MPC8313ECZQAFFB - 333MHz PowerQUICC II Pro MPU | NXP
Teilenummer: MPC8313ECZQAFFB ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $43.2 | $432,00 |
| 100 | $36.95 | $3.695,00 |
| 250 | $32.1 | $8.025,00 |
| 500 | $28.4 | $14.200,00 |
MPC8313ECZQAFFB Übersicht
A microprocessor (MPU) is a single-chip CPU that integrates core, cache, memory controller and I/O peripherals. The e300c3 core executes the PowerPC instruction set with a 32-Kbyte L1 instruction cache and a 32-Kbyte L1 data cache, and the MPC8313E adds on-chip encryption acceleration - a feature not present on the non-E variant.
Key features of the MPC8313E include a 333 MHz core, a DDR1/DDR2 memory controller, dual 10/100/1000 Ethernet MACs (one RGMII and one SGMII interface selectable), a USB 2.0 (Full/Low Speed) controller, a local bus controller, dual I2C, SPI, dual UART, GPIOs, and a NAND flash controller (FCM). The dedicated security engine accelerates DES, 3DES, AES, and public-key algorithms, offloading cryptographic load from the core.
The architecture combines an e300c3 superscalar core with on-chip accelerated engines and the well-known QUICC Engine subsystem for protocol handling. Multiple power domains (1.0 V core plus selectable 1.8 V / 2.5 V / 3.3 V I/O) reduce total system power, and four GMII-style Ethernet paths support line-rate switching or routing duties at gigabit speeds when used with an external PHY.
Typical applications include secure industrial gateways, networked printers, SOHO routers and VPN access concentrators, NAS controllers, and small-form-factor NAS or print servers. The combined dual GbE + USB 2.0 + NAND support enables a complete wired networking appliance on a single chip.
When designing with this device, allocate the 27x27 mm TE-PBGA footprint with sufficient PCB layers (typically 6-8) for power, ground, and the matched-impedance DDR2 traces. Thermal management relies on the exposed pad soldered to a continuous ground plane; without this, junction-to-ambient resistance rises dramatically and the security accelerator duty cycle must be derated.
This page synthesizes distributor pricing, drop-in alternatives from the same MPC8313 family, and practical design notes not found on a single manufacturer product page.
Drop-in-Alternativen für MPC8313ECZQAFFB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8313ECZQAFFB (gleiche Bauform und Footprint) – abweichend in Memory Controller, USB, Ethernet, Security Engine, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8313EVRAFFB
✅ Drop-In✓ Auf Lager
$42.85 / Stück
Datenblatt ansehen →MPC8313EZQAFFB
✅ Drop-In✓ Auf Lager
$36.9 / Stück
Datenblatt ansehen →MPC8313ECZQAFFB Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors |
| Core | PowerPC e300c3 |
| Processor Series | MPC83xx (PowerQUICC II Pro) |
| Datenbusbreite | 32 bit |
| Maximum Core Frequency | 333 MHz |
| Number of Cores | 1 |
| Instruction Set Architecture | PowerPC |
| Security Engine | Yes (DES / 3DES / AES, public-key acceleration) |
| Ethernet Interfaces | 2x 10/100/1000 (RGMII + SGMII selectable) |
| USB | USB 2.0 Full/Low Speed |
| Memory Controller | DDR1 / DDR2 SDRAM |
| Operating Voltage (Core) | 1.0 V |
| I/O Voltage | 1.8 V / 2.5 V / 3.3 V (selectable) |
| Gehäuse | 516-ball TE-PBGA (27x27 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +105C (extended industrial, per datasheet) |
| RoHS-Status | Not RoHS (per one distributor listing) |
| Encryption Acceleration | Hardware IPsec / SSL assist |
MPC8313ECZQAFFB 516-ball te-pbga (27x27 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8313ECZQAFFB (516-ball te-pbga (27x27 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8313ECZQAFFB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8313ECZQAFFB ist geeignet für 6 Anwendungs: Secure SOHO Router / VPN Gateway, Industrial Secure Gateway / Edge Router, Networked Multifunction Printer Controller, Small NAS / Storage Controller, Wireless Access Point / Controller, Industrial IoT Edge Concentrator.
Secure SOHO Router / VPN Gateway
The MPC8313ECZQAFFB fits secure SOHO router and VPN gateway designs because it combines a 333 MHz PowerPC e300c3 core, hardware DES/3DES/AES IPsec acceleration, and dual Gigabit Ethernet (RGMII plus SGMII) in a single chip. The integrated security engine offloads AES-256 and 3DES from the CPU, sustaining line-rate IPsec tunnels in the 100-300 Mbps range. The DDR2 controller feeds the QUICC Engine for protocol handling, while the optional NAND flash controller (FCM) eliminates an external boot ROM, reducing BOM. Designers route one GbE to the WAN PHY and the second to the LAN switch; the exposed-pad TE-PBGA keeps junction temperature within the 105C industrial limit. Trade-off: the security engine adds quiescent current compared to a non-E MPC8313, so thermally constrained fanless enclosures should still check firmware duty-cycle.
Empfohlen
Industrial Secure Gateway / Edge Router
In industrial edge routers the MPC8313ECZQAFFB pairs the hardware encryption engine with its -40C to +105C junction range to act as a hardened IPsec gateway between factory networks and the cloud. The QUICC Engine handles serial-to-IP conversion alongside Ethernet, offloading Modbus TCP, PROFINET, and other industrial protocols from the e300c3 core. DDR2 with ECC support keeps packet buffers reliable under sustained load. Two GbE ports allow one dedicated MAC to the WAN and one to the LAN switch fabric, while the USB 2.0 controller provisions cellular or Wi-Fi modems. Compared to a soft-CPU router the dedicated crypto engine drops IPsec latency by 30-50% at line rate. Designers must respect the 27x27 mm BGA keep-out and add a heatsink for deployments above 70C ambient.
Empfohlen
Networked Multifunction Printer Controller
Networked multifunction printers (MFPs) need a control processor that can drive the scanner engine, run the user interface, manage the page-description language RIP, and encrypt traffic to the office network - exactly the workload the MPC8313ECZQAFFB was designed for. The 333 MHz e300c3 core handles PCL/PostScript rendering while the security engine keeps TLS sessions off the critical path. Dual GbE ports (one RGMII to the office LAN, one to the scanner sub-system) eliminate an external switch. The local bus controller addresses the engine ASIC and the NAND flash controller (FCM) boots the firmware image from cost-effective NAND. Compared to the smaller MPC8309, the MPC8313E adds the encryption accelerator and the SGMIE GbE option. PCB layout needs 6+ layers to keep DDR2 matched-impedance clean and to manage the 27x27 mm BGA breakout.
Empfohlen
Small NAS / Storage Controller
Entry-level network-attached storage designs use the MPC8313ECZQAFFB as the controller for two-bay or four-bay appliances, leveraging the dual GbE for link aggregation and the local bus plus NAND flash controller for boot and metadata. The e300c3 core runs the file-system stack while the QUICC Engine handles iSCSI or SMB offload. DDR2 with ECC buffers read-modify-write RAID rebuilds without data corruption. The hardware AES engine secures SMB3 and iSCSI CHAP exchanges, which otherwise starve the CPU. Fanless thermal design is feasible if the security engine duty cycle stays below ~50% and the exposed pad is fully soldered. Compared to a software-only NAS on a smaller MPU, the MPC8313E removes the AES bottleneck and supports 100+ MB/s sustained SMB throughput.
Empfohlen
Wireless Access Point / Controller
Mid-range wireless access points and lightweight wireless LAN controllers use the MPC8313ECZQAFFB to terminate 802.11ac/ax AP tunnels, run CAPWAP, and bridge traffic into the wired core via either GbE port. The 333 MHz e300c3 core sustains CAPWAP data-channel encryption when 802.11i (WPA2/WPA3) terminates on the AP ASIC. DDR2 memory allows up to several thousand associated clients' state tables. The security engine accelerates DTLS and 802.1X EAP exchanges during storms of re-association events. Compared to a plain non-E MPC8313, the E variant survives a heavy EAP-TLS handshake storm without dropping frames. Two GbE MACs allow one to face the AP radios and the other to face the core switch. PCB design still requires solid DDR2 routing and a 6+ layer stack.
Empfohlen
Industrial IoT Edge Concentrator
Industrial IoT edge concentrators route Modbus, EtherNet/IP, and PROFINET traffic from a sensor cluster up to a cloud gateway. The MPC8313ECZQAFFB fits this role because the e300c3 core runs a real-time Linux, the QUICC Engine provides the deterministic serial protocols, and the hardware security engine authenticates MQTT-TLS sessions to the cloud without saturating the CPU. DDR2 memory and the local bus connect the radio sub-system or the cellular modem. The extended -40C to +105C junction range covers outdoor enclosure deployments. The exposed-pad TE-PBGA must be soldered to a ground plane for fanless operation. Compare: a soft-CPU core (ARM Cortex-A5) provides lower power per MHz, but the QUICC Engine and hardware crypto make the MPC8313E a stronger fit when determinism and security both matter.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8313ECZQAFFB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8313EVRAFFB | MPC8313EZQAFFB |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-ball TE-PBGA (27x27 mm) | 516-ball TE-PBGA (27x27 mm) - same | 516-ball TE-PBGA (27x27 mm) - same |
| Core | PowerPC e300c3 | PowerPC e300c3 | PowerPC e300c3 |
| Max Core Frequency | 333 MHz | Different speed grade (per suffix) | Different speed grade (per suffix) |
| Security Engine (DES/3DES/AES) | Yes | Yes | No (non-E variant) |
| Ethernet Interfaces | 2x GbE (RGMII + SGMII) | 2x GbE (RGMII + SGMII) | 2x GbE (RGMII + SGMII) |
| USB | USB 2.0 Full/Low Speed | USB 2.0 Full/Low Speed | USB 2.0 Full/Low Speed |
| Memory Controller | DDR1 / DDR2 | DDR1 / DDR2 | DDR1 / DDR2 |
| Core Voltage | 1.0 V | 1.0 V | 1.0 V |
Wichtigste Unterscheidungsmerkmale
- Integrated hardware security engine for IPsec/TLS offload (vs. MPC8313EZQAFFB (non-E variant))
- 333 MHz top speed grade within the MPC8313E family (vs. MPC8313EVRAFFB)
- Dual Gigabit Ethernet (RGMII + SGMII) (vs. Smaller PowerQUICC parts such as MPC8309)
Designhinweise
The 516-ball TE-PBGA package relies on the exposed pad as the primary thermal dissipation path. Solder the exposed pad to a continuous ground plane on the top layer, with thermal vias (typically 0.3 mm drill, 0.5 mm pitch, filled) into the inner ground layers. Estimated: without the exposed pad, theta_JA rises by 30-50% relative to a properly mounted part and the security engine duty cycle must be derated. Place ambient temperature sensors within 5 mm of the package for thermal foldback.
Use a 6+ layer PCB stack-up for the MPC8313ECZQAFFB. Layer 1 carries short breakout traces from the 1 mm pitch BGA; layer 2 is a solid ground plane directly under the BGA; layers 3-5 route matched-impedance DDR2 signals; layer 6 is power. Use 50 ohm single-ended and 100 ohm differential impedance for RGMII/SGMII per the NXP hardware specifications. Series-damping resistors (22-33 ohm) on clock nets reduce overshoot. Placekeeper decoupling on every 2-3 power pins with 100 nF X7R plus bulk 10 uF ceramic per rail.
Common pitfalls include (1) omitting the 32 kHz RTC crystal reference and the 33 MHz system clock jitter requirements - check AN3531 documents for the section on the QUICC Engine clock tree; (2) leaving cfg_reset asserted during boot, which prevents the e300c3 core from starting; (3) failing to strap boot-mode correctly for NAND versus NOR versus I2C boot, which causes 'no console' debug failures on prototypes. Always reference the NXP MPC8313E hardware specifications datasheet for the exact reset and boot strap pin behavior.
Compliance-Informationen
RoHS non-compliant per DigiChip catalog excerpt. AEC-Q100 not applicable - this is an industrial-network MPU, not an automotive-grade part. REACH / halogen / conflict-mineral status not present in supplied data and should be requested directly from NXP.
