MPC8306SCVMABDCA - PowerQUICC II Pro SoC 133MHz | NXP
Teilenummer: MPC8306SCVMABDCA ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $35.2 | $352,00 |
| 100 | $31.75 | $3.175,00 |
| 500 | $28.9 | $14.450,00 |
| 1.000 | $26.4 | $26.400,00 |
MPC8306SCVMABDCA Übersicht
A communications SoC (System-on-Chip) is an integrated circuit that consolidates a processor core, memory controllers, and dedicated communications peripherals onto a single die. The MPC8306SCVMABDCA sits in the hierarchy SoC -> communications processor -> PowerQUICC II Pro -> MPC830x family, where it serves as the ultra low-end node targeting price-sensitive wireline and industrial designs. Its integrated QUICC Engine offloads bit-level protocol processing from the CPU, enabling deterministic throughput for HDLC and TDM traffic.
Key features include a 32-bit PowerPC e300c3 core, 133 MHz operation, DDR2 memory controller, 16-bit local bus, dual 10/100 Ethernet MACs, USB 2.0 (full-speed), HDLC/TDM support via QUICC Engine, IEEE 1588 v2 hardware time-stamping, and an extended -40C to +105C industrial operating temperature range. The 369-PBGA MAP-BGA package exposes the full peripheral set while keeping the PCB footprint compact. Security, boot, and reset features include secure boot, multiple reset sources, and JTAG boundary scan.
The architecture pairs the e300c3 superscalar core with the QUICC Engine block, which contains RISC communication controllers optimized for serial protocol termination. On-chip DDR2 controller supports common industrial memory configurations, while the local bus controller glues to NOR flash, NAND flash, and FPGA/ASIC peripherals. Industrial-grade temperature compliance and a long-life roadmap (when active) make the part suitable for legacy factory automation, telecom edge nodes, and serial concentrator designs.
Typical applications include industrial Ethernet gateways, HDLC/TDM line-card controllers, sub-rack telecom equipment, serial-protocol concentrators, secure embedded routers, and legacy industrial control boards. The combination of QUICC Engine, dual Ethernet, and USB also fits retail/POS terminals that need deterministic serial-channel processing alongside IP connectivity.
When designing with this device, ensure DDR2 trace lengths follow the NXP reference design layout guide and that the QUICC Engine firmware (RISC microcode) is loaded into the designated memory region during boot. Thermal management is straightforward due to the modest 133 MHz clock and industrial-grade silicon.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für MPC8306SCVMABDCA – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8306SCVMABDCA (gleiche Bauform und Footprint) – abweichend in Ethernet, Memory Controller, Operating Temperature, Package, Data Bus Width.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8306CVMABDCA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8306VMABDCA
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$16.1 / Stück
Datenblatt ansehen →MPC8306SCVMADDCA
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8306SVMABDCA
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$17 / Stück
Datenblatt ansehen →MPC8306CVMAJDCA
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8306SCVMABDCA Grenzwerte & elektrische Eigenschaften
| Core | PowerPC e300c3 |
| Architecture | Power Architecture, 32-bit |
| Maximum Core Frequency | 133 MHz |
| Number of Cores | 1 |
| Datenbusbreite | 32 bit |
| Gehäuse | 369-PBGA MAP-BGA (19x19 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +105C (extended) |
| Memory Controller | DDR2 |
| Local Bus | 16-bit |
| Ethernet | Dual 10/100 MAC (R/MII) |
| USB | USB 2.0 Full-Speed |
| Communications Engine | QUICC Engine (HDLC, TDM) |
| Time Synchronization | IEEE 1588 v2 |
| RoHS-Status | Compliant |
MPC8306SCVMABDCA 369-pbga map-bga (19x19 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8306SCVMABDCA (369-pbga map-bga (19x19 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8306SCVMABDCA.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8306SCVMABDCA ist geeignet für 6 Anwendungs: Industrial Ethernet Gateways, Telecom Line-Card Controllers, Serial Protocol Concentrators, Secure Embedded Routers, POS and Retail Terminals, Legacy Industrial Control Boards.
Industrial Ethernet Gateways
The MPC8306SCVMABDCA is well-suited for industrial Ethernet gateway designs that bridge legacy serial fieldbuses to modern IP networks. Its dual 10/100 Ethernet MACs (R/MII) provide redundant uplink and field-network connections, while the integrated QUICC Engine handles HDLC and TDM protocols commonly found in industrial automation. The 133 MHz e300c3 core delivers sufficient processing power for protocol translation, firewall filtering, and basic web management. The extended -40C to +105C temperature range ensures reliable operation in factory-floor cabinets and outdoor enclosures. The 369-PBGA MAP-BGA package allows compact gateway hardware designs, and DDR2 memory support enables buffering of industrial traffic bursts. Compared to switching regulators, the deterministic QUICC Engine offloads bit-level processing from the CPU.
Empfohlen
Telecom Line-Card Controllers
For telecom line-card and sub-rack equipment, the MPC8306SCVMABDCA provides an integrated solution combining PowerPC processing with dedicated serial-channel handling. The QUICC Engine supports HDLC framing and TDM time-slot management, which are essential for legacy T1/E1 and DSLAM line cards. Its IEEE 1588 v2 hardware time-stamping capability enables precise timing distribution across telecom networks. The DDR2 memory controller interfaces with cost-effective commodity memory for packet buffering, and the 16-bit local bus connects to control-plane glue logic and FPGA co-processors. At 133 MHz, the core handles routing tables and management-plane software with predictable latency. The industrial temperature grade ensures operation in thermally constrained central-office environments.
Empfohlen
Serial Protocol Concentrators
Designers building serial protocol concentrators benefit from the MPC8306SCVMABDCA's QUICC Engine, which terminates HDLC and TDM traffic deterministically without burdening the host CPU. This is critical for systems aggregating dozens of serial channels from sensors, controllers, or legacy telecom equipment. The device's 16-bit local bus allows connection to multiple external UARTs or framers, while the dual Ethernet ports aggregate traffic onto IP backhaul. At 133 MHz the e300c3 core runs management, statistics, and protocol-conversion software. The 369-PBGA MAP-BGA footprint supports miniaturized concentrator boards. Extended temperature operation enables deployment in outdoor cabinets and unconditioned industrial spaces.
Empfohlen
Secure Embedded Routers
The MPC8306SCVMABDCA serves as the main processor in secure embedded routers used in branch-office and industrial networking. Its hardware-assisted security features, combined with the QUICC Engine for encrypted serial links, allow secure VPN tunnels and firewall processing. The dual 10/100 Ethernet MACs enable WAN and LAN segmentation, and the USB 2.0 Full-Speed port supports external storage or 3G/4G modems for backup connectivity. The 32-bit e300c3 core at 133 MHz runs embedded Linux with adequate performance for routing tables, NAT, and basic IDS functions. DDR2 memory support allows cost-effective expansion for routing-table storage. The MAP-BGA package keeps the router board compact for DIN-rail mounting.
Empfohlen
POS and Retail Terminals
Retail point-of-sale and kiosk terminals can leverage the MPC8306SCVMABDCA for its combination of Ethernet, USB, and legacy serial support. The QUICC Engine handles payment-terminal serial protocols while the Ethernet MACs connect to store networks for transaction processing. The integrated USB 2.0 port supports peripherals such as barcode scanners, receipt printers, and customer displays. At 133 MHz with DDR2 memory, the core runs embedded Linux for payment applications, inventory lookups, and receipt rendering. The industrial temperature range suits deployments in non-climate-controlled retail back rooms. The compact MAP-BGA footprint enables slim kiosk form factors.
Empfohlen
Legacy Industrial Control Boards
For legacy industrial control boards and PLC communication modules, the MPC8306SCVMABDCA offers a proven Power Architecture platform with long-term availability through authorized aftermarket sources. Its deterministic QUICC Engine handles proprietary serial protocols common in factory automation, while the Ethernet ports enable modern SCADA connectivity. The 16-bit local bus interfaces with industrial I/O expansion, and the DDR2 controller supports standard industrial memory modules. Extended -40C to +105C operation handles harsh factory environments. The 369-PBGA MAP-BGA package is compatible with existing board designs from earlier MPC8306 revisions, simplifying upgrades and replacements in installed machinery.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8306SCVMABDCA – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8306CVMABDCA | MPC8306VMABDCA | MPC8306SCVMADDCA | MPC8306SVMABDCA |
|---|---|---|---|---|---|
| Package | 369-PBGA MAP-BGA (19x19 mm) | 369-PBGA MAP-BGA (19x19 mm) - same | 369-PBGA MAP-BGA (19x19 mm) - same | 369-PBGA MAP-BGA (19x19 mm) - same | 369-PBGA MAP-BGA (19x19 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 (S-variant) |
| Maximum Frequency | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
| Ethernet | Dual 10/100 (R/MII) | Dual 10/100 (R/MII) | Dual 10/100 (R/MII) | Dual 10/100 (R/MII) | Reduced Ethernet |
| QUICC Engine | Yes (HDLC, TDM) | Yes (HDLC, TDM) | Yes (HDLC, TDM) | Yes (HDLC, TDM) | Limited QUICC Engine |
| IEEE 1588 v2 | Yes | Yes | Yes | Yes | No (S-variant) |
Wichtigste Unterscheidungsmerkmale
- Integrated QUICC Engine for HDLC/TDM offload (vs. MPC8306SVMABDCA)
- IEEE 1588 v2 hardware time-stamping (vs. MPC8306SVMABDCA)
- Dual 10/100 Ethernet MACs (vs. MPC8306SVMABDCA)
Designhinweise
The 369-ball MAP-BGA package requires careful PCB layout with microvia or via-in-pad technology for reliable assembly. Follow NXP hardware reference manual guidelines for BGA breakout routing, maintaining controlled impedance for DDR2 signals and Ethernet differential pairs. Decoupling capacitors should be placed as close as possible to power pins with short, wide traces.
The MPC8306SCVMABDCA requires multiple supply rails including core voltage and I/O voltage. Use a power sequencing circuit to ensure proper rail order during startup, preventing latch-up conditions. Bulk decoupling on each rail and high-frequency ceramic decoupling near the IC are essential for stable operation of the e300c3 core and QUICC Engine block.
Do not omit the QUICC Engine firmware (microcode) load during boot; the communications engines will not function without proper initialization. Ensure JTAG boundary scan access is preserved for board-level testing, and verify reset circuit timing meets the NXP datasheet specifications to avoid boot failures in production units.
Compliance-Informationen
RoHS and REACH compliant per NXP product documentation. Not AEC-Q100 qualified - this is an industrial-grade communications processor, not an automotive part. Lead-free packaging confirmed.
