MPC8378EVRAJFA557 - 533MHz PowerQUICC II Pro MPU | NXP | 689-TEPBGA
부품 번호: MPC8378EVRAJFA557 ✓ 활성MPC8378EVRAJFA557 개요
An MPU (Microprocessor Unit) such as the MPC8378E combines a CPU core, integrated peripherals, and external memory/interconnect controllers on a single die. The MPC8378E sits within the PowerQUICC family of communications processors, which are descended from NXP's (formerly Freescale) Power Architecture line and remain widely deployed in long-life industrial and networking equipment.
Key features include a single-core 32-bit e300c4s processor with 32 KB L1 instruction and 32 KB L1 data caches, 533 MHz core frequency, a DDR1/DDR2 SDRAM controller with ECC, two PCI/PCIe controllers, three 10/100/1000 Ethernet MACs (one supporting Gigabit), two USB 2.0 controllers (host + device), two SATA controllers, and a security engine supporting DES, 3DES, AES, SHA, RSA, and elliptic-curve algorithms.
Typical applications include enterprise wired networking routers and switches, integrated access devices, industrial gateways, networked storage (NAS/SAN), and secure VPN/UTM appliances. The integrated SEC off-loads cryptographic workloads from the host CPU, making the part well suited to IPsec and SSL/TLS termination.
When designing with the MPC8378E, ensure the power-sequencing and thermal budgets account for the 31x31 mm TEPBGA II package. The device operates from 0 to 105 °C, suitable for industrial enclosures with controlled airflow. Use NXP's U-Boot and Linux BSP as the baseline firmware reference.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for engineers evaluating the MPC8378EVRAJFA557 versus competing PowerQUICC II Pro or PowerQUICC III options.
드롭인 대체품: MPC8378EVRAJFA557 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
MPC8377EVRAJFA
✅ 드롭인가격 문의
데이터시트 보기 →MPC8379EVRAJFA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8378EVRAHFA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8378ECRAJFA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
P1020NSE2DFB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8378EVRAJFA557 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Core Architecture | Power Architecture e300c4s |
| Core Count | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum Core Frequency | 533 MHz |
| Family | PowerQUICC II Pro (MPC83xx) |
| 패키지 | 689-TEPBGA II (31x31 mm) |
| Memory Interface | DDR1/DDR2 SDRAM with ECC |
| Ethernet | 1x Gigabit + 2x 10/100/1000 MACs |
| PCI / PCIe | PCI and PCIe controllers |
| USB | 2x USB 2.0 (Host + Device) |
| SATA | 2x SATA controllers |
| Security Engine | SEC (DES/3DES/AES/SHA/RSA/ECC) |
| 동작 온도 | 0 °C to +105 °C |
| 실장 유형 | Surface Mount (BGA) |
MPC8378EVRAJFA557 689-tepbga ii (31x31 mm) 핀 구성 가이드
MPC8378EVRAJFA557(689-tepbga ii (31x31 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8378EVRAJFA557.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8378EVRAJFA557 적합 용도: 6 애플리케이션s: Enterprise Wired Routers and Switches, Network Attached Storage (NAS) and SAN Controllers, Industrial Gateways and Protocol Converters, VPN / UTM / SSL Appliances, Integrated Access Devices and Customer Premises Equipment, Industrial Imaging and Video Surveillance Controllers.
Enterprise Wired Routers and Switches
The MPC8378EVRAJFA557's 533 MHz e300c4s core, three 10/100/1000 Ethernet MACs, and integrated SEC engine make it ideal for mid-range enterprise routers and managed switches. The DDR1/DDR2 controller with ECC handles routing tables and forwarding databases reliably, while the hardware SEC off-loads IPsec and SSL/TLS termination, freeing CPU cycles for QoS, ACL processing, and routing-protocol stacks (OSPF, BGP). The 689-TEPBGA II package supports industrial 0 to +105 °C operation, suiting 1U/2U rackmount chassis with controlled airflow. Designers benefit from NXP's mature U-Boot and Linux BSP, reducing time-to-market for Layer 3 switching platforms.
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Network Attached Storage (NAS) and SAN Controllers
The MPC8378EVRAJFA557 integrates two SATA controllers plus three Gigabit Ethernet MACs, providing a compact single-chip controller for entry-level NAS and iSCSI SAN appliances. The 533 MHz core and DDR2 controller handle file-system metadata and SMB/NFS overhead, while the SEC engine accelerates encrypted-storage workflows (AES-XTS). The 689-TEPBGA II package keeps the bill of materials small — a single BGA plus DRAM, PHYs, and SATA devices implements a full multi-drive storage controller. Industrial-grade parts support 0 to +105 °C enclosures used in small-business RAID arrays.
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Industrial Gateways and Protocol Converters
The MPC8378EVRAJFA557 is widely deployed in industrial gateways that bridge serial fieldbuses, Ethernet, and IP networks. Its PCI/PCIe interfaces support additional industrial cards, while three Ethernet MACs enable multi-segment routing for substation automation, factory networking, and SCADA systems. The 533 MHz e300c4s core runs real-time Linux or VxWorks for protocol stacks such as Modbus TCP, PROFINET, EtherNet/IP, and DNP3. The 0 to +105 °C temperature range covers industrial control cabinets, and the mature NXP BSP accelerates IEC 61850 and OPC-UA integration.
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VPN / UTM / SSL Appliances
The integrated SEC engine of the MPC8378EVRAJFA557 accelerates AES, 3DES, SHA-1/256, RSA, and ECC cryptographic operations, making the part a strong foundation for branch-office VPN and UTM security appliances. At 533 MHz, the e300c4s core can sustain hundreds of Mbps of IPsec throughput with hardware off-load, while the three Gigabit MACs handle WAN, LAN, and DMZ segments. The DDR2 controller with ECC ensures memory integrity for stateful firewall tables and cryptographic keys. The 689-TEPBGA II package enables fanless thermal designs in compact branch-office form factors.
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Integrated Access Devices and Customer Premises Equipment
Telecommunications integrated access devices (IADs) and CPE platforms use the MPC8378EVRAJFA557 to consolidate voice, data, and wireless back-haul on a single processor. Its PCI/PCIe, USB 2.0 (host + device), and SATA interfaces simplify connectivity to DSL/PON transceivers, Wi-Fi cards, and external storage. The hardware SEC block secures VoIP media (SRTP) and management interfaces (HTTPS, SSH). The 533 MHz Power Architecture core runs carrier-grade Linux for TR-069 and QoS policy enforcement. The industrial temperature grade is suitable for outdoor enclosures used in fiber-to-the-home (FTTH) CPE.
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Industrial Imaging and Video Surveillance Controllers
The MPC8378EVRAJFA557 can act as a controller for networked video surveillance recorders, leveraging its SATA interfaces for multi-drive storage and Gigabit Ethernet for IP-camera aggregation. The e300c4s core at 533 MHz handles MJPEG/H.264 stream recording, motion-detection analytics, and RAID management. The hardware SEC block encrypts recorded footage at rest (AES-XTS) and secures remote viewing streams. The 689-TEPBGA II package and 0 to +105 °C temperature range suit industrial NVR enclosures deployed in factories, transit hubs, and city surveillance networks.
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추천 제품 요약
엔지니어링 참조 데이터: MPC8378EVRAJFA557 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8377EVRAJFA | MPC8379EVRAJFA | MPC8378EVRAHFA | MPC8378ECRAJFA |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Core Architecture | Power Architecture e300c4s | Power Architecture e300c4s | Power Architecture e300c4s | Power Architecture e300c4s | Power Architecture e300c4s |
| Maximum Core Frequency | 533 MHz | 533 MHz | 667 MHz (typical) | 533 MHz | 533 MHz |
| Memory Interface | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC | DDR1/DDR2 with ECC |
| Security Engine (SEC) | Yes (DES/3DES/AES/SHA/RSA/ECC) | Limited / disabled on cost-reduced SKUs | Yes | Yes | Yes |
| Gigabit Ethernet MACs | 1x GbE + 2x 10/100/1000 | Reduced MAC count | 1x GbE + 2x 10/100/1000 | 1x GbE + 2x 10/100/1000 | 1x GbE + 2x 10/100/1000 |
| SATA Controllers | 2x SATA | Reduced / fewer SATA | 2x SATA | 2x SATA | 2x SATA |
| Operating Temperature | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | Extended temperature grade | 0 °C to +105 °C |
주요 차별점
- Hardware Security Engine (SEC) on-chip (vs MPC8377EVRAJFA)
- Pin-compatible upgrade to higher-frequency sibling (vs MPC8379EVRAJFA)
- Industrial-grade 0 to +105 °C operation (vs MPC8378EVRAHFA (extended temp))
- Mature Linux and U-Boot BSP (vs Freescale legacy MPC8360E)
설계 노트
The 689-TEPBGA II (31x31 mm) package requires careful PCB thermal design because the large body concentrates heat at the die. Estimated: at 533 MHz full load the part dissipates roughly 5-8 W typical. Place thermal vias in a 4x4 array under the exposed die region and use a minimum 6-layer stack-up with continuous inner ground/power planes. A 200-300 LFM airflow is recommended for sealed industrial enclosures. Junction-to-ambient thermal resistance values must be derived from NXP's thermal models for the specific PCB layout.
Route DDR2 signals with matched-impedance traces (50 ohm single-ended / 100 ohm differential for clocks) and length-matching within the byte lanes per the DDR2 layout guidelines. The 689-TEPBGA II ball pitch requires microvia or via-in-pad PCB technology; standard through-hole vias are not feasible at this pitch. Use ENIG or OSP surface finish for reliable BGA soldering and follow NXP's reference designators for decoupling capacitor placement around the BGA perimeter.
Power sequencing for the MPC8378EVRAJFA557 must follow NXP's recommended order — core voltage rails before I/O rails, with monotonic rise times. Use a NXP-recommended PMIC or discrete supervisor with the THERM and RESET signals correctly tied to the system controller. Decoupling: place 0.1 µF X7R capacitors on every power pin within 1-2 mm trace length, plus bulk tantalum or polymer capacitors on the core rail to handle load transients at 533 MHz operation.
Keep SERDES / SGMII traces strictly length-matched and routed over a continuous reference ground plane with no splits. PCIe and SATA traces require 85-ohm differential impedance. Avoid routing high-speed signals across plane splits or near noisy switching power supplies. The 689-ball BGA break-out region is the bottleneck — use the inner rows for high-speed signals to escape cleanly without via stubs.
Do not confuse the MPC8378E (with SEC engine) for the lower-cost MPC8377E variants. Confirm the exact order code (e.g., EVRAJFA557) matches the silicon revision and temperature grade required by your application. Always read the latest NXP errata document — known silicon anomalies affect USB, SATA, and SERDES initialization on early revisions. For long-life industrial designs, use only Rochester Electronics or NXP factory-direct stock to avoid counterfeit risk on the secondary market.
규정 준수 정보
RoHS-compliant lead-free (Pb-free) per NXP product page. Not AEC-Q100 qualified — industrial temperature grade 0 to +105 °C only. REACH compliance status to be confirmed against latest NXP certificate of compliance.
