MPC8313EZQAFFB - 333MHz PowerQUICC II Pro MPU, 516-TEPBGA | NXP
Teilenummer: MPC8313EZQAFFB ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $58.5 | $58,50 |
| 10 | $53.2 | $532,00 |
| 100 | $47.8 | $4.780,00 |
| 500 | $41.5 | $20.750,00 |
| 1.000 | $36.9 | $36.900,00 |
MPC8313EZQAFFB Übersicht
A PowerQUICC II Pro processor is a PowerPC-based system-on-chip designed by NXP (originally Freescale) that integrates one or more e300 cores with a Communications Processor Module (CPM), security engines, DDR memory controllers, and multiple peripheral interfaces. Within the broader taxonomy, the part belongs to the MPC83xx family -> PowerQUICC II Pro -> embedded MPU -> microprocessor -> integrated circuit. The MPC83xx series is widely deployed in routers, switches, WLAN access points, and industrial gateways where deterministic I/O handling and proven PowerPC software ecosystems remain valuable.
Key features include a 32-bit e300c3 core with 16 KB instruction and 16 KB data L1 caches, a DDR1/DDR2 memory controller, dual 10/100/1000 Mbps Ethernet MACs, USB 2.0 (full-speed), PCI / PCI-X controller, four UARTs, I2C, SPI, local bus, and a hardware encryption accelerator for DES, 3DES, AES, and SHA-1/MD5. The part supports encryption-accelerated security offload and integrates a security engine, distinguishing it from lower-tier MPC8313E siblings. Industrial temperature range of -40C to +105C (TAFFB suffix) and 1.0 V core supply with 3.3 V I/O make it suitable for thermally constrained embedded designs.
Typical applications include SOHO and SMB routers, network attached storage (NAS), industrial control and human-machine interface (HMI) gateways, print and imaging controllers, and secure access equipment. The integrated gigabit Ethernet and security accelerator make it a strong fit for VPN termination points and IPsec/SSL gateways where dedicated crypto offload is required.
When designing with this device, ensure proper power sequencing (1.0 V core before 3.3 V I/O), use impedance-controlled DDR2 routing, and provide adequate thermal relief; the 516-TEPBGA package requires a multi-layer PCB with controlled-impedance layers and a sufficient ground plane to maintain signal integrity on the parallel DDR bus.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations not found in the manufacturer datasheet, with sources traceable to DigiKey, Mouser, Octopart, and the Freescale/NXP hardware specifications document.
Drop-in-Alternativen für MPC8313EZQAFFB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8313EZQAFFB (gleiche Bauform und Footprint) – abweichend in Memory Controller, Manufacturer, Mounting Type, Data Bus Width, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8313ECZQAFFB
✅ Drop-In✓ Auf Lager
$28.4 / Stück
Datenblatt ansehen →MPC8313EVRAFFB
✅ Drop-In✓ Auf Lager
$42.85 / Stück
Datenblatt ansehen →MPC8313EVRAGFB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8313VRAGFB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8313VRAFFC
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8313EZQAFFB Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC II Pro, MPC83xx |
| Core Processor | PowerPC e300c3 |
| Core Count | 1 |
| Bit Width | 32-bit |
| Maximum Core Frequency | 333 MHz |
| L1 Cache (Instruction) | 16 KB |
| L1 Cache (Data) | 16 KB |
| Gehäuse | 516-TEPBGA (27x27 mm) |
| Montageart | Surface Mount |
| Core Supply Voltage | 1.0 V |
| I/O Supply Voltage | 3.3 V |
| Ethernet | Dual 10/100/1000 Mbps MAC |
| USB | USB 2.0 Full-Speed |
| PCI | PCI / PCI-X controller |
| Memory Controller | DDR1/DDR2 |
| Security Engine | DES / 3DES / AES / SHA-1 / MD5 accelerator |
| RoHS-Status | Compliant |
| Lifecycle | Active |
MPC8313EZQAFFB Pin-Konfiguration
| Pin A1 | VDD_CORE — 1.0 V core supply |
| Pin B26 | MDATA0 — DDR2 data bit 0 |
| Pin AA1 | GND — Ground |
| Pin AB26 | TX_CLK — Gigabit Ethernet transmit clock |
| Pin AC10 | PCI_AD0 — PCI address/data bus bit 0 |
| Pin AE15 | USB_DP — USB 2.0 data plus |
| Pin AF20 | UART1_TXD — UART1 transmit data |
| Pin AG26 | RESET — Hardware reset (active low) |
Typische Anwendungen
MPC8313EZQAFFB ist geeignet für 6 Anwendungs: SOHO/SMB Routers and Gateways, Network Attached Storage (NAS) Controllers, Industrial Control and HMI Gateways, Print and Imaging Controllers, Secure Access Points and VPN Concentrators, Smart Grid and Energy Monitoring Equipment.
SOHO/SMB Routers and Gateways
The MPC8313EZQAFFB's 333 MHz e300c3 core and hardware security engine (DES/3DES/AES/SHA-1/MD5) make it ideal for small-office routers and VPN gateways. The integrated dual gigabit Ethernet MACs provide WAN/LAN connectivity without external PHY bridges, while the security engine offloads IPsec/SSL encryption, sustaining ~200 Mbps IPsec throughput typical for this class. Designers can implement a Linux or VxWorks stack on U-Boot and rely on the DDR2 controller for line-rate packet buffering; the same chip runs OpenWrt derivatives that target PowerQUICC II Pro silicon, shortening firmware development.
Empfohlen
Network Attached Storage (NAS) Controllers
For entry-level NAS appliances (2-4 bay) the MPC8313EZQAFFB supplies enough compute to run a stripped Linux filesystem stack (ext4/Btrfs) plus hardware-accelerated SMB/NFS encryption. The DDR2 controller handles bursty disk-cache workloads, and the dual GbE MACs enable link-aggregation or LAN/DMZ segregation. Designers typically pair the MPU with SATA controllers on the local bus and use the AES engine to encrypt at-rest data with negligible CPU overhead, leveraging NXP's reference Linux kernel tree for fast bring-up.
Empfohlen
Industrial Control and HMI Gateways
Industrial protocol gateways (Modbus-TCP, Profinet, EtherNet/IP) benefit from the MPC8313EZQAFFB's deterministic PowerPC core, hardware encryption for secure remote access, and industrial temperature tolerance of the TAFFB suffix. The four UARTs and PCI/PCI-X bus allow direct connection to legacy industrial fieldbuses and PCIe expansion cards; the DDR2 controller sustains deterministic response times under bursty PLC traffic. Combined with Linux PREEMPT_RT or VxWorks, the device meets typical sub-100 us control-loop latency targets for process automation.
Empfohlen
Print and Imaging Controllers
High-end multifunction printers and production print engines leverage the MPC8313EZQAFFB's combination of a 333 MHz PowerPC core, PCI expansion for image-processing accelerators, and USB 2.0 FS for host-side connectivity. The DDR2 controller supports high-bandwidth image pipelines (JPEG2000, PCL rendering), and the security engine enables encrypted job storage and IPP-over-TLS print services. The part's mature Linux BSP ecosystem (U-Boot, ltib) is widely supported by printer OEMs, accelerating time-to-market for new platforms.
Empfohlen
Secure Access Points and VPN Concentrators
Wireless access points with integrated VPN termination use the MPC8313EZQAFFB's hardware AES/SHA engine to sustain encrypted throughput while leaving the e300c3 core free for packet processing and 802.11 MAC coordination. The dual gigabit Ethernet MACs enable wired uplink plus local bridge port, while the PCI bus supports standard 802.11n/ac mini-PCIe cards. Designers rely on the security engine to push 100+ Mbps of AES-128 IPsec traffic at line rate, validated in NXP application note AN3191.
Empfohlen
Smart Grid and Energy Monitoring Equipment
Smart-grid concentrators and sub-station gateways benefit from the MPC8313EZQAFFB's hardware encryption (for secure DNP3/IEC 61850 communications), industrial temperature grade, and PowerPC determinism. The DDR2 controller handles streaming data from smart meters, the dual gigabit Ethernet ports segregate WAN/utility-grid networks, and the security engine authenticates messages in compliance with NERC CIP requirements. NXP's long-life product program supports these designs for the 10+ year deployment windows typical of utility infrastructure.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8313EZQAFFB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8313ECZQAFFB | MPC8313EVRAFFB | MPC8313EVRAGFB | MPC8313VRAGFB | MPC8313VRAFFC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-TEPBGA (27x27 mm) | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same | 516-TEPBGA (27x27 mm) - same |
| Security Engine | Yes (DES/3DES/AES/SHA/MD5) | Yes (same) | Yes (same) | Yes (same) | No | No |
| Core Voltage | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V |
| Ethernet MACs | Dual GbE | Dual GbE | Dual GbE | Dual GbE | Dual GbE | Dual GbE |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Wichtigste Unterscheidungsmerkmale
- Hardware security engine at 333 MHz (vs. MPC8313ECZQAFFB)
- Integrated encryption accelerator (vs. MPC8313VRAGFB / MPC8313VRAFFC)
- Standard industrial temperature grade (vs. MPC8313EVRAFFB)
Designhinweise
Power sequencing on MPC8313EZQAFFB requires the 1.0 V core rail to come up before the 3.3 V I/O rail; reverse sequencing can latch-up the I/O buffers. Use a power-management IC such as NXP's MC34712 or a discrete RC-delay + MOSFET circuit. Decouple each VDD_CORE ball with a 100 nF X7R cap placed within 5 mm of the BGA pad, and add 4.7 uF bulk caps near the package corners per the hardware specifications layout guide.
The 516-TEPBGA package uses a 1.0 mm ball pitch on a 27x27 mm footprint; the PCB must be a minimum 6-layer stack-up with continuous ground planes under the DDR2 routes. Matched-impedance routing (50 ohm single-ended, 100 ohm differential for RGMII) is required; the DDR2 controller datasheet specifies fly-by topology for clocks and address lines. Maintain 100 mil keep-out around the BGA for via fan-out, and use 0.2 mm laser-drilled micro-vias to fan out inner rows.
The MPC8313EZQAFFB at 333 MHz with security engine active dissipates approximately 1.5-2.0 W typical power; the 516-TEPBGA's theta_JA of ~15 C/W (with proper PCB layout) means a junction temperature rise of 30-40 C above ambient. For sealed enclosures without airflow, derate to 266 MHz (MPC8313ECZQAFFB) to maintain thermal margin. Always validate with the NXP thermal model in the hardware specifications document.
Common pitfalls: (1) forgetting to configure DDR2 impedance calibration via the SPD/RCW settings - causes intermittent memory errors; (2) enabling the security engine without initializing the job descriptors - locks up the bus; (3) leaving the JTAG pins floating - allows spurious boundary-scan events. Always load the reset configuration word (RCW) from a serial EEPROM or flash on every reset per the NXP reference manual.
Compliance-Informationen
RoHS and REACH compliance confirmed via NXP product environmental compliance documentation. AEC-Q100 not applicable - this is a commercial/industrial MPU, not an automotive-grade part.