MPC852TVR100A - 100MHz PowerQUICC I MPU, 32-Bit, BGA-256 | NXP
Teilenummer: MPC852TVR100A ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2.890,00 |
| 500 | $24.5 | $12.250,00 |
| 1.000 | $21.1 | $21.100,00 |
MPC852TVR100A Übersicht
What is a PowerQUICC processor? PowerQUICC (pronounced "power-quick") is NXP/Freescale's family of integrated communications processors that combine a PowerPC processor core with a dedicated Communications Processor Module (CPM). The CPM offloads communications-intensive tasks such as HDLC framing, Ethernet MAC, and serial channel management from the main CPU, enabling deterministic real-time performance for routers, switches, and telecom equipment. PowerQUICC I (MPC8xx) is the original family; PowerQUICC II (MPC82xx) and PowerQUICC III followed with higher integration.
Key features include the MPC8xx core at 100MHz, dual 10/100 Ethernet support, dual serial communications controllers (SCC2/SCC3), one serial management controller (SMC1), 5V-tolerant I/O, and a 66MHz external bus. The integrated CPM handles protocol processing independently of the CPU, freeing the PowerPC core for application-layer tasks. Memory controller supports SDRAM, SRAM, and Flash with dedicated transaction queues.
Typical applications include Ethernet-to-Ethernet line cards, ISDN router interfaces, T1/E1 channel banks, xDSL modem control, set-top box control, industrial control hubs, and serial-bridge gateways. The 256-ball PBGA provides robust thermal and electrical performance for sustained 1.5W typical power dissipation.
Design consideration: PCB layout for the 256-ball PBGA requires microvia or via-in-pad technology for reliable assembly. Decoupling requires 100nF capacitors at every VDDQ/VDD pair and a 10uF bulk capacitor near the core supply pins. Maintain solid ground pours under the package to dissipate heat and reduce EMI on the 66MHz external bus.
Drop-in-Alternativen für MPC852TVR100A – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC852TVR100A (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Core Frequency, Core Architecture, Series.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC852TVR100B
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC852TCVR66A
✅ Drop-In✓ Auf Lager
$22.1 / Stück
Datenblatt ansehen →MPC852TCVR50A
✅ Drop-In✓ Auf Lager
$22.1 / Stück
Datenblatt ansehen →MPC859DSLZP66A
✅ Drop-In✓ Auf Lager
$125.4 / Stück
Datenblatt ansehen →MPC852TVR100A Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC I (MPC8xx) |
| Core Architecture | PowerPC MPC8xx, 32-Bit RISC |
| Core Frequency | 100 MHz |
| External Bus Frequency | 66 MHz |
| Process Technology | 0.18 micron CMOS |
| On-Chip Cache | 8 KB |
| Core Voltage (VDD) | 1.8 V (1.7 V to 1.9 V) |
| I/O Voltage (VDDH) | 3.3 V with 5 V TTL tolerance |
| Gehäuse | 256-PBGA (23 x 23 mm) |
| Betriebstemperatur | 0C to +95C |
| Communications Module | CPM with 2 SCC + 1 SMC |
| Ethernet | 10/100 Mbps MAC integrated |
| Montageart | Surface Mount (PBGA) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
| MSL-Level | 3 |
MPC852TVR100A 256-pbga (23 x 23 mm) Pinbelegungsleitfaden
Pinbelegung für MPC852TVR100A (256-pbga (23 x 23 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC852TVR100A.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC852TVR100A ist geeignet für 7 Anwendungs: Ethernet-to-Ethernet Line Card, ISDN Router and Remote-Access Concentrator, T1/E1 Channel Bank and Multiplexer, xDSL Modem Control Processor, Industrial Serial-Bridge Gateway, Set-Top Box Control and Media Bridge, Legacy Telecom Equipment Sustainment.
Ethernet-to-Ethernet Line Card
The MPC852TVR100A is purpose-built for Ethernet-to-Ethernet line-card applications. Its dual 10/100 Ethernet MAC, integrated CPM with two SCCs, and 100MHz PowerPC core enable wire-speed packet processing without external switching silicon. The CPM offloads HDLC framing, VLAN tagging, and statistics gathering from the core, freeing the PowerPC for routing-table lookups and management-plane tasks. The 1.8V core plus 3.3V I/O with 5V TTL tolerance allows direct connection to legacy backplane transceivers in central-office equipment. Per NXP product documentation, the device's deterministic interrupt latency and DMA-driven CPM are why this part dominated DSLAM line cards and IP-access switches in its era.
Empfohlen
ISDN Router and Remote-Access Concentrator
The MPC852TVR100A's dual SCC channels and SMC make it well-suited for ISDN router designs where multiple serial WAN links must terminate alongside Ethernet LAN. Each SCC can independently run HDLC, UART, or transparent protocols, while the SMC handles low-speed management links. The 100MHz PowerPC core processes routing-table updates and PPP state machines in real time. Operating temperature of 0C to +95C covers indoor central-office and customer-premises environments. The 256-PBGA package allows compact router designs with all serial, Ethernet, and memory interfaces routed to inner board layers on a 4- or 6-layer PCB.
Empfohlen
T1/E1 Channel Bank and Multiplexer
Telecom channel banks that aggregate T1/E1 circuits onto Ethernet backhaul benefit from the MPC852TVR100A's combination of serial channels and Ethernet MAC. The CPM's SCCs handle per-channel HDLC framing for up to two T1/E1 links at 1.544/2.048 Mbps, while the integrated 10/100 Ethernet MAC uplinks aggregated traffic to a router or switch. The 100MHz core sustains channel-bank management overhead including SNMP, RADIUS, and signaling. The part's 5V TTL tolerance on the I/O ring simplifies interface to legacy T1/E1 framer ICs operating at 5V rails.
Empfohlen
xDSL Modem Control Processor
The MPC852TVR100A was a preferred host processor for xDSL CPE modems (ADSL, VDSL, and early G.fast designs). The CPM's DMA-driven channel controllers manage ATM or PTM packet flows between the DSL PHY and the network stack without CPU intervention. The 100MHz PowerPC handles PPPoE, IP routing, NAT, and web management. Combined 8KB on-chip cache and external SDRAM interface support high-throughput packet pipelines. The 256-PBGA package allows single-board modem designs with all interfaces including Ethernet, USB (via companion chip), and DSL PHY routed to inner layers.
Empfohlen
Industrial Serial-Bridge Gateway
The MPC852TVR100A enables serial-to-Ethernet bridge gateways used in industrial automation, building management, and SCADA systems. The SCCs accept RS-232/422/485 streams via external transceivers; the integrated Ethernet MAC publishes the serial data as TCP/UDP sockets or Modbus TCP. The 100MHz core runs gateway protocol stacks with deterministic latency. The commercial 0C to +95C temperature range covers indoor cabinets and control rooms. For outdoor or factory-floor deployments, environmental qualification of the final assembly is required since the part itself is commercial-grade.
Empfohlen
Set-Top Box Control and Media Bridge
The MPC852TVR100A served as a control processor in set-top boxes and residential media bridges during the PowerQUICC I era. The PowerPC core runs the real-time control plane; the CPM manages conditional-access and out-of-band signaling channels; the Ethernet MAC interfaces to home-network backhaul. The 256-PBGA package is well-suited to compact consumer-electronics enclosures with thermal management via chassis heat-spreading. The 1.8V core voltage minimizes power dissipation in always-on consumer devices.
Empfohlen
Legacy Telecom Equipment Sustainment
For operators maintaining deployed base stations, central-office switches, or industrial controllers that shipped with the MPC852TVR100A, the part is essential for field-replacement and depot-repair programs. Authorized-channel inventory from Rochester Electronics LLC and remaining franchised distributor stock support multi-year sustainment windows. The drop-in silicon revision B variant (MPC852TVR100B) provides functionally identical replacements when original parts deplete. Functional equivalence to MPC852TCVR66A and MPC852TCVR50A allows lower-throughput variants to bridge emergency shortages.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC852TVR100A – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC852TVR100B | MPC852TCVR66A | MPC852TCVR50A | MPC859DSLZP66A |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA (23x23) | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA (23x23) - same | 256-PBGA - same family |
| Core Frequency | 100 MHz | 100 MHz | 66 MHz | 50 MHz | 66 MHz |
| External Bus Frequency | 66 MHz | 66 MHz | 66 MHz | 50 MHz | 66 MHz |
| Core Architecture | PowerPC MPC8xx 32-Bit | PowerPC MPC8xx 32-Bit | PowerPC MPC8xx 32-Bit | PowerPC MPC8xx 32-Bit | PowerPC MPC8xx 32-Bit |
| On-Chip Cache | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| CPM (SCC + SMC) | 2 SCC + 1 SMC | 2 SCC + 1 SMC | 2 SCC + 1 SMC | 2 SCC + 1 SMC | 4 SCC + 2 SMC (extended) |
| Ethernet MAC | 10/100 Mbps (x1 port) | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| Operating Temperature | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C |
Wichtigste Unterscheidungsmerkmale
- True 100MHz core at 1.8V in compact 256-PBGA (vs. MPC852TCVR66A)
- Drop-in silicon revision B preserves firmware investment (vs. MPC852TVR100B)
- PowerQUICC I heritage with extensive third-party ecosystem (vs. MPC859DSLZP66A)
Designhinweise
The 256-PBGA (23x23 mm) package has a 1.27mm ball pitch. Use microvia or via-in-pad PCB technology with 0.4mm laser-drilled vias for reliable assembly. Place 100nF decoupling capacitors within 2mm of every VDD/VDDH ball pair and at least one 10uF bulk capacitor near the core supply balls. Maintain continuous ground and power planes under the BGA to minimize inductance; route all high-speed signals on inner layers with controlled impedance of 50 ohms single-ended.
Estimated: at full 100MHz core utilization with 1.8V core and 3.3V I/O rails, typical power dissipation is approximately 1.5W. With a PBGA theta_JA in the 25-30 C/W range (4-layer PCB, no airflow), junction temperature rises 38-45C above ambient. For sealed enclosures without airflow, provide thermal vias to inner copper planes or attach a small stamped heatsink. Monitor junction temperature via the on-chip thermal sensor registers during qualification.
The 66MHz external bus is the most demanding signal-integrity interface. Use 50-ohm controlled-impedance traces with length matching of +/- 250 ps within each byte lane and +/- 50 ps within a source-synchronous clock group. Keep bus traces short and reference them to a continuous ground plane. Series-damping 22-ohm resistors may be required on heavily loaded address and control lines. Refer to the Freescale AN2132 application note for bus-topology recommendations.
Do not confuse the MPC852T (PowerQUICC I, 0.18um, 1.8V core) with the earlier MPC860 (PowerQUICC, 0.5um, 2.5V core) - they share package but require different core voltage regulators. Verify the silicon revision mask set before generating firmware; errata differ between revisions. Ensure PORESET (Power-On Reset) holds for the minimum 256 bus-clock periods per datasheet, otherwise the CPM may enter undefined state.
Keep analog PLL supply (VDDA_PLL) filtered with a ferrite bead and 10uF + 100nF capacitor network. Route the system clock input with a short, guarded trace and provide a series 33-ohm damping resistor at the driver. Place all configuration pull-up and pull-down resistors (e.g., on MODCK[0:2] and RSTCONF) within 1 inch of their respective balls to avoid floating configuration at reset.
Compliance-Informationen
RoHS compliant per NXP product page. Halogen-free status not specified in available web data; flagged unknown. AEC-Q100 not applicable - this is a commercial-grade MPU for telecom/industrial equipment, not automotive. Last-time-buy status per NXP EOL notification.