MPC8358EVVAGDGA vs MPC8360EVVAGDGA Vergleich
Detaillierter Direktvergleich von MPC8358EVVAGDGA von NXP Semiconductors und MPC8360EVVAGDGA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8358EVVAGDGA - PowerQUICC II Pro MPU 400MHz TBGA-740 | NXP
MPC8358EVVAGDGA ✗ AbgekündigtNXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC8358EVVAGDGA | MPC8360EVVAGDGA |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Letzte Kaufgelegenheit |
| Architecture | RISC (PowerPC e300) | — |
| Datenbusbreite | 32-Bit | 32-bit |
| Core Frequency | 400 MHz | — |
| Number of Cores | 1 | 1 |
| Core Process Technology | 0.13 µm CMOS | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Supply Voltage | 1.8 V / 2.5 V / 3.3 V | — |
| Package Type | TBGA-740 | — |
| Package Dimensions | 37.5 x 37.5 mm, 1.46 mm height | — |
| Ball Pitch | 1.0 mm | — |
| Pin-Anzahl | 740 | — |
| Betriebstemperatur | 0 °C to +105 °C | — |
| Integrated Memory Controller | DDR1 / DDR2 SDRAM with ECC | — |
| Ethernet Interfaces | Gigabit (10/100/1000 Mbps) | — |
| USB | USB 2.0 FS device/host | USB 2.0 |
| PCI | PCI 2.2 | — |
| Security Engine | SEC (DES/3DES/AES/SHA) | SEC (IPSEC/SSL/SRNG) |
| Lead-Free / RoHS | Lead-free (per part suffix 'G'); RoHS compliance status unknown in provided data | — |
| Core | — | Power Architecture e300 (enhanced MPC603e) |
| Maximale Taktfrequenz | — | 400 MHz |
| Operating Core Voltage | — | 1.2 V |
| I/O Voltage | — | 3.3 V |
| Memory Controller | — | DDR1/DDR2 SDRAM with ECC |
| PCI Interface | — | PCI 2.2 (32-bit, 66 MHz) / PCI-X |
| Ethernet | — | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) |
| TDM / H.110 | — | Yes |
| ATM Support | — | Yes (ATM SAR, AAL) |
| Betriebstemperaturbereich | — | 0C to +105C (TA) |
| Gehäuse | — | 740-TBGA (37.5 x 37.5 mm) |
| RoHS-Status | — | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] |
| Lead-Free | — | Yes (per distributor listing, Mouser 'NO-PB' coding) |
| Series | — | PowerQUICC II Pro (MPC8360E family) |
| Revision | — | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced |
| Montageart | — | Surface Mount (TBGA ball grid) |
| Packaging | — | Tray |
| ECCN | — | 5A002.a.1 |