MPC8306SVMABDCA - PowerQUICC II Pro MPU, e300, 133MHz | NXP
Teilenummer: MPC8306SVMABDCA ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $25.04 | $25,04 |
| 10 | $22.53 | $225,30 |
| 100 | $20.03 | $2.003,00 |
| 500 | $18.02 | $9.010,00 |
| 1.000 | $17 | $17.000,00 |
MPC8306SVMABDCA Übersicht
A communications MPU (microprocessor unit) is a system-on-chip class device that integrates one or more processor cores with networking peripherals, memory controllers, and connectivity interfaces designed for protocol processing, routing, and embedded control. Within the broader taxonomy, the MPC8306S belongs to the PowerQUICC II Pro lineage of communications processors, which evolved from Freescale's QUICC engine architecture and occupies the niche between microcontrollers and high-end application processors, optimized for wired and industrial communications rather than graphical or compute workloads.
Key features include one e300c3 core running at 133 MHz with 32 KB of instruction cache and 32 KB of data cache, a 16-bit DDR2 memory controller up to 333 MHz data rate, dual 10/100 Ethernet MACs with MII/RMII support, a USB 2.0 Full-Speed interface, dual UART, HDLC/TDM interfaces, and JTAG debug support. Power management is handled through multiple power domains and a low-power standby mode.
Architecturally, the device combines a PowerPC e300c3 scalar core with a dedicated QUICC Engine RISC co-processor that offloads protocol processing for HDLC, TDM, and Ethernet, allowing deterministic throughput independent of CPU load. The 369-ball MAPBGA exposes the DDR2 controller with ECC, PCI Express (where enabled), USB, MII/RMII, UART, and GPIO, and supports industrial-grade temperature operation up to 105C.
Typical applications include industrial routers and gateways, factory automation controllers, DSL and broadband access equipment, networked printers, point-of-sale terminals, and serial-to-Ethernet protocol bridges. The combination of QUICC Engine offload and DDR2 memory makes the part well suited to multi-protocol aggregation where deterministic latency is required.
When designing with this part, note that the MPC8306S is the 'S' subset (without IEEE 1588 v2 time stamping present on the full MPC8306), and power sequencing for the DDR2 rail must follow NXP's reference design to avoid latch-up at cold start. Static I/O voltages are 1.8 V / 2.5 V / 3.3 V tolerant, and the core runs from a separate 1.0 V or 1.2 V supply depending on speed grade.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes that are not consolidated in the manufacturer datasheet, enabling faster component selection for communications and industrial designs.
Drop-in-Alternativen für MPC8306SVMABDCA – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8306SVMABDCA (gleiche Bauform und Footprint) – abweichend in Ethernet, Memory Controller, Operating Temperature, Package, USB.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8306SCVMABDCA
✅ Drop-In✓ Auf Lager
$26.4 / Stück
Datenblatt ansehen →MPC8306CVMABDCA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8306VMABDCA
✅ Drop-In✓ Auf Lager
$16.1 / Stück
Datenblatt ansehen →MPC8306SVMADDCA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8306SVMAGDCA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8306SVMABDCA Grenzwerte & elektrische Eigenschaften
| Core Architecture | PowerPC e300c3 (Power Architecture) |
| Core Count | 1 |
| Datenbusbreite | 32-bit |
| Core Frequency | 133 MHz |
| Memory Controller | DDR2 up to 333 MHz data rate |
| On-chip Cache | 32 KB instruction / 32 KB data |
| Ethernet | Dual 10/100 MAC with MII/RMII |
| USB | USB 2.0 Full-Speed |
| Connectivity | QUICC Engine (HDLC, TDM), 2x UART |
| Gehäuse | 369-MAPBGA (19x19 mm, 0.8 mm pitch) |
| Betriebstemperatur | 0C to +105C |
| Versorgungsspannung | 1.0 V core / 1.8 V, 2.5 V, 3.3 V I/O |
| RoHS-Status | Compliant (lead-free) |
| Lead-Free | Yes |
MPC8306SVMABDCA 369-mapbga (19x19 mm, 0.8 mm pitch) Pinbelegungsleitfaden
Pinbelegung für MPC8306SVMABDCA (369-mapbga (19x19 mm, 0.8 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8306SVMABDCA.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8306SVMABDCA ist geeignet für 7 Anwendungs: Industrial Ethernet Gateways, Multi-Service Routers and Access Equipment, Factory Automation Controllers, Networked Printers and Imaging Devices, Point-of-Sale Terminals, Serial-to-Ethernet Protocol Bridges, Smart Grid and Energy Management Terminals.
Industrial Ethernet Gateways
The MPC8306SVMABDCA fits industrial Ethernet gateways because its dual 10/100 MAC with MII/RMII, QUICC Engine HDLC/TDM offload, and 133 MHz e300c3 core provide deterministic, protocol-aware bridging between legacy fieldbus networks and TCP/IP backbones. The integrated DDR2 controller up to 333 MT/s sustains large routing tables and queues, while the USB Full-Speed and UART peripherals expose diagnostic channels for commissioning and remote management. Operating from 0C to +105C, the part handles indoor cabinet temperatures typical of PLC and SCADA panels. For deterministic multiservice aggregation at line rate, the QUICC Engine offloads HDLC framing from the CPU, freeing cycles for higher-layer routing logic.
Empfohlen
Multi-Service Routers and Access Equipment
Multi-service routers and DSL access equipment benefit from the MPC8306SVMABDCA's combination of dual Ethernet MACs, QUICC Engine TDM aggregation, DDR2 memory bandwidth, and 133 MHz CPU throughput. The device supports legacy T1/E1 TDM links alongside 10/100 Ethernet, enabling hybrid circuit-switched and packet-switched routing in central-office and enterprise edge hardware. PCI Express (or PCI where present in the family) interface allows expansion to multi-port Gigabit uplinks. The Power Architecture e300 core, paired with the QUICC Engine RISC co-processor, gives deterministic QoS behavior for voice and data services over a single platform.
Empfohlen
Factory Automation Controllers
Factory automation controllers use the MPC8306SVMABDCA for its industrial temperature range (0C to +105C), UART/HDLC connectivity to legacy serial field devices, and dual Ethernet for redundant ring topologies. The DDR2 controller supports large program and data buffers for ladder-logic translation or motion controllers. Deterministic behavior under QUICC Engine HDLC offload is critical when bridging Profibus, DeviceNet, or CAN-style protocols over Ethernet. The USB Full-Speed port enables local HMI or programming interfaces, while the PCI bus supports FPGA-based expansion for high-speed analog I/O. Extended lifecycle and NXP's mature Power Architecture toolchain reduce certification risk for IEC 61131 industrial designs.
Empfohlen
Networked Printers and Imaging Devices
Networked printers, multifunction devices, and imaging controllers leverage the MPC8306SVMABDCA for its DDR2 bandwidth (handles large page buffers and image streams), dual Ethernet for concurrent print-server and admin channels, USB 2.0 Full-Speed for host-side connectivity to scanners or storage, and HDLC/TDM for legacy fax or maintenance modems. The 133 MHz e300c3 core runs PostScript/PDF rasterizers and PDL interpreters while the QUICC Engine sustains peripheral DMA streams. Industrial-grade thermal margin suits the warm interior of laser printers. Long-term Power Architecture firmware support reduces churn in mature imaging platforms compared with newer ARM SoCs that break boot interfaces across SDK releases.
Empfohlen
Point-of-Sale Terminals
Point-of-sale terminals benefit from the MPC8306SVMABDCA's mix of UART peripherals for cash drawers and barcode scanners, dual Ethernet for store-LAN and payment-processor uplink, USB Full-Speed for receipt printers and customer displays, and HDLC support for legacy payment-authorization modems. The DDR2 controller accommodates signature and EMV transaction buffers; the e300c3 at 133 MHz runs the secure-payment firmware stack with margin for encryption. Operating from 0C to +105C the part tolerates the warm interior of countertop POS enclosures while the industrial-grade temperature profile supports kiosk and outdoor payment units. Power Architecture stability and long-term NXP BSP support suit the multi-year compliance certifications these terminals require.
Empfohlen
Serial-to-Ethernet Protocol Bridges
Serial-to-Ethernet protocol bridges use the MPC8306SVMABDCA as a compact deterministic converter, mapping legacy UART or HDLC traffic onto TCP/IP via the dual Ethernet MAC while the QUICC Engine handles framing and DMA concurrently with CPU processing. The DDR2 memory allows generous buffer pools for protocol-store-and-forward behavior, and the USB port adds a local management channel. Industrial temperature support enables DIN-rail cabinet deployment, and the e300c3 core retains determinism for transparent serial tunneling with tight latency bounds. The same BOM also extends to SCADA RTUs and remote telemetry units, where multiple serial links are aggregated onto Ethernet without external bridging ASICs.
Empfohlen
Smart Grid and Energy Management Terminals
Smart grid concentrators and energy management terminals benefit from the MPC8306SVMABDCA's HDLC/TDM support (for legacy metering backhaul), dual Ethernet (for utility-LAN and management), DDR2 bandwidth for interval-data tables, and operating temperature to +105C for unenclosed substation cabinets. The e300c3 at 133 MHz runs metering aggregation firmware with margin for encryption and DLMS/COSEM protocol stacks, while the QUICC Engine sustains the parallel metering data flows without CPU contention. Determinism provided by the Power Architecture and QUICC Engine coprocessor is valued in regulatory metering paths that require traceable timing and audit records.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8306SVMABDCA – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8306SCVMABDCA | MPC8306CVMABDCA | MPC8306VMABDCA | MPC8306SVMADDCA | MPC8306SVMAGDCA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 369-MAPBGA (19x19) | 369-MAPBGA (19x19) - same | 369-MAPBGA (19x19) - same | 369-MAPBGA (19x19) - same | 369-MAPBGA (19x19) - same | 369-MAPBGA (19x19) - same |
| Core Architecture | e300c3 | e300c3 | e300c3 | e300c3 | e300c3 | e300c3 |
| Core Frequency | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
| IEEE 1588 v2 | No (S subset) | No (S subset) | Yes | Yes | No (S subset) | No (S subset) |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C |
| Memory Controller | DDR2 up to 333 MHz | DDR2 up to 333 MHz | DDR2 up to 333 MHz | DDR2 up to 333 MHz | DDR2 up to 333 MHz | DDR2 up to 333 MHz |
| Lifecycle Status | Last time buy | Last time buy | Last time buy | Last time buy | Last time buy | Last time buy |
Wichtigste Unterscheidungsmerkmale
- Mature Power Architecture BSP ecosystem (vs. MPC8309)
- Single-package replacement without 1588 (vs. MPC8306CVMABDCA)
- QUICC Engine co-processor offload (vs. Software-only RTOS designs)
Designhinweise
The 369-MAPBGA has higher thermal resistance than plastic QFP packages owing to its small 19x19 mm footprint. Estimated: at 0.8 W typical CPU + peripheral dissipation with no forced airflow, expect a junction-to-ambient rise near 30-40 C. For sealed industrial enclosures operating near 70 C ambient, validate with the NXP thermal model and consider copper pours on both inner and outer PCB layers directly under the die footprint.
The 0.8 mm ball pitch requires microvia or HDI PCB stack-up; standard 4-layer FR4 designs with full vias will not escape adequately under the BGA. Recommended: JEDEC Type 1A or 2A HDI design rules with 0.1 mm laser vias, plus a continuous GND reference plane directly under the BGA. Decoupling uses 100 nF X7R per power pin plus bulk 10 uF near the VDDC ball cluster, following NXP reference schematic. The DDR2 traces must be length-matched within NXP's published tolerance (typically +/- 25 mil).
Reset configuration word (RCW) errors at boot are the most common first-PCB failure mode. The MPC8306S latches its initial boot parameters from external pull-up/pull-down resistors on the LA pins and POR must be held until the system reference clock is stable. Power sequencing must conform to the NXP reference: VDDC must ramp before VDDIO and never collapse during the PLL lock window, or the device will not exit reset. Confirm long-term BSP support with NXP before committing, as the part is in last-time-buy lifecycle as of 2026-10-17.
Compliance-Informationen
RoHS compliance confirmed on NXP product page. AEC-Q100 not applicable for industrial communications MPU. REACH and halogen-free status were not found in the provided web data - mark as unknown.
