interface protects metadata integrity during rebuild operations.
Empfohlen
Industrial Control Systems
With -40 C to +105 C industrial temperature range and 266 MHz processing headroom, the MPC8245TVV266D is suited for PLC controllers, motion-control boards, and SCADA gateway designs. The PowerPC 603e core runs deterministic VxWorks or Linux real-time firmware, while the PCI bridge provides expansion for motion cards or fieldbus ASICs (Profibus, CAN, EtherCAT). ECC memory improves reliability in factory-floor environments exposed to EMI.
Empfohlen
Printing and Imaging Equipment
The integrated host processor architecture is well-matched to mid-range multifunction printers and imaging controllers, where the PowerPC 603e drives the raster image processor and the PCI bridge connects to scanner ASICs or network interfaces. The low power consumption of the 0.25 um core reduces the printer's thermal envelope, allowing compact enclosures. ECC SDRAM keeps image data integrity intact during high-volume printing jobs.
Empfohlen
Telematics and In-Vehicle Computing
The industrial -40 to +105 C temperature range lets the MPC8245TVV266D operate inside telematics control units where automotive thermal swings are common. The integrated PCI bus supports GPS receivers, cellular modems, and CAN bridge ASICs. ECC memory protects against soft errors in vehicle electrical environments, while the PowerPC 603e core handles routing stacks and diagnostics without needing a separate microcontroller. Lead-free variants may be required for in-vehicle designs.
Empfohlen
SOHO Router and Gateway Designs
The MPC8245TVV266D pairs a 266 MHz CPU with integrated PCI and memory control in a single chip, suiting entry-level SOHO routers and broadband gateways. The PowerPC 603e core runs the routing stack, while the PCI bridge attaches to Wi-Fi mini-PCI cards or DSL modem ASICs. ECC memory keeps routing tables safe from bit flips in always-on deployments, and the low 0.25 um process power draw keeps the SOHO power budget manageable.
Empfohlen
Medical Imaging Peripherals
The PowerPC 603e core with ECC memory and integrated PCI bridge fits ultrasound carts and patient-monitoring peripherals that require deterministic real-time response. The 266 MHz clock handles modest data-acquisition rates, while DMA engines bulk-transfer pixel data to system memory. The industrial temperature range and ECC make the part suitable for clinical environments that demand data-integrity guarantees, although medical designs may require lead-free packaging variants.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8245TVV266D – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8245TVV300D | MPC8245LZU266D | MPC8245LZU300D | MPC8245TZU266D |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 352-pin TBGA (35x35) | 352-pin TBGA (35x35) - same | 352-pin TBGA (35x35) - same footprint family | 352-pin TBGA (35x35) - same | 456-pin TBGA - different |
| Core Frequency | 266 MHz | 300 MHz | 266 MHz | 300 MHz | 266 MHz |
| Core Architecture | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e |
| Integrated PCI Bridge | Yes (PCI 2.2) | Yes (PCI 2.2) | Yes (PCI 2.2) | Yes (PCI 2.2) | Yes (PCI 2.2) |
| Memory Controller | SDRAM with ECC | SDRAM with ECC | SDRAM with ECC | SDRAM with ECC | SDRAM with ECC |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
| Process Technology | 0.25 um CMOS | 0.25 um CMOS | 0.25 um CMOS | 0.25 um CMOS | 0.25 um CMOS |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Unit Price (qty 1, USD) | $48.50 | $52.00-$58.00 | $45.00-$50.00 | $55.00 | $60.00+ |
Wichtigste Unterscheidungsmerkmale
- Highest-speed 352-pin TBGA variant in the 266 MHz grade (vs. MPC8245LZU266D)
- Lower-cost entry into the MPC8245 family at 266 MHz (vs. MPC8245TVV300D)
- 352-ball TBGA footprint matches speed-grade family (vs. MPC8245TZU266D)
- Integrated PCI 2.2 with master/target and arbitration (vs. MPC8248CVRTIEA)
Designhinweise
The 352-pin TBGA package at 35x35 mm requires multilayer PCB with via-in-pad or microvia escape to break out the dense 1.27 mm ball pitch. Use a 6-layer stackup minimum (signal-ground-power-signal-power-signal) and place 0.1 uF decoupling capacitors within 100 mils of every power/ground ball pair. Estimated based on the MPC8245 datasheet package dimension: routing density exceeds 600 escape traces, so blind/buried vias are recommended for first-two layers.
The 0.25 um CMOS process dissipates approximately 1.5-2.0 W at 266 MHz with typical workloads. With a TBGA theta_JA near 18 C/W (estimated for 35x35 mm package on a 4-layer JEDEC board), junction temperature rises 27-36 C above ambient, well within the 105 C industrial limit. For sealed enclosures, however, mount thermal vias directly under the package die shadow and consider a copper spreader for 90 percent loading margins.
The external memory bus runs at half the CPU clock (133 MHz at 266 MHz core) with 64-bit data, producing significant simultaneous switching noise on the address/control bus. Series-terminate all address and control lines to 50 ohms, keep trace lengths matched within +/- 250 mils, and use a continuous ground reference plane beneath the bus. The PCI bus at 66 MHz demands the same termination discipline plus stub-length control below 1.5 inches.
The MPC8245 requires a 3.3 V core rail capable of at least 1.5 A peak during cache-miss bursts. Use a low-dropout regulator with +/- 3 percent tolerance and 50 mV peak-to-peak ripple. The I/O rail can share the core supply if 5 V tolerance is not needed; otherwise, derive the I/O rail separately. Hold the system reset for at least 100 us after all rails reach 90 percent of nominal to allow internal PLL lock.
Because this part is obsolete, do not rely on NXP EOL coupons or RMA paths. Source only from authorized stocking distributors (Rochester Electronics, DigiKey-Franchise) and reject any supplier without a traceable Certificate of Conformance. Verify the lead-finish code against the datasheet; lead-free variants exist for some MPC8245 suffix codes. Confirm 5 V tolerance on PCI pins before driving them from a 5 V slot.
Compliance-Informationen
RoHS non-compliant due to legacy leaded Sn/Pb BGA balls; lead-free variants exist for other suffix codes. Not AEC-Q100 qualified. Reach compliant per NXP environmental documentation. Conflict-minerals compliant per NXP policy.
