NXP Semiconductors

MPC8313ECZQAFFC - PowerQUICC II Pro 333MHz SoC MPU | NXP

Teilenummer: MPC8313ECZQAFFC ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
0.95 V to 1.05 V Vdss 516-TEPBGA (27x27 mm) Package 333 MHz Speed DDR1/DDR2, up to 256 MB Memory
Ab $21.3 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-16
Mengenpreise
Menge Stückpreis Gesamt
1 $32.28 $32,28
10 $30.67 $306,70
100 $27.44 $2.744,00
500 $24.21 $12.105,00
1.000 $21.3 $21.300,00
ℹ️ Alle Preise sind in USD

MPC8313ECZQAFFC Übersicht

The NXP MPC8313ECZQAFFC is a PowerQUICC II Pro integrated communications processor that combines a PowerPC e300c3 core running at 333 MHz with a 516-TEPBGA (27x27 mm) package. It integrates DDR1/DDR2 memory support, PCI, Gigabit Ethernet, USB 2.0, and a Security Engine (SEC) for embedded networking applications in a single -45 GHz processing device.

What is an MPU (Microprocessor Unit)? An MPU is an integrated circuit that contains a CPU core and integrated peripherals such as memory controllers and communications interfaces. The PowerQUICC family is a hierarchy of Power Architecture SoCs from NXP (formerly Freescale), descended from the original PowerQUICC I and PowerQUICC II communications processors used widely in routers, switches, and industrial gateways. The MPC8313 specifically belongs to the MPC83xx sub-family, integrating more peripherals than its predecessors while keeping the classic PowerQUICC architecture for software reuse.

Key features include a single e300c3 core at 333 MHz, 16 KB I-cache and 16 KB D-cache, integrated DDR1/DDR2 memory controller supporting up to 256 MB, dual 10/100/1000 Ethernet MACs with TCP/IP acceleration, USB 2.0 high-speed host/device, PCI 2.3 interface, and a hardware Security Engine for DES, 3DES, AES, and MD5/SHA-1 hashing. The 0.95 V to 1.05 V core supply and -40C to +105C industrial temperature range suit industrial and rugged environments.

Technical depth: The MPC8313 uses a 90 nm process and replaces an external Northbridge by integrating the DDR controller, three Fast Ethernet controllers, a PCI controller, and the Security Engine. The QUICC Engine multi-protocol block handles TDM, HDLC, and ATM, making the device well-suited for legacy telecom and industrial control applications. The integrated SEC block offloads cryptographic work from the host CPU.

Typical applications include industrial gateways, wireless LAN access points, multi-function printers, network attached storage, and telecom DSL line cards. The integrated GbE switch fabric and Security Engine make it suitable for VPN, IPsec, and SSL/TLS acceleration in routers and firewalls.

When designing with this device, ensure the 0.95-1.05 V core supply is sequenced before the 1.8 V/2.5 V DDR I/O supply, use impedance-controlled PCB traces for DDR and Gigabit Ethernet, and provide adequate decoupling near the BGA balls. Software reuse from the PowerQUICC II Pro family (U-Boot, Linux 2.6, VxWorks BSPs) accelerates development.

This page synthesizes distributor pricing, parametric comparisons, drop-in alternatives, and design considerations not found in the manufacturer datasheet alone.

Drop-in-Alternativen für MPC8313ECZQAFFC – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8313ECZQAFFC (gleiche Bauform und Footprint) – abweichend in Package, Security Engine, Operating Temperature, RoHS Status, USB.

NXP Semiconductors
Package: 516-ball TE-PBGA (27x27 mm)
Security Engine: Yes (DES / 3DES / AES, public-key acceleration)
Operating Temperature: -40C to +105C (extended industrial, per datasheet)
Vergleichen mit MPC8313ECZQAFFC →
NXP Semiconductors
Package: 516-Ball TEBGA (Tape Enhanced BGA)
Security Engine: SEC 3.x (DES/3DES/AES/SHA/RSA)
Operating Temperature: 0 C to +105 C
Vergleichen mit MPC8313ECZQAFFC →
NXP Semiconductors
Package: 516-TEPBGA (27x27 mm) with exposed pad
Security Engine: SEC 2.x (IPsec/SSL acceleration)
Operating Temperature: 0 C to +105 C
Vergleichen mit MPC8313ECZQAFFC →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

MPC8313CVRAFFC

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 516-TEPBGA (27x27)
Same 516-TEPBGA footprint, same e300c3 core, -40C to +105C industrial temp, 333 MHz - identical key ratings

📋 Referenzalternative (nicht im Katalog)

MPC8313EVRAGDA

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 516-TEPBGA (27x27)
Same 516-TEPBGA footprint, e300c3 core, -40C to +105C industrial temp; speed grade differs by family bin

📋 Referenzalternative (nicht im Katalog)

MPC8313ECVRAGDA

✅ Drop-In ⚠️ Spezifikationen ungeprüft
📦 516-TEPBGA (27x27)
Same 516-TEPBGA footprint, RoHS lead-free, e300c3 core; speed grade varies by ordering code

📋 Referenzalternative (nicht im Katalog)

MPC8313ECZQAFFB

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 516-TEPBGA (27x27)
NXP Semiconductors · PowerPC e300c3 · MPC83xx (PowerQUICC II Pro) · 32 bit · 333 MHz · 1 · PowerPC

✓ Auf Lager

$28.4 / Stück

Datenblatt ansehen →

MPC8313EVRAGDC

✅ Drop-In ⚠️ Spezifikationen ungeprüft
NXP Semiconductors
📦 516-TEPBGA (27x27)
PowerQUICC II Pro (MPC83xx) · 32-bit e300 RISC · 400 MHz · 0.95 V to 1.05 V · 2.5 V / 3.3 V · 16 KB · 16 KB · DDR1 / DDR2 with ECC

✓ Auf Lager

$31.5 / Stück

Datenblatt ansehen →

MPC8313ECZQAFFC Grenzwerte & elektrische Eigenschaften

Processor Type PowerPC e300c3
Series PowerQUICC II Pro, MPC83xx
Core Count 1
Bit Width 32-Bit
Clock Speed 333 MHz
Core Voltage 0.95 V to 1.05 V
Betriebstemperatur -40C to +105C
Gehäuse 516-TEPBGA (27x27 mm)
Montageart Surface Mount
Memory Controller DDR1/DDR2, up to 256 MB
L1 Cache 16 KB I-Cache, 16 KB D-Cache
Ethernet 2x 10/100/1000 MAC (Gigabit)
USB USB 2.0 High-Speed (Host/Device)
PCI PCI 2.3
Security Engine SEC (DES/3DES/AES/MD5/SHA-1)
RoHS-Status Compliant

MPC8313ECZQAFFC 516-tepbga (27x27 mm) Pinbelegungsleitfaden

Pinbelegung für MPC8313ECZQAFFC (516-tepbga (27x27 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für MPC8313ECZQAFFC im 516-tepbga (27x27 mm)-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für MPC8313ECZQAFFC.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

MPC8313ECZQAFFC ist geeignet für 7 Anwendungs: Industrial Network Gateway, Wireless LAN Access Point, Multi-Function Printer Controller, Network Attached Storage, Telecom DSL Line Card, VPN / Firewall Appliance, Embedded Industrial Controller.

🏭

Industrial Network Gateway

The MPC8313ECZQAFFC suits industrial network gateways because its dual Gigabit Ethernet MACs with integrated TCP/IP acceleration provide line-rate forwarding for multiple LAN segments, while the QUICC Engine handles serial protocols (TDM/HDLC) for legacy fieldbus interfaces. The hardware Security Engine offloads DES/3DES/AES and SHA-1/MD5 from the e300c3 core, enabling IPsec and SSL/TLS at gigabit rates with the 333 MHz CPU focused on routing and management. Industrial -40C to +105C operation supports deployment in factory cabinets, substation gateways, and outdoor cellular backhaul. The DDR1/DDR2 controller with up to 256 MB accommodates Linux-based routing stacks and OpenWrt firmware.

📱

Wireless LAN Access Point

In WLAN access points the MPC8313ECZQAFFC serves as the host CPU managing the 802.11 MAC/PHY subsystem over PCI, with USB 2.0 high-speed attaching a Bluetooth/Wi-Fi coexistence radio or storage controller. The integrated Gigabit Ethernet provides the wired uplink, and the QUICC Engine supports legacy T1/E1 backhaul for carrier-grade APs. DDR1/DDR2 with up to 256 MB supports OpenWrt, Linux wireless drivers, and CAPWAP/control-plane firmware. The 333 MHz e300c3 core combined with hardware crypto acceleration delivers enterprise-class WPA2-Enterprise throughput without loading the CPU with encryption work.

🖥️

Multi-Function Printer Controller

The MPC8313ECZQAFFC provides the main controller logic for multi-function printers, with PCI attaching image-processor ASICs and Gigabit Ethernet providing gigabit-class print and scan data transfer. USB 2.0 high-speed offers direct-connect PC interfaces for walk-up printing/scanning, and the DDR1/DDR2 controller with up to 256 MB supports large image buffers for high-resolution scanning and RIP processing. The 0.95 V to 1.05 V core supply and industrial -40C to +105C temperature rating suit compact printer chassis with limited airflow. The Security Engine enables secure print release and document confidentiality features.

💾

Network Attached Storage

For entry-level Network Attached Storage, the MPC8313ECZQAFFC combines Gigabit Ethernet throughput and PCI expansion to attach SATA controllers or RAID HBAs, while the DDR1/DDR2 controller with up to 256 MB supports common NAS OS images including custom Linux distributions. The hardware crypto offload enables encrypted volumes (LUKS, SMB3 encryption) at near line-rate without overloading the 333 MHz CPU. USB 2.0 high-speed supports external backup drives. The industrial temperature grade allows fanless NAS chassis designs in office settings.

🌐

Telecom DSL Line Card

In DSL line cards the MPC8313ECZQAFFC's QUICC Engine provides multi-protocol TDM and HDLC channelization for legacy T1/E1 and ADSL backhaul, while the Gigabit Ethernet uplinks aggregate subscriber traffic to the central office switch. The 333 MHz e300c3 core runs the DSLAM control firmware and IGMP/multicast processing, with DDR1/DDR2 up to 256 MB supporting subscriber session tables. The integrated Security Engine accelerates per-subscriber authentication and IPsec tunnels. Industrial -40C to +105C operation supports outdoor DSLAM cabinets with minimal thermal headroom.

🔐

VPN / Firewall Appliance

The MPC8313ECZQAFFC is well suited to small/medium-business VPN and firewall appliances where the integrated Security Engine (DES/3DES/AES, SHA-1/MD5) delivers gigabit IPsec throughput without external crypto ASICs. The dual Gigabit Ethernet MACs provide WAN and LAN interfaces, and the QUICC Engine's multi-protocol block supports legacy serial VPNs over TDM. With DDR1/DDR2 supporting up to 256 MB of rule tables and connection state, the 333 MHz e300c3 core focuses on packet forwarding. Industrial -40C to +105C operation tolerates the confined chassis of branch-office security appliances.

🤖

Embedded Industrial Controller

For embedded industrial controllers the MPC8313ECZQAFFC provides PowerPC e300c3 processing with fieldbus connectivity via the QUICC Engine (TDM/HDLC/ATM), Gigabit Ethernet for SCADA uplinks, and PCI for I/O expansion. The 0.95 V to 1.05 V core supply and industrial -40C to +105C temperature range support factory-floor deployment. DDR1/DDR2 up to 256 MB supports real-time extensions (RT Linux, VxWorks) and complex motion-control algorithms. The Security Engine protects IP for proprietary control protocols and remote firmware updates.

What is the MPC8313ECZQAFFC?
The MPC8313ECZQAFFC is a NXP PowerQUICC II Pro communications processor integrating a PowerPC e300c3 core at 333 MHz with DDR1/DDR2, dual Gigabit Ethernet, USB 2.0, PCI 2.3, and a hardware Security Engine. It ships in a 516-TEPBGA 27x27 mm package and operates from -40C to +105C for industrial and networking applications.
What is the operating voltage of the MPC8313ECZQAFFC?
The MPC8313ECZQAFFC core operates from 0.95 V to 1.05 V. The DDR I/O rail is typically 1.8 V for DDR2 or 2.5 V for DDR1. Power sequencing must follow the NXP datasheet to avoid latch-up; the core supply should rise before or simultaneously with the I/O rail to prevent back-drive.
What is the operating temperature of the MPC8313ECZQAFFC?
The 'C' temperature grade in the part number MPC8313ECZQAFFC denotes the -40C to +105C industrial operating range. This makes it suitable for industrial gateways, outdoor networking equipment, and ruggedized telecom hardware.
How much memory can the MPC8313ECZQAFFC address?
The MPC8313ECZQAFFC integrated DDR1/DDR2 controller supports up to 256 MB of external memory in standard configurations. Designers using stacked or high-density DDR2 devices can typically achieve 128 MB to 256 MB on a single memory bus.
Where can I buy MPC8313ECZQAFFC and what is the price?
The MPC8313ECZQAFFC is currently available at authorized distributors including DigiKey, Mouser, and Zouser, as well as authorized independent distributors. As of 2026-10-16, pricing at distributors including DigiKey is around USD 32.28 for qty 1 and as low as USD 21.30 at qty 1000.
What is the lead time for MPC8313ECZQAFFC?
Lead time for the MPC8313ECZQAFFC at Heisener is listed as 'To be Confirmed' with delivery around Aug 1 to Aug 6. NXP industrial-grade PowerQUICC II Pro devices are typically stocked at authorized distributors with 8-12 week lead times for high-volume orders.
Is MPC8313ECZQAFFC in stock?
Yes, the MPC8313ECZQAFFC is currently in stock at Heisener with 2,112 pieces available, and listed as 'ships today' at DigiKey via Rochester Electronics LLC. NXP also maintains factory-lub for active industrial devices in this family.
What is the difference between MPC8313ECZQAFFC and MPC8313VRAFFC?
The MPC8313ECZQAFFC and MPC8313VRAFFC differ in their temperature grade and silicon revision. The 'C' suffix denotes the -40C to +105C industrial temperature range, while the 'V' suffix denotes an extended or variant grade. Both share the same 516-TEPBGA package and pinout per the NXP MPC8313 family datasheet.
Is MPC8313ECZQAFFC RoHS compliant?
Yes, the MPC8313ECZQAFFC is RoHS compliant per NXP's product declaration. The 'E' character in the part number designates the RoHS-compliant lead-free package option, as documented on NXP's product page.
When should I choose MPC8313ECZQAFFC over MPC8323E?
Choose the MPC8313ECZQAFFC for cost-sensitive, lower-throughput industrial networking and gateway designs where 333 MHz and 256 MB DDR is sufficient. Choose the higher-clocked MPC8323E for designs that need more CPU headroom and additional QUICC Engine TDM/HDLC channels.
What is the best drop-in replacement for MPC8313ECZQAFFC?
The best drop-in replacements within the same MPC8313 family include the MPC8313EVRAGDA and MPC8313CVRAFFC, which share the 516-TEPBGA (27x27 mm) footprint, PowerPC e300c3 core architecture, and integrated peripherals. Pin compatibility is preserved within the MPC8313 family so PCB drop-in is direct.
Where to download the MPC8313ECZQAFFC datasheet PDF?
The official NXP MPC8313EC datasheet is available at https://www.nxp.com/docs/en/data-sheet/MPC8313EC.pdf. For full hardware specifications including errata, the MPC8313 reference manual is published separately at NXP's website.
What can replace the MPC8313ECZQAFFC?
The MPC8313ECZQAFFC can be replaced by other MPC8313 family variants such as MPC8313EVRAGDA, MPC8313CVRAFFC, and MPC8313ECVRAGDA within the same 516-TEPBGA footprint. For new designs, NXP Layerscape LS1012 are ARM Cortex-based successors.
What are the key specifications of MPC8313ECZQAFFC that engineers should know?
The MPC8313ECZQAFFC combines a 333 MHz PowerPC e300c3 core, DDR1/DDR2 memory controller with up to 256 MB support, 2x Gigabit Ethernet MACs, USB 2.0, PCI 2.3, integrated Security Engine (SEC), and QUICC Engine multi-protocol block. The 516-TEPBGA 27x27 mm BGA package is the primary integration constraint.
Is there an NXP equivalent for MPC8313ECZQAFFC?
Yes, the closest NXP equivalents within the same family are the MPC8313EVRAGDA, MPC8313CVRAFFC, and MPC8313ECVRAGDA, all sharing the 516-TEPBGA (27x27 mm) package. These same-brand variants differ mainly in speed grade, temperature grade, and feature configuration.

Technische Referenzdaten für MPC8313ECZQAFFC – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the MPC8313ECZQAFFC for industrial-grade networking and gateway designs requiring a 333 MHz PowerPC e300c3 core with integrated Gigabit Ethernet, USB 2.0, PCI, DDR1/DDR2 controller, and hardware Security Engine. It is the right fit when cost is sensitive, software reuse from PowerQUICC II Pro U-Boot/Linux/VxWorks is required, and 256 MB DDR suffices. For designs needing more CPU headroom, consider MPC8323E or MPC8349E. For new designs starting from scratch, evaluate NXP Layerscape LS1012 ARM-based SoCs as the modern replacement, but expect significant software porting. Within the MPC8313 family, prefer MPC8313ECZQAFFC for the RoHS-compliant industrial grade and verified supply availability at major distributors.

Vergleich mit Alternativen

Parameter Dieses Produkt MPC8313CVRAFFC MPC8313EVRAGDA MPC8313ECVRAGDA MPC8313ECZQAFFB MPC8313EVRAGDC
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 516-TEPBGA (27x27 mm) 516-TEPBGA (27x27 mm) 516-TEPBGA (27x27 mm) 516-TEPBGA (27x27 mm) 516-TEPBGA (27x27 mm) 516-TEPBGA (27x27 mm)
Core PowerPC e300c3 PowerPC e300c3 PowerPC e300c3 PowerPC e300c3 PowerPC e300c3 PowerPC e300c3
Operating Temperature -40C to +105C -40C to +105C -40C to +105C -40C to +105C -40C to +105C -40C to +105C
Core Voltage 0.95 V to 1.05 V 0.95 V to 1.05 V 0.95 V to 1.05 V 0.95 V to 1.05 V 0.95 V to 1.05 V 0.95 V to 1.05 V
Memory Controller DDR1/DDR2 up to 256 MB DDR1/DDR2 up to 256 MB DDR1/DDR2 up to 256 MB DDR1/DDR2 up to 256 MB DDR1/DDR2 up to 256 MB DDR1/DDR2 up to 256 MB
Security Engine SEC (DES/3DES/AES/MD5/SHA-1) SEC (DES/3DES/AES/MD5/SHA-1) SEC (DES/3DES/AES/MD5/SHA-1) SEC (DES/3DES/AES/MD5/SHA-1) SEC (DES/3DES/AES/MD5/SHA-1) SEC (DES/3DES/AES/MD5/SHA-1)
RoHS Compliant Compliant Compliant Compliant Compliant Compliant

Wichtigste Unterscheidungsmerkmale

  • Integrated Security Engine offloads AES/SHA from CPU (vs. MPC8323E)
  • Lowest-cost PowerQUICC II Pro with integrated SEC (vs. MPC8349E)
  • Wide -40C to +105C industrial temperature (vs. MPC8313EVRAGDA)

Designhinweise

Power sequencing: the MPC8313ECZQAFFC requires the core supply (0.95-1.05 V) to ramp before or simultaneously with the DDR I/O (1.8 V DDR2 or 2.5 V DDR1). Reverse sequencing can forward-bias internal ESD diodes and damage the device. Use the NXP-recommended ordering with a common NXP/MPC83xx power sequencer IC or discrete FET circuits. Estimated: each rail should ramp within 100 ms with monotonic edges; total inrush is dominated by DDR bulk capacitors.

BGA layout: the 516-TEPBGA 27x27 mm package uses 1.27 mm or 1.0 mm ball pitch (verify exact pitch from NXP package drawing). Use microvia-in-pad or dog-bone fanout to break out the inner balls. Match trace lengths within 100 mils for DDR signals and follow the NXP MPC8313EC hardware design checklist for DDR termination (typically VTT at half VDDQ via NXP DDR termination regulator).

The MPC8313ECZQAFFC's power consumption depends on CPU load, DDR activity, and peripheral enable states. Estimated: at 333 MHz full CPU load and active Gigabit Ethernet, total power is approximately 2.5-3.5 W. The TEPBGA package relies on PCB copper for heat dissipation; design 4-6 inner ground planes stitched with thermal vias under the die to keep junction temperature below 105C at industrial operating temperatures.

Do not omit the 32.768 kHz RTC reference or the 66 MHz system clock source - these are required for the integrated security engine and DDR PLL lock. Ensure JTAG pins are accessible for boundary-scan and code development; route them to a 14-pin header per NXP's standard. Verify PCIe/PCI clock reference frequency matches the chosen mode (33 MHz vs 66 MHz) in the reset configuration words.

Gigabit Ethernet MACs require impedance-controlled PCB traces (100 ohm differential for GMII/RGMII, 50 ohm single-ended for MII). Place the magnetics within 25 mm of the PHY RJ-45 connector and route MII traces length-matched to within 50 mils to minimize skew. Use the integrated GMII rather than external MII where possible to reduce pin count and BOM cost.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS compliant per NXP product page; 'E' character in MPN designates lead-free RoHS package option. Not AEC-Q100 qualified (industrial temp grade, not automotive).

Daten verifiziert am: 2026-10-16 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

NXP Semiconductors MPC8313ECZQAFFC MPC8313CVRAFFC MPC8313EVRAGDA MPC8313ECVRAGDA MPC8313ECZQAFFB MPC8313EVRAGDC PowerQUICC II Pro MPC83xx PowerPC e300c3 MPU microprocessor System-on-Chip TEPBGA-516 BGA package DDR1 DDR2 Gigabit Ethernet USB 2.0 PCI 2.3 Security Engine (SEC) QUICC Engine AES 3DES SHA-1 RoHS industrial temperature grade
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