MPC875CVR133 - 133MHz PowerQUICC MPU | NXP | Communications
Teilenummer: MPC875CVR133 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $68.5 | $68,50 |
| 10 | $62.4 | $624,00 |
| 100 | $55.8 | $5.580,00 |
| 500 | $49.2 | $24.600,00 |
| 1.000 | $43.75 | $43.750,00 |
MPC875CVR133 Übersicht
A PowerQUICC microprocessor is a highly integrated System-on-Chip for embedded networking, combining a general-purpose RISC core (the Power Architecture embedded core, evolved from the PowerPC MPC8xx lineage) with peripheral and communications engine blocks built around an on-chip system bus. Architecturally the part sits in the hierarchy: PowerQUICC -> MPC8xx microprocessor -> Power Architecture embedded CPU -> 32-bit embedded processor -> microprocessor IC. The CPM co-processor supports multiple serial controllers (FCCs, SCCs, SMC, USB), Ethernet (Fast Ethernet MAC), ATM, HDLC/SDLC, UART, and transparent operation, reducing host CPU load for protocol-heavy tasks.
Key specifications: 133 MHz core frequency at 1.8 V core / 3.3 V I/O supply, 32-bit Power Architecture core, 4-channel DMA, two Fast Ethernet controllers (FEC), ATM support, USB interface, 7.5 KB I-cache / 8 KB D-cache, on-chip SDRAM controller, and a -40C to +100C industrial operating temperature range suited to outdoor networking gear.
Typical applications include DSLAM line cards, T1/E1 routers, Ethernet-to-Ethernet protocol bridges, low-end industrial routers, VoIP gateways, and protocol-conversion line-card applications where the CPM off-loads communications-intensive processing from the host CPU.
A common design pitfall is underestimating core-supply decoupling: the MPC875CVR133 requires a low-noise 1.8 V regulator with bulk decoupling on the core pins, and the CPM-driven peripherals demand careful clock-routing and impedance-matched PCB traces to stay within AC timing margins.
This page synthesizes distributor pricing, package-specific drop-in alternatives within the MPC8xx family, and practical design notes targeting communications/line-card engineers using legacy PowerQUICC silicon today.
Drop-in-Alternativen für MPC875CVR133 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC875CVR133 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Manufacturer, Core Architecture, Series.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC875VR133
✅ Drop-In✓ Auf Lager
$27.9 / Stück
Datenblatt ansehen →MPC870ZT133
✅ Drop-In✓ Auf Lager
$28.75 / Stück
Datenblatt ansehen →MPC875CZT133
✅ Drop-In✓ Auf Lager
$54.8 / Stück
Datenblatt ansehen →MPC852TVR100A
✅ Drop-In✓ Auf Lager
$21.1 / Stück
Datenblatt ansehen →MPC852TCVR50A
✅ Drop-In✓ Auf Lager
$22.1 / Stück
Datenblatt ansehen →MPC875CVR133 Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Product Category | Microprocessors (MPU) |
| Processor Series | MPC8xx / PowerQUICC |
| Core | MPC8xx (Power Architecture Technology) |
| Datenbusbreite | 32-bit |
| Maximale Taktfrequenz | 133 MHz |
| Performance | 176 MIPS |
| Number of Cores | 1 |
| Core Supply Voltage | 1.8 V |
| I/O Supply Voltage | 3.3 V |
| Betriebstemperatur | -40C to +100C |
| Gehäuse | 256-PBGA (23 mm x 23 mm, 1.27 mm pitch) |
| Montageart | Surface Mount |
| On-chip Communication Processor Module (CPM) | Yes (FCC/SCC/SMC/USB/FEC/ATM) |
MPC875CVR133 256-pbga (23 mm x 23 mm, 1.27 mm pitch) Pinbelegungsleitfaden
Pinbelegung für MPC875CVR133 (256-pbga (23 mm x 23 mm, 1.27 mm pitch)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC875CVR133.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC875CVR133 ist geeignet für 7 Anwendungs: T1/E1 Router Line Card, DSLAM / ADSL Line Card, Industrial Ethernet-to-Ethernet Bridge, VoIP Gateway / Media Gateway Controller, Wireless Base Station Controller (BTS Edge), Protocol-Conversion Line Card, Legacy Industrial Router / SCADA Gateway.
T1/E1 Router Line Card
The MPC875CVR133's PowerQUICC CPM off-loads HDLC framing, T1/E1 channelization, and HDLC/bit-transparent protocol processing from the host CPU, freeing the 133 MHz Power Architecture core for routing-table lookup and QoS policy enforcement. The two integrated Fast Ethernet Controllers (FEC) provide dual MII/RMII PHY interfaces for upstream and downstream Ethernet links, while SCC channels carry framed T1/E1 traffic to framer/transceiver ICs. Placed on a line card with local SDRAM and a serial-booted firmware image, the part handles per-channel protocol termination without external co-processors - a benefit its less-integrated MPC870 sibling cannot match.
Empfohlen
DSLAM / ADSL Line Card
DSLAM access multiplexer line cards pair the MPC875CVR133's ATM-capable CPM with DSL PHY front ends to terminate multiple subscriber lines per slot. The CPM's ATM AAL2/AAL5 segmentation-and-reassembly support eliminates the need for an external ATM controller, while the 176 MIPS core handles PPPoA/PPPoE termination and IGMP snooping. With 1.8V core / 3.3V I/O the part integrates cleanly with 3.3V DSL PHY ICs and standard SDRAM, and the industrial -40C to +100C temperature range covers outside-plant enclosures.
Empfohlen
Industrial Ethernet-to-Ethernet Bridge
For protocol-bridging applications the MPC875CVR133's dual FECs allow direct Ethernet-to-Ethernet transparent bridging, while remaining SCC channels can carry serial industrial protocols (Modbus, Profibus) for legacy PLC integration. The Power Architecture core runs the bridging firmware with deterministic latency thanks to the CPM's DMA-driven packet handling, off-loading the main CPU. Designers typically pair the part with 64-128 MB SDRAM and a small NOR boot flash, using one FEC for the upstream managed switch port and the other for the field-site daisy-chain port.
Empfohlen
VoIP Gateway / Media Gateway Controller
VoIP gateways leverage the MPC875CVR133's CPM for RTP packetization, HDLC framing on T1/E1 spans, and TDM bus (timeslot-mapped) switching between PSTN interfaces and the Ethernet side. The 133 MHz core runs the signalling stack (H.248/MGCP/SIP) and DSP-resource arbitration, while FECs handle the IP-side packets. The hardware-specification document confirms TDM support and time-slot assignment registers needed for T1/E1-to-IP media gateway designs.
Empfohlen
Wireless Base Station Controller (BTS Edge)
Base-station edge controllers use the MPC875CVR133's multiple serial controllers (FCC/SCC/SMC) to backhaul E1/T1 traffic from remote radio heads over Abis/Abis-TCP links. The CPM's HDLC controllers handle the LAPD framing needed in 2G/3G RAN architectures, while the two FECs connect to the IP-based transport. Operating from -40C to +100C the part fits outdoor cabinet environments and remote-site deployments where temperature swings are severe.
Empfohlen
Protocol-Conversion Line Card
Protocol-conversion line cards (e.g., HDLC-to-Ethernet, X.25-to-IP, frame-relay-to-MPLS) benefit from the MPC875CVR133's parallel serial controllers and dual FECs running concurrently, allowing simultaneous termination of legacy serial links and IP forwarding. The CPM's RISC microcoded engine handles per-channel protocol state machines without CPU intervention, while the main Power Architecture core executes the protocol-conversion application logic and management plane. This is the canonical use case called out in the Freescale MPC875/MPC870 hardware-specification document.
Empfohlen
Legacy Industrial Router / SCADA Gateway
SCADA gateways in industrial automation pair the MPC875CVR133's serial controllers (RS-232/485 via external transceivers on SCC pins) with Ethernet FECs to bridge field-bus devices to plant IP networks. The -40C to +100C operating range and rugged PBGA package suit factory-floor enclosures, while the deterministic CPM-driven DMA handles time-critical polling of RTUs/PLCs without loading the main CPU. Designers should note that newer IOT gateways typically migrate to QorIQ Layerscape - the MPC8xx remains relevant only for legacy install-base retrofits.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC875CVR133 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC875VR133 | MPC870ZT133 | MPC875CZT133 | MPC852TVR100A | MPC852TCVR50A |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-PBGA (23x23, 1.27mm pitch) | 256-PBGA (23x23, 1.27mm pitch) - same | 256-PBGA (23x23, 1.27mm pitch) - same | 256-PBGA (23x23, 1.27mm pitch) - same | 256-PBGA (23x23, 1.27mm pitch) - same | 256-PBGA (23x23, 1.27mm pitch) - same |
| Core Frequency | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 100 MHz | 50 MHz |
| Core Voltage | 1.8 V (CVR variant) | 1.8 V (VR variant) | 3.3 V (ZT variant) | 1.8 V (CZ variant) | 1.8 V (VR variant) | 1.8 V (CVR variant) |
| CPM Channels (FCC/SCC/SMC) | Full set (MPC875 grade) | Full set | Reduced (MPC870 grade) | Full set | Reduced (MPC852 grade) | Reduced (MPC852 grade) |
| Operating Temperature | -40C to +100C | -40C to +100C (same family) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
| Lifecycle Status | NRND / NCNR | NRND | NRND | NRND | Obsolete (EOL) | Obsolete (EOL) |
Wichtigste Unterscheidungsmerkmale
- Full MPC875 CPM channel count vs MPC870/MPC852 siblings (vs. MPC870ZT133)
- Higher 133 MHz clock vs 100 MHz and 50 MHz variants (vs. MPC852TVR100A / MPC852TCVR50A)
- 1.8V core supply (CVR variant) for power efficiency (vs. MPC870ZT133 (3.3V unified core/IO))
- NRND alternative MP875VR133 offers drop-in same-die alternate (vs. MPC875VR133)
Designhinweise
The MPC875CVR133 requires a low-noise 1.8V core regulator with peak transient capability of at least 1.5 A. Use a buck regulator with ceramic output capacitors and place the regulator within 25 mm of the BGA core-supply balls. Bulk-decouple each VDD pin pair with 100 nF X7R ceramic plus a 10 uF tantalum or polymer bulk capacitor to handle CPM peak transients during DMA bursts. The 3.3 V I/O supply can be sourced from the same 3.3 V rail that powers SDRAM and the PHY, but must be sequenced AFTER the 1.8 V core rail to prevent I/O driving into unpowered core logic.
The 256-PBGA at 1.27 mm pitch requires 4-6 layer stack-up with continuous ground planes under the BGA and dedicated power planes for the 1.8V and 3.3V rails. Escape routing on the top layer must use via-in-pad or microvia technology for clean signal egress; JEDEC MSL3 or better handling is required to prevent moisture-induced BGA ball cracking during reflow. High-speed FEC MII traces must be length-matched within 50 mil tolerance and series-terminated if length exceeds 50 mm.
At full 133 MHz operation with active CPM and dual FEC, junction-to-ambient thermal resistance (theta_JA) on a 256-PBGA with minimal copper is roughly 20-25 C/W. In a sealed outdoor enclosure at 70C ambient, designers should derate by at least 15C and may need thermal vias under the BGA thermal pad to spread heat to inner ground planes. Forced-air cooling is recommended for line cards with multiple MPC875 devices per blade.
Common pitfalls include (1) confusing 'CVR' (1.8V core / 3.3V I/O) with 'ZT' (unified 3.3V) variants when second-sourcing, which can permanently damage the core; (2) omitting the 32.768 kHz reference oscillator for the CPM real-time clock, causing periodic timer faults; (3) failure to configure BDIP bit in the reset configuration word for proper bus-width detection; (4) DMA buffer misalignment causing CPM descriptor errors - buffers must be 32-bit aligned.
SDRAM clock and DQS lines to the MPC875's memory controller must be length-matched with skew under 50 ps; series-termination resistors (22-33 ohm) on clock outputs may be needed for two-DIMM configurations. FEC MII transmit clock and data must be source-synchronous matched; RMII reduces pin count but requires 50 MHz reference clock generation. Keep CPM-driven serial channels away from the SDRAM clock region to avoid coupling into ADC sample timing on attached PHYs.
Compliance-Informationen
RoHS/REACH and lead-free status not explicitly listed in verified distributor data; conflict-minerals compliant per NXP corporate policy. AEC-Q100 not applicable - this is an industrial communications MPU, not an automotive-grade part.
