MPC8358EVVAGDGA - PowerQUICC II Pro MPU 400MHz TBGA-740 | NXP
Teilenummer: MPC8358EVVAGDGA ✗ AbgekündigtMPC8358EVVAGDGA Übersicht
A microprocessor (MPU) is a single-chip CPU that integrates the arithmetic logic unit, registers, cache, and bus interfaces onto one die, forming the computational heart of an embedded system. The PowerQUICC II Pro family extends the classic PowerQUICC II architecture with the e300 core (a PowerPC 603e-derived design), a system interface unit (SIU), and a communications processor module (CPM) that offloads networking tasks from the main CPU. This hierarchy places the MPC8358E within the broader class of integrated communications processors used in wired networking and access equipment, and ultimately within the embedded microprocessor segment of the semiconductor taxonomy.
Key features include 400 MHz e300 core, integrated DDR1/DDR2 SDRAM controller with ECC, dual 10/100/1000 Mbps Ethernet MACs, USB 2.0 full-speed device/host, PCI 2.2 interface, two UTOPIA/Packet engines for ATM, TDM support for voice, hardware-accelerated SEC for IPSec and SSL, and integrated PHYs. The device is manufactured in 0.13 µm CMOS and supports JTAG boundary-scan for production test. Power management includes doze, nap, and sleep modes.
The architecture pairs a host e300 CPU with the QUICC Engine communications module, enabling simultaneous wire-speed packet processing and control-plane execution. The integrated SEC block accelerates DES/3DES/AES/SHA algorithms at gigabit rates, allowing VPN and SSL termination without external crypto silicon. The 740-pin TBGA package supports high-speed parallel interfaces while exposing dedicated DDR, PCI, and gigabit Ethernet signal groups for straightforward four-layer PCB layout.
Typical applications include small-to-medium enterprise routers, low-end DSLAM line cards, IP private branch exchange (PBX) systems, industrial gateways, and secured broadband access equipment. The combination of gigabit Ethernet, ATM, and hardware crypto makes the MPC8358E especially suited to integrated access devices and secure VPN gateways operating at wire speed.
When designing with this part, plan thermal headroom for the 740-pin TBGA at sustained 400 MHz operation; provide at least four PCB layers with a continuous ground plane beneath the package, and follow NXP AN-2806 routing guidelines for DDR2 trace matching. Use NXP CodeWarrior Development Studio and the LTIB (Linux Target Image Builder) toolchain to bring up U-Boot and Linux SMP environments.
This page synthesizes distributor pricing, lifecycle status, and drop-in pin-compatible alternatives not consolidated in the manufacturer datasheet, giving engineers and procurement teams a single source for selection and second-sourcing decisions.
Drop-in-Alternativen für MPC8358EVVAGDGA – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8358EVVAGDGA (gleiche Bauform und Footprint) – abweichend in USB, Architecture, Ethernet, Lead-Free / RoHS, Mounting Type.
MPC8358EVVAGDGA
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →MPC8360EVVAGDGA
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →MPC8358CVVAGDGA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8358EVVAGDGA Grenzwerte & elektrische Eigenschaften
| Architecture | RISC (PowerPC e300) |
| Datenbusbreite | 32-Bit |
| Core Frequency | 400 MHz |
| Number of Cores | 1 |
| Core Process Technology | 0.13 µm CMOS |
| Core Supply Voltage | 1.2 V |
| I/O Supply Voltage | 1.8 V / 2.5 V / 3.3 V |
| Package Type | TBGA-740 |
| Package Dimensions | 37.5 x 37.5 mm, 1.46 mm height |
| Ball Pitch | 1.0 mm |
| Pin-Anzahl | 740 |
| Betriebstemperatur | 0 °C to +105 °C |
| Integrated Memory Controller | DDR1 / DDR2 SDRAM with ECC |
| Ethernet Interfaces | Gigabit (10/100/1000 Mbps) |
| USB | USB 2.0 FS device/host |
| PCI | PCI 2.2 |
| Security Engine | SEC (DES/3DES/AES/SHA) |
| Lead-Free / RoHS | Lead-free (per part suffix 'G'); RoHS compliance status unknown in provided data |
MPC8358EVVAGDGA 37.5 x 37.5 mm, 1.46 mm height Pinbelegungsleitfaden
Pinbelegung für MPC8358EVVAGDGA (37.5 x 37.5 mm, 1.46 mm height-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8358EVVAGDGA.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8358EVVAGDGA ist geeignet für 6 Anwendungs: Small-to-Medium Enterprise Router, DSLAM Line Card Controller, IP-PBX and VoIP Gateway, Industrial Secure Gateway, Wireless LAN / Wi-Fi Access Controller, Secure VPN Concentrator.
Small-to-Medium Enterprise Router
The MPC8358EVVAGDGA targets SME routers with its 400 MHz e300 core, dual Gigabit Ethernet MACs, and hardware-accelerated SEC block that performs IPSec and SSL termination at wire speed. The QUICC Engine offloads TCP/IP, NAT, QoS, and packet filtering from the host CPU, allowing concurrent routing, firewalling, and VPN services without throughput degradation. The integrated DDR1/DDR2 controller with ECC supports the large route and connection tables required by enterprise gateways.
Empfohlen
DSLAM Line Card Controller
In low-end DSLAM line cards, the MPC8358EVVAGDGA aggregates subscriber traffic through its Gigabit Ethernet uplink while terminating ATM via the integrated UTOPIA/Packet engines. The QUICC Engine handles AAL2/AAL5 SAR, PPPoA, and PPPoE termination at wire speed, and the e300 core runs control-plane software such as VxWorks or Linux for subscriber management. The 740-pin TBGA exposes sufficient GPIO and bus bandwidth for backplane glue logic interfacing.
Empfohlen
IP-PBX and VoIP Gateway
The MPC8358EVVAGDGA's integrated TDM interface and QUICC Engine make it well suited for IP-PBX and VoIP gateway platforms bridging PSTN T1/E1 circuits to SIP trunks. The e300 core runs Asterisk or commercial PBX software, while the communications processor module handles signaling, RTP stream handling, and echo cancellation offload. Hardware encryption via the SEC block secures SIP/TLS and SRTP media without taxing the host CPU.
Empfohlen
Industrial Secure Gateway
For industrial gateways bridging OT networks to the cloud, the MPC8358EVVAGDGA delivers the dual Gigabit Ethernet, hardware IPSec/SSL acceleration, and 0 to 105 C temperature range needed for plant-floor deployment. The QUICC Engine handles Modbus/TCP, DNP3, and IEC 61850 protocol conversion while the e300 core executes firewall and remote-access VPN software. The lead-free TBGA package withstands industrial assembly reflow profiles.
Empfohlen
Wireless LAN / Wi-Fi Access Controller
In enterprise Wi-Fi controllers aggregating multiple 802.11 access points, the MPC8358EVVAGDGA provides Gigabit Ethernet trunking, IPSec-secured CAPWAP tunnels via its SEC block, and sufficient CPU headroom for mobility, QoS, and RADIUS processing. The DDR2 controller supports large subscriber tables, while the QUICC Engine accelerates CAPWAP, GRE, and 802.1X encapsulation at line rate across multiple aggregated APs.
Empfohlen
Secure VPN Concentrator
The MPC8358EVVAGDGA's hardware-accelerated SEC block accelerates DES, 3DES, AES, and SHA algorithms at gigabit rates, enabling VPN concentrators to terminate hundreds of IPSec tunnels without CPU saturation. The QUICC Engine manages tunnel encapsulation, anti-replay windows, and key refresh, while the e300 core runs policy and IKE negotiation. The 740-pin TBGA provides the GPIO and bus bandwidth required by multi-port crypto accelerator line cards.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8358EVVAGDGA – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8360EVVAGDGA | MPC8358CVVAGDGA |
|---|---|---|---|
| Package | TBGA-740 (37.5x37.5 mm) | TBGA-740 (37.5x37.5 mm) - same | TBGA-740 (37.5x37.5 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e300 (32-bit) | PowerPC e300 (32-bit) | PowerPC e300 (32-bit) |
| Core Frequency | 400 MHz | 400 MHz | 400 MHz |
| Hardware Security Engine (SEC) | Yes (DES/3DES/AES/SHA) | Yes (enhanced SEC) | No (non-encryption variant) |
| DDR Memory Controller | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Gigabit Ethernet MACs | 2 x 10/100/1000 Mbps | 2 x 10/100/1000 Mbps | 2 x 10/100/1000 Mbps |
| Operating Temperature | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C |
| Pin/Pin Compatibility | Reference | Drop-in compatible | Drop-in compatible |
Wichtigste Unterscheidungsmerkmale
- Pin-compatible richer-feature upgrade path (vs. MPC8358CVVAGDGA)
- End-of-Life awareness for second-sourcing (vs. MPC8360EVVAGDGA)
- Integrated QUICC Engine offload (vs. MPC8358CVVAGDGA)
Designhinweise
The 740-ball TBGA at 1.0 mm pitch requires a minimum four-layer PCB with a continuous ground plane directly beneath the BGA for power integrity and DDR2 reference-plane return. Matched 50 Ω trace impedance is required for the DDR2 address/command and clock groups. Follow NXP application note AN-2806 for BGA breakout via-in-pad or dog-bone fanout, and use microvia stack-ups on high-speed signal layers.
Estimated: at full 400 MHz operation, junction-to-ambient thermal resistance for the TBGA-740 is approximately 15-20 C/W on a standard 4-layer JEDEC test board. Designers should verify θJA from the NXP hardware specifications document and provide adequate copper spreading on inner and outer layers. Forced-air cooling or a heatsink is recommended for sustained operation at +105 °C ambient.
DDR2 data and strobe groups require ±25 ps trace-length matching within byte lanes and ±50 ps between byte lanes; route DQS differential pairs with 100 Ω differential impedance. The Gigabit Ethernet GMII/RGMII signals should be length-matched to within 50 mil and routed away from the DDR bus to minimize crosstalk. Use series-termination resistors on RGMII source-synchronous clocks per NXP reference schematics.
Do not confuse the MPC8358E (with SEC) with the MPC8358C (without SEC) - both share the TBGA-740 footprint but the 'C' variant lacks the encryption engine. Boot configuration words sampled at POR determine the boot source and must match the JTAG/COP debug port settings. Ensure the 1.2 V core supply ramps before the 1.8/2.5/3.3 V I/O rails to avoid I/O latch-up at power-up.
Compliance-Informationen
Lead-free indicated by 'G' in part suffix per NXP part-numbering convention; full RoHS/REACH compliance documentation should be requested directly from NXP. AEC-Q100 not applicable for this communications processor class.
