MPC8378EVRAJFA557 - 533MHz PowerQUICC II Pro MPU | NXP | 689-TEPBGA
Teilenummer: MPC8378EVRAJFA557 ✓ AktivMPC8378EVRAJFA557 Übersicht
An MPU (Microprocessor Unit) such as the MPC8378E combines a CPU core, integrated peripherals, and external memory/interconnect controllers on a single die. The MPC8378E sits within the PowerQUICC family of communications processors, which are descended from NXP's (formerly Freescale) Power Architecture line and remain widely deployed in long-life industrial and networking equipment.
Key features include a single-core 32-bit e300c4s processor with 32 KB L1 instruction and 32 KB L1 data caches, 533 MHz core frequency, a DDR1/DDR2 SDRAM controller with ECC, two PCI/PCIe controllers, three 10/100/1000 Ethernet MACs (one supporting Gigabit), two USB 2.0 controllers (host + device), two SATA controllers, and a security engine supporting DES, 3DES, AES, SHA, RSA, and elliptic-curve algorithms.
Typical applications include enterprise wired networking routers and switches, integrated access devices, industrial gateways, networked storage (NAS/SAN), and secure VPN/UTM appliances. The integrated SEC off-loads cryptographic workloads from the host CPU, making the part well suited to IPsec and SSL/TLS termination.
When designing with the MPC8378E, ensure the power-sequencing and thermal budgets account for the 31x31 mm TEPBGA II package. The device operates from 0 to 105 °C, suitable for industrial enclosures with controlled airflow. Use NXP's U-Boot and Linux BSP as the baseline firmware reference.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for engineers evaluating the MPC8378EVRAJFA557 versus competing PowerQUICC II Pro or PowerQUICC III options.
Drop-in-Alternativen für MPC8378EVRAJFA557 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8378EVRAJFA557 (gleiche Bauform und Footprint) – abweichend in Family, Mounting Type, Package, Security Engine.
MPC8377EVRAJFA
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →MPC8379EVRAJFA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8378EVRAHFA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8378ECRAJFA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1020NSE2DFB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8378EVRAJFA557 Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Core Architecture | Power Architecture e300c4s |
| Core Count | 1 |
| Datenbusbreite | 32-bit |
| Maximum Core Frequency | 533 MHz |
| Family | PowerQUICC II Pro (MPC83xx) |
| Gehäuse | 689-TEPBGA II (31x31 mm) |
| Memory Interface | DDR1/DDR2 SDRAM with ECC |
| Ethernet | 1x Gigabit + 2x 10/100/1000 MACs |
| PCI / PCIe | PCI and PCIe controllers |
| USB | 2x USB 2.0 (Host + Device) |
| SATA | 2x SATA controllers |
| Security Engine | SEC (DES/3DES/AES/SHA/RSA/ECC) |
| Betriebstemperatur | 0 °C to +105 °C |
| Montageart | Surface Mount (BGA) |
MPC8378EVRAJFA557 689-tepbga ii (31x31 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8378EVRAJFA557 (689-tepbga ii (31x31 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8378EVRAJFA557.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8378EVRAJFA557 ist geeignet für 6 Anwendungs: Enterprise Wired Routers and Switches, Network Attached Storage (NAS) and SAN Controllers, Industrial Gateways and Protocol Converters, VPN / UTM / SSL Appliances, Integrated Access Devices and Customer Premises Equipment, Industrial Imaging and Video Surveillance Controllers.
Enterprise Wired Routers and Switches
The MPC8378EVRAJFA557's 533 MHz e300c4s core, three 10/100/1000 Ethernet MACs, and integrated SEC engine make it ideal for mid-range enterprise routers and managed switches. The DDR1/DDR2 controller with ECC handles routing tables and forwarding databases reliably, while the hardware SEC off-loads IPsec and SSL/TLS termination, freeing CPU cycles for QoS, ACL processing, and routing-protocol stacks (OSPF, BGP). The 689-TEPBGA II package supports industrial 0 to +105 °C operation, suiting 1U/2U rackmount chassis with controlled airflow. Designers benefit from NXP's mature U-Boot and Linux BSP, reducing time-to-market for Layer 3 switching platforms.
Empfohlen
Network Attached Storage (NAS) and SAN Controllers
The MPC8378EVRAJFA557 integrates two SATA controllers plus three Gigabit Ethernet MACs, providing a compact single-chip controller for entry-level NAS and iSCSI SAN appliances. The 533 MHz core and DDR2 controller handle file-system metadata and SMB/NFS overhead, while the SEC engine accelerates encrypted-storage workflows (AES-XTS). The 689-TEPBGA II package keeps the bill of materials small — a single BGA plus DRAM, PHYs, and SATA devices implements a full multi-drive storage controller. Industrial-grade parts support 0 to +105 °C enclosures used in small-business RAID arrays.
Empfohlen
Industrial Gateways and Protocol Converters
The MPC8378EVRAJFA557 is widely deployed in industrial gateways that bridge serial fieldbuses, Ethernet, and IP networks. Its PCI/PCIe interfaces support additional industrial cards, while three Ethernet MACs enable multi-segment routing for substation automation, factory networking, and SCADA systems. The 533 MHz e300c4s core runs real-time Linux or VxWorks for protocol stacks such as Modbus TCP, PROFINET, EtherNet/IP, and DNP3. The 0 to +105 °C temperature range covers industrial control cabinets, and the mature NXP BSP accelerates IEC 61850 and OPC-UA integration.
Empfohlen
VPN / UTM / SSL Appliances
The integrated SEC engine of the MPC8378EVRAJFA557 accelerates AES, 3DES, SHA-1/256, RSA, and ECC cryptographic operations, making the part a strong foundation for branch-office VPN and UTM security appliances. At 533 MHz, the e300c4s core can sustain hundreds of Mbps of IPsec throughput with hardware off-load, while the three Gigabit MACs handle WAN, LAN, and DMZ segments. The DDR2 controller with ECC ensures memory integrity for stateful firewall tables and cryptographic keys. The 689-TEPBGA II package enables fanless thermal designs in compact branch-office form factors.
Empfohlen
Integrated Access Devices and Customer Premises Equipment
Telecommunications integrated access devices (IADs) and CPE platforms use the MPC8378EVRAJFA557 to consolidate voice, data, and wireless back-haul on a single processor. Its PCI/PCIe, USB 2.0 (host + device), and SATA interfaces simplify connectivity to DSL/PON transceivers, Wi-Fi cards, and external storage. The hardware SEC block secures VoIP media (SRTP) and management interfaces (HTTPS, SSH). The 533 MHz Power Architecture core runs carrier-grade Linux for TR-069 and QoS policy enforcement. The industrial temperature grade is suitable for outdoor enclosures used in fiber-to-the-home (FTTH) CPE.
Empfohlen
Industrial Imaging and Video Surveillance Controllers
The MPC8378EVRAJFA557 can act as a controller for networked video surveillance recorders, leveraging its SATA interfaces for multi-drive storage and Gigabit Ethernet for IP-camera aggregation. The e300c4s core at 533 MHz handles MJPEG/H.264 stream recording, motion-detection analytics, and RAID management. The hardware SEC block encrypts recorded footage at rest (AES-XTS) and secures remote viewing streams. The 689-TEPBGA II package and 0 to +105 °C temperature range suit industrial NVR enclosures deployed in factories, transit hubs, and city surveillance networks.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8378EVRAJFA557 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8377EVRAJFA | MPC8379EVRAJFA | MPC8378EVRAHFA | MPC8378ECRAJFA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Core Architecture | Power Architecture e300c4s | Power Architecture e300c4s | Power Architecture e300c4s | Power Architecture e300c4s | Power Architecture e300c4s |
| Maximum Core Frequency | 533 MHz | 533 MHz | 667 MHz (typical) | 533 MHz | 533 MHz |
| Memory Interface | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Security Engine (SEC) | Yes (DES/3DES/AES/SHA/RSA/ECC) | Limited / disabled on cost-reduced SKUs | Yes | Yes | Yes |
| Gigabit Ethernet MACs | 1x GbE + 2x 10/100/1000 | Reduced MAC count | 1x GbE + 2x 10/100/1000 | 1x GbE + 2x 10/100/1000 | 1x GbE + 2x 10/100/1000 |
| SATA Controllers | 2x SATA | Reduced / fewer SATA | 2x SATA | 2x SATA | 2x SATA |
| Operating Temperature | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | Extended temperature grade | 0 °C to +105 °C |
Wichtigste Unterscheidungsmerkmale
- Hardware Security Engine (SEC) on-chip (vs. MPC8377EVRAJFA)
- Pin-compatible upgrade to higher-frequency sibling (vs. MPC8379EVRAJFA)
- Industrial-grade 0 to +105 °C operation (vs. MPC8378EVRAHFA (extended temp))
- Mature Linux and U-Boot BSP (vs. Freescale legacy MPC8360E)
Designhinweise
The 689-TEPBGA II (31x31 mm) package requires careful PCB thermal design because the large body concentrates heat at the die. Estimated: at 533 MHz full load the part dissipates roughly 5-8 W typical. Place thermal vias in a 4x4 array under the exposed die region and use a minimum 6-layer stack-up with continuous inner ground/power planes. A 200-300 LFM airflow is recommended for sealed industrial enclosures. Junction-to-ambient thermal resistance values must be derived from NXP's thermal models for the specific PCB layout.
Route DDR2 signals with matched-impedance traces (50 ohm single-ended / 100 ohm differential for clocks) and length-matching within the byte lanes per the DDR2 layout guidelines. The 689-TEPBGA II ball pitch requires microvia or via-in-pad PCB technology; standard through-hole vias are not feasible at this pitch. Use ENIG or OSP surface finish for reliable BGA soldering and follow NXP's reference designators for decoupling capacitor placement around the BGA perimeter.
Power sequencing for the MPC8378EVRAJFA557 must follow NXP's recommended order — core voltage rails before I/O rails, with monotonic rise times. Use a NXP-recommended PMIC or discrete supervisor with the THERM and RESET signals correctly tied to the system controller. Decoupling: place 0.1 µF X7R capacitors on every power pin within 1-2 mm trace length, plus bulk tantalum or polymer capacitors on the core rail to handle load transients at 533 MHz operation.
Keep SERDES / SGMII traces strictly length-matched and routed over a continuous reference ground plane with no splits. PCIe and SATA traces require 85-ohm differential impedance. Avoid routing high-speed signals across plane splits or near noisy switching power supplies. The 689-ball BGA break-out region is the bottleneck — use the inner rows for high-speed signals to escape cleanly without via stubs.
Do not confuse the MPC8378E (with SEC engine) for the lower-cost MPC8377E variants. Confirm the exact order code (e.g., EVRAJFA557) matches the silicon revision and temperature grade required by your application. Always read the latest NXP errata document — known silicon anomalies affect USB, SATA, and SERDES initialization on early revisions. For long-life industrial designs, use only Rochester Electronics or NXP factory-direct stock to avoid counterfeit risk on the secondary market.
Compliance-Informationen
RoHS-compliant lead-free (Pb-free) per NXP product page. Not AEC-Q100 qualified — industrial temperature grade 0 to +105 °C only. REACH compliance status to be confirmed against latest NXP certificate of compliance.
